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Wafer Fabrication Technician

Nashua, NH · On-site

$28 - $30/hr

Operate and monitor wafer fabrication equipment, including photolithography, thin film deposition, etching, grinding, dicing, and related processes. * Follow detailed traveler documentation and ...

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Wafer Grinding information

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$13

$19

$26

How much do wafer grinding jobs pay per hour?

As of Jun 25, 2026, the average hourly pay for wafer grinding in the United States is $19.16, according to ZipRecruiter salary data. Most workers in this role earn between $17.07 and $20.67 per hour, depending on experience, location, and employer.

What is the difference between Wafer Grinding vs Wafer Polishing?

AspectWafer GrindingWafer Polishing
Primary PurposeMaterial removal to achieve desired thickness and flatnessSurface finishing to improve smoothness and reflectivity
ProcessMechanical grinding using abrasive wheels or beltsChemical-mechanical polishing for fine surface finish
EquipmentGrinding machines, abrasive toolsPolishing pads, chemical slurry
Work EnvironmentCleanroom, precision manufacturingCleanroom, surface finishing labs

Wafer Grinding and Wafer Polishing are both essential in semiconductor manufacturing. Grinding primarily reduces wafer thickness and prepares the surface, while polishing enhances surface smoothness and quality. Both roles require precision, cleanroom environments, and similar technical skills, but focus on different stages of wafer preparation.

What does a wafer technician do?

A wafer technician is responsible for operating and maintaining equipment used to grind and polish semiconductor wafers to precise specifications. They monitor process parameters, inspect wafers for defects, and ensure quality control during manufacturing. The role often requires knowledge of cleanroom procedures and technical skills with grinding tools and measurement instruments.

What is the job description of a grinder?

A wafer grinding operator is responsible for using precision grinding machines to thin and shape semiconductor wafers. The job requires attention to detail, knowledge of equipment operation, and adherence to safety protocols in a cleanroom environment. Skills in measuring and quality control are essential for ensuring wafers meet specifications.

What does wafer tech make?

Wafer technicians work in semiconductor manufacturing and are responsible for grinding, polishing, and inspecting silicon wafers used in electronic devices. They operate specialized equipment and follow strict quality standards to ensure wafers meet specifications for chip production.

What is wafer grinding?

Wafer grinding is a process used in semiconductor manufacturing to thin silicon wafers by removing material from their surfaces. It involves using precision grinding machines with abrasive wheels to achieve the desired thickness, often as a preparatory step before further processing like polishing or dicing. Workers in this field need knowledge of equipment operation, safety protocols, and quality control standards.

What are some common challenges faced in wafer grinding roles, and how can they be addressed?

One common challenge in wafer grinding is maintaining tight tolerances and preventing wafer breakage, as the process requires extreme precision and careful handling. Operators must remain vigilant about equipment calibration, cleanliness, and monitoring for any signs of tool wear or contamination. Effective communication with quality assurance and maintenance teams is essential to quickly address issues and minimize downtime. Continuous on-the-job training and following strict safety protocols also help ensure high-quality output and a safe work environment.

What are the key skills and qualifications needed to thrive as a Wafer Grinding Technician, and why are they important?

To excel as a Wafer Grinding Technician, you need a solid understanding of semiconductor manufacturing processes, precision measurement, and a high school diploma or technical certification. Familiarity with grinding machines, cleanroom protocols, and inspection tools like micrometers and profilometers is typically required. Attention to detail, problem-solving abilities, and effective communication are crucial soft skills in this role. These competencies ensure the production of high-quality wafers, minimize defects, and maintain efficiency in semiconductor fabrication.
Infographic showing various Wafer Grinding job openings in the United States as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution, with an average salary of $39,852 per year, or $19.2 per hour.

Process Engineer, Senior

MACOM Technology Solutions Holdings

Lowell, MA • On-site

$98K - $130K/yr

Full-time

Medical, Dental, PTO

Posted 22 days ago

Job description

MACOM designs and manufactures semiconductor productsfor Data Center, Telecommunication and Industrial and Defense applications.Headquartered in Lowell, Massachusetts, MACOM has design centers and salesoffices throughout North America, Europe and Asia. MACOM is certified to theISO9001 international quality standard and ISO14001 environmental managementstandard.
MACOM has more than 75 years of application expertise with multiple designcenters, Si, GaAs and InP fabrication, manufacturing, assembly and test, andoperational facilities throughout North America, Europe, and Asia. Click hereto view our facilities. In addition, MACOM offers foundry services thatrepresent a key core competency within our business.
MACOM sells and distributes products globally via a sales channel comprised ofa direct field sales force, authorized sales representatives and leadingindustry distributors. Our sales team is trained across all of our products togive our customers insights into our entire portfolio.
Process Engineer, Senior
In this critical role, you will be responsiblefor the Grind/Polish and wafer bonding processes within MACOM's internal waferfab. You will also assist in other areas as needed and providebackup coverage for additional operations within the upstairs fab. Thisrole includes both developing new fab processes and sustaining existingones. The product portfolio includes GaN, GaAs, Si, and InP-basedtechnologies.
Main Duties and Responsibilities
  • Develop, continuously improve, and sustain processes in close partnership with Device and Integration Engineering and Business Unit design teams.
  • Serve in a hands-on capacity requiring a broad understanding of wafer fabrication equipment and processes. Responsibilities include setup, qualification, optimization, and troubleshooting of automated equipment used for Wafer Grinding, Edge Grinding, Chemical-Mechanical Planarization (CMP), Polishing, Wafer Bonding and Mount/Demount processes.
  • Sustain wafer fabrication processes to meet all factory indicators; plan and execute experiments to fully characterize processes throughout the development cycle; drive improvements in quality, reliability, cost, yield, process stability/capability, productivity, and safety/ergonomics across variables such as material, method, equipment, environment, and operating personnel.
  • Provide daily process support, including equipment setup, writing new programs, adjusting/optimizing parameters, running engineering lots, troubleshooting equipment, and supporting production in identifying, responding to, and dispositioning non-conforming material.
  • Take ownership of entire processes, including equipment selection, process and equipment qualification, writing detailed setup instructions and procedures, and training operators, technicians, and other engineers on equipment operation. Update and create routing documentation as needed.
  • Apply general knowledge of electronics manufacturing and maintain strong technical understanding of wafer fabrication processes.

Key Competencies Required
  • Excellent judgment, familiarity with semiconductor processing, and an optimistic, proactive approach.
  • Ability to develop solutions using formal education, statistical methods, and structured problem-solving tools.
  • Proven track record of solving technical problems, owning projects, meeting deadlines, and managing multiple tasks.
  • Strong sense of ownership, enthusiasm, and dedication to process improvement.
  • Ability to work collaboratively with cross-functional teams to enhance processes.
  • Excellent verbal and written communication skills, including technical writing for data summaries, findings, process specifications, equipment documentation, and work instructions.
  • Knowledge of optical component fabrication and polishing.
  • Knowledge of wafer polishing, Wafer Grinding, Edge Grinding, and CMP processes.
  • Hands-on experience in wafer fabrication processes.
  • Basic project management experience and ability to work with minimal supervision.
  • Strong presentation skills and ability to communicate effectively with all levels of management and across diverse departments.

Minimum Qualifications
  • BS in Engineering. Minimum 5 years of relevant work experience in semiconductors / Wafer fabrication process.
  • Familiarity with typical material systems used in compound semiconductors and a solid understanding of device physics and IC processing.
  • Demonstrated knowledge of compound semiconductor processing in a wafer fabrication environment or similar setting.
  • Experience with data mining, statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem-solving methodologies is preferred.
  • Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

The Salary Range for this position is $98,000 - $130,000.Actual salary offered to candidates will depend on several factors, includingbut not limited to, work location, relevant candidates' experience, education,and specific knowledge, skills, and abilities.
This position is eligible to receive restricted stockunit (RSU) awards and cash bonuses, solely at MACOM's discretion, subject toindividual and company performance.
EEO:
MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis ofrace, color, religion, sex, gender identity, sexual orientation, nationalorigin, age, disability, genetic information, veteran status, military service,marital status, or any other category protected under applicable law.
Reasonable Accommodation:
MACOM is committed to working with and providing reasonable accommodations toqualified individuals with physical and mental disabilities. If you havea disability and are in need of a reasonable accommodation with respect to anypart of the application process please call +1-978-656-2500 or emailHR_Ops@MACOM.com. Provide your name, phone number and the position titleand location in which you are interested, and nature of accommodation needed,and we will get back to you. We also work with current employees whorequest or need reasonable accommodation in order to perform the essentialfunctions of their jobs.
Benefits: This positionoffers a comprehensive benefits package including but not limited to:
• Health, dental, and visioninsurance.
• Employer-sponsored 401(k)plan.
• Paid time off.
• Professional developmentopportunities.

Apply