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Wafer Grinding Jobs (NOW HIRING)

Process Engineer, Principal

Lowell, MA ยท On-site

$117 - $171/hr

Process Engineer In this critical role, you will be responsible for supporting backend wafer fabrication processes, including grinding, polishing, glassing, wafer bonding, mounting/dismounting, and ...

... Grinding, Wafer probe, Pick-and-Place, and Wafer/Device Testing. ยท Front End Process: Photolithography, optical coatings, wet chemical processing, metallization, RIE & PECVD thin film deposition ยท ...

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... Grinding, Wafer probe, Pick-and-Place, and Wafer/Device Testing. ยท Front End Process: Photolithography, optical coatings, wet chemical processing, metallization, RIE & PECVD thin film deposition ยท ...

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Wafer Grinding information

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How much do wafer grinding jobs pay per hour?

As of Sep 3, 2026, the average hourly pay for wafer grinding in the United States is $19.16, according to ZipRecruiter salary data. Most workers in this role earn between $17.07 and $20.67 per hour, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a wafer grinding technician?

To excel as a Wafer Grinding Technician, you need a solid understanding of semiconductor manufacturing processes, precision measurement, and a high school diploma or technical certification. Familiarity with grinding machines, cleanroom protocols, and inspection tools like micrometers and profilometers is typically required. Attention to detail, problem-solving abilities, and effective communication are crucial soft skills in this role. These competencies ensure the production of high-quality wafers, minimize defects, and maintain efficiency in semiconductor fabrication.

What are some common challenges faced in wafer grinding roles, and how can they be addressed?

One common challenge in wafer grinding is maintaining tight tolerances and preventing wafer breakage, as the process requires extreme precision and careful handling. Operators must remain vigilant about equipment calibration, cleanliness, and monitoring for any signs of tool wear or contamination. Effective communication with quality assurance and maintenance teams is essential to quickly address issues and minimize downtime. Continuous on-the-job training and following strict safety protocols also help ensure high-quality output and a safe work environment.

What is the difference between Wafer Grinding vs Wafer Polishing?

AspectWafer GrindingWafer Polishing
Primary PurposeMaterial removal to achieve desired thickness and flatnessSurface finishing to improve smoothness and reflectivity
ProcessMechanical grinding using abrasive wheels or beltsChemical-mechanical polishing for fine surface finish
EquipmentGrinding machines, abrasive toolsPolishing pads, chemical slurry
Work EnvironmentCleanroom, precision manufacturingCleanroom, surface finishing labs

Wafer Grinding and Wafer Polishing are both essential in semiconductor manufacturing. Grinding primarily reduces wafer thickness and prepares the surface, while polishing enhances surface smoothness and quality. Both roles require precision, cleanroom environments, and similar technical skills, but focus on different stages of wafer preparation.

What is wafer grinding?

Wafer grinding is a process used in semiconductor manufacturing to thin silicon wafers by removing material with precision grinding equipment. It is typically performed before dicing and packaging, requiring knowledge of equipment operation and safety protocols. The job often involves working in cleanroom environments and may require certifications in equipment handling.
Infographic showing various Wafer Grinding job openings in the United States as of August 2026, with employment types broken down into 89% Full Time, 4% Part Time, 2% Contract, and 5% Nights. Highlights an 99% Physical, and 1% Remote job distribution, with an average salary of $39,852 per year, or $19.2 per hour.

Process Engineer, Principal

MACOM

Lowell, MA โ€ข On-site

$117 - $171/hr

Other

Medical, Dental, Vision, Retirement, PTO

Posted 6 days ago


Job description

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cuttingโ€‘edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and highโ€‘speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customersโ€™ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Process Engineer

In this critical role, you will be responsible for supporting backend wafer fabrication processes, including grinding, polishing, glassing, wafer bonding, mounting/dismounting, and other operations within MACOM's internal wafer fabrication facility. You will also provide support across additional manufacturing areas as needed and serve as backup coverage for other operations within the upstairs fab. This position encompasses both the development of new manufacturing processes and the sustainment and continuous improvement of existing processes. The product portfolio supported by this role includes technologies based on GaN, GaAs, Si, and InP materials.

Main Duties and Responsibilities
  • Develop, continuously improve, and sustain processes in close partnership with Device and Integration Engineering and Business Unit design teams.
  • Serve in a handsโ€‘on capacity requiring a broad understanding of wafer fabrication equipment and processes. Responsibilities include setup, qualification, optimization, and troubleshooting of automated equipment used for Wafer Grinding, Edge Grinding, Chemicalโ€‘Mechanical Planarization (CMP), Polishing, Wafer Bonding, Mount/Demount processes, glassing.
  • Sustain wafer fabrication processes to meet all factory indicators; plan and execute experiments to fully characterize processes throughout the development cycle; drive improvements in quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics across variables such as material, method, equipment, environment, and operating personnel.
  • Provide daily process support, including equipment setup, writing new programs, adjusting/optimizing parameters, running engineering lots, troubleshooting equipment, and supporting production in identifying, responding to, and dispositioning nonโ€‘conforming material.
  • Take ownership of entire processes, including equipment selection, process and equipment qualification, writing detailed setup instructions and procedures, and training operators, technicians, and other engineers on equipment operation. Update and create routing documentation as needed.
  • Apply general knowledge of electronics manufacturing and maintain strong technical understanding of wafer fabrication processes.
Key Competencies Required
  • Excellent judgment, familiarity with semiconductor processing, and an optimistic, proactive approach.
  • Ability to develop solutions using formal education, statistical methods, and structured problemโ€‘solving tools.
  • Proven track record of solving technical problems, owning projects, meeting deadlines, and managing multiple tasks.
  • Strong sense of ownership, enthusiasm, and dedication to process improvement.
  • Ability to work collaboratively with crossโ€‘functional teams to enhance processes.
  • Excellent verbal and written communication skills, including technical writing for data summaries, findings, process specifications, equipment documentation, and work instructions.
  • Knowledge of optical component fabrication and polishing.
  • Knowledge of wafer polishing, Wafer Grinding, Edge Grinding, and CMP processes.
  • Handsโ€‘on experience in wafer fabrication processes.
  • Basic project management experience and ability to work with minimal supervision.
  • Strong presentation skills and ability to communicate effectively with all levels of management and across diverse departments.
Minimum Qualifications
  • BS in Engineering. Minimum 8 years of relevant work experience in semiconductors / Wafer fabrication process.
  • Familiarity with typical material systems used in compound semiconductors and a solid understanding of device physics and IC processing.
  • Demonstrated knowledge of compound semiconductor processing in a wafer fabrication environment or similar setting.
  • Experience with data mining, statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problemโ€‘solving methodologies is preferred.
  • Due to ITAR restrictions, applicants must be a U.S. Citizen or Permanent Resident.
EEO

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

ITAR

Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

RSU Eligible

This position is eligible to receive restricted stock unit (RSU) awards and cash bonuses, solely at MACOMโ€™s discretion, subject to individual and company performance.

Salary Range

The Salary Range for this position is $117,000 โ€“ $171,000. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidatesโ€™ experience, education, and specific knowledge, skills, and abilities.

Benefits
  • Health, dental, and vision insurance.
  • Employer-sponsored 401(k) plan.
  • Paid time off.
  • Professional development opportunities.
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