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Wafer Grinding Jobs (NOW HIRING)

GPD Optoelectronics

Senior Wafer Fab Engineer

Salem, NH

$55.25 - $71.25/hr

The Senior Fabrication Engineer will manage the wafer processing operation in a semi-automated ... Grinding, Lapping, Polishing, Saw, Scribe * Data-centric approach for design, process control, and ...

GPD Optoelectronics

Senior Wafer Fab Engineer

Salem, NH · On-site

$55.25 - $71.25/hr

The Senior Fabrication Engineer will manage the wafer processing operation in a semi-automated ... Grinding, Lapping, Polishing, Saw, Scribe * Datacentric approach for design, process control, and ...

GPD Optoelectronics

Senior Wafer Fab Engineer

Salem, NH · On-site

$103K - $134K/yr

The Senior Fabrication Engineer will manage the wafer processing operation in a semi-automated ... Grinding, Lapping, Polishing, Saw, Scribe • Data-centric approach for design, process control ...

Translarity

Be Seen First

CNC Machinist/Programmer (3-Axis Mill & Surface Grinder)

Hutto, TX · On-site

$20 - $40/hr

We hold 100+ patents and our full-wafer MEMS probe technology delivers low cost, high performance ... Set up and run the surface grinder to achieve precise finishes on finished parts * Interpret ...

Apple

Package Integration Engineer

San Francisco, CA · On-site

$122K - $164K/yr

Some hands-on knowledge in Wafer Bumping, Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach (including multilayer thin die stacking), encapsulation ...

SpaceX

Materials R&D Technician - Level 4/5

Bastrop, TX

$19.50 - $26/hr

Partner with engineering to rapidly bring online state-of-the art silicon wafer fab development lines that include wafer slicing, grinding, cleaning, degumming, and inspection stations. * Drive ...

Socket.dev

Packaging Engineer

California, MO · On-site

$150 - $230/hr

Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape ...

Apple

Packaging Engineer

San Francisco, CA · On-site

Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing, Flip Chip die attach, encapsulation/molding, under-fill, ball attach, package singulation and Tape ...

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Wafer Grinding information

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$19

$26

How much do wafer grinding jobs pay per hour?

As of Sep 3, 2026, the average hourly pay for wafer grinding in the United States is $19.16, according to ZipRecruiter salary data. Most workers in this role earn between $17.07 and $20.67 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a wafer grinding technician?

To excel as a Wafer Grinding Technician, you need a solid understanding of semiconductor manufacturing processes, precision measurement, and a high school diploma or technical certification. Familiarity with grinding machines, cleanroom protocols, and inspection tools like micrometers and profilometers is typically required. Attention to detail, problem-solving abilities, and effective communication are crucial soft skills in this role. These competencies ensure the production of high-quality wafers, minimize defects, and maintain efficiency in semiconductor fabrication.

What are some common challenges faced in wafer grinding roles, and how can they be addressed?

One common challenge in wafer grinding is maintaining tight tolerances and preventing wafer breakage, as the process requires extreme precision and careful handling. Operators must remain vigilant about equipment calibration, cleanliness, and monitoring for any signs of tool wear or contamination. Effective communication with quality assurance and maintenance teams is essential to quickly address issues and minimize downtime. Continuous on-the-job training and following strict safety protocols also help ensure high-quality output and a safe work environment.

What is the difference between Wafer Grinding vs Wafer Polishing?

AspectWafer GrindingWafer Polishing
Primary PurposeMaterial removal to achieve desired thickness and flatnessSurface finishing to improve smoothness and reflectivity
ProcessMechanical grinding using abrasive wheels or beltsChemical-mechanical polishing for fine surface finish
EquipmentGrinding machines, abrasive toolsPolishing pads, chemical slurry
Work EnvironmentCleanroom, precision manufacturingCleanroom, surface finishing labs

Wafer Grinding and Wafer Polishing are both essential in semiconductor manufacturing. Grinding primarily reduces wafer thickness and prepares the surface, while polishing enhances surface smoothness and quality. Both roles require precision, cleanroom environments, and similar technical skills, but focus on different stages of wafer preparation.

What is wafer grinding?

Wafer grinding is a process used in semiconductor manufacturing to thin silicon wafers by removing material with precision grinding equipment. It is typically performed before dicing and packaging, requiring knowledge of equipment operation and safety protocols. The job often involves working in cleanroom environments and may require certifications in equipment handling.
Infographic showing various Wafer Grinding job openings in the United States as of August 2026, with employment types broken down into 89% Full Time, 4% Part Time, 2% Contract, and 5% Nights. Highlights an 99% Physical, and 1% Remote job distribution, with an average salary of $39,852 per year, or $19.2 per hour.

Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)

SpaceX

Bastrop, TX • On-site

$103K - $133K/yr

Full-time

Re-posted 14 days ago

SpaceX rating

8.7

Company rating: 8.7 out of 10

Based on 150 frontline employees who took The Breakroom Quiz

16th of 72 rated aerospace companies

Job description

SpaceX was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today SpaceX is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.
SR. SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK)
SpaceX is leveraging its experience in building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's largest satellite constellation and is providing fast, reliable internet to 4M+ users worldwide. We design, build, test, and operate all parts of the system - thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We've only begun to scratch the surface of Starlink's potential global impact. As we continue to upgrade and expand the constellation, we're looking for best-in-class engineers to join the team.
In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing integrated circuit packaging and assembly in-house for development and manufacturing. We are looking for hands-on and dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and test. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable to those who need it most.
RESPONSIBILITIES:
  • Own packaging assembly processes from concept to mass production including equipment and material selection for wafer-level and chip-level systems
  • Develop new technologies and establish baselines for assembly and packaging including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach
  • Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
  • Own packaging prototypes, product development and release to production
  • Select equipment and material to meet quality, reliability, cost, yield, and production targets
  • Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
  • Cross-functional interface with IC design, materials, thermal, systems, and production teams
  • Implement advanced packaging solutions into SpaceX next generation products

BASIC QUALIFICATIONS:
  • Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other applied engineering discipline
  • 5+ years of professional experience in semiconductor assembly and packaging

PREFERRED SKILLS AND EXPERIENCE:
  • Advanced technical degree
  • 7+ years industry experience with microelectronics packaging development
  • Packaging familiarity with flip-chip, BGA, fcCSP, WLCSP, fan out FO processes, system-in-package SiP, multi-chip modules MCM, panel level packaging, heterogenous and chiplet integration
  • Hands-on packaging, PCB, PCBA, or SMT assembly experience
  • OSAT (outsource semiconductor assembly and test) experience a plus

ITAR REQUIREMENTS:
  • To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.

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About SpaceX

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Industry

Aerospace product and parts manufacturing, data services, guided missile and space vehicle manufacturing and satellite telecommunications

Company size

1,001 - 5,000 Employees

Headquarters location

Hawthorne, CA, US

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