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Wafer Dicing Engineer Jobs (NOW HIRING)

... Wafer Dicing, CMP etc. Qualifications: * Currently pursuing a BS, MS, PhD in Electrical Engineering ... Chemical Engineering, Materials Science, or related fields, Minimum 3.0 GPA. * Semiconductor ...

... Photolithography, Wafer Dicing, CMP etc. * Data collection via various metrology tools * Data ... Currently pursuing a BS, MS, or PhD in Electrical Engineering, Chemical Engineering, Materials ...

... Photolithography, Wafer Dicing, CMP etc. * Data collection via various metrology tools * Data ... Currently pursuing a BS, MS, or PhD in Electrical Engineering, Chemical Engineering, Materials ...

... Photolithography, Wafer Dicing, CMP etc. * Data collection via various metrology tools * Data ... Currently pursuing a BS, MS, or PhD in Electrical Engineering, Chemical Engineering, Materials ...

... Photolithography, Wafer Dicing, CMP etc. * Data collection via various metrology tools * Data ... Currently pursuing a BS, MS, or PhD in Electrical Engineering, Chemical Engineering, Materials ...

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Wafer Dicing Engineer information

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$33.5K

$87K

$130.5K

How much do wafer dicing engineer jobs pay per year?

As of Sep 9, 2026, the average yearly pay for wafer dicing engineer in the United States is $87,037.00, according to ZipRecruiter salary data. Most workers in this role earn between $71,000.00 and $114,500.00 per year, depending on experience, location, and employer.

What does a wafer dicing engineer do?

A Wafer Dicing Engineer is responsible for cutting semiconductor wafers into individual chips or dies using precision equipment such as dicing saws or lasers. Their work involves setting up and maintaining dicing tools, optimizing cutting parameters, and ensuring high-quality yields with minimal damage or contamination to the chips. They also troubleshoot equipment issues, implement process improvements, and adhere to cleanroom protocols to maintain product integrity. This role is crucial in the semiconductor manufacturing process, as it directly impacts the quality and performance of the finished devices.

What are the key skills and qualifications needed to thrive as a wafer dicing engineer, and why are they important?

To thrive as a Wafer Dicing Engineer, you need a solid background in semiconductor manufacturing processes, materials science, and precision engineering, often supported by a degree in engineering or a related field. Familiarity with dicing saws, laser dicing equipment, cleanroom protocols, and statistical process control tools is typically required. Strong problem-solving skills, attention to detail, and effective communication help ensure quality and efficiency in a team environment. These skills and qualifications are crucial for maintaining high yields, minimizing defects, and supporting advanced semiconductor device production.

What are some typical challenges faced by wafer dicing engineers, and how can candidates prepare to address them?

Wafer Dicing Engineers often encounter challenges related to maintaining high precision and yield while minimizing wafer breakage and contamination. These challenges require strong attention to detail, familiarity with dicing equipment such as saws or lasers, and the ability to troubleshoot process issues quickly. Candidates can prepare by gaining hands-on experience with semiconductor fabrication tools, understanding cleanroom protocols, and staying updated on emerging dicing technologies. Collaborating closely with process engineers and technicians is also essential for optimizing workflows and resolving production bottlenecks.

What is the difference between Wafer Dicing Engineer vs Semiconductor Process Engineer?

AspectWafer Dicing EngineerSemiconductor Process Engineer
CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications are optionalRequires a degree in chemical, electrical, or materials engineering; certifications may enhance prospects
Work EnvironmentWorks in cleanroom or manufacturing settings focused on wafer slicing and dicingWorks in cleanrooms or labs involved in process development and optimization
Industry UsageCommonly employed in semiconductor fabrication plants for wafer singulationUsed across semiconductor manufacturing for process improvement and quality control

While both roles operate within the semiconductor industry, a Wafer Dicing Engineer specializes in cutting and separating wafers into individual chips, whereas a Semiconductor Process Engineer focuses on developing and refining manufacturing processes. Understanding these differences helps in choosing the right career path or job search focus.

What are popular job titles related to Wafer Dicing Engineer jobs?

For Wafer Dicing Engineer jobs, the most frequently searched job titles are:

Infographic showing various Wafer Dicing Engineer job openings in the United States as of September 2026, with employment types broken down into 100% Full Time. Highlights an 88% In-person, 6% Hybrid, and 6% Remote job distribution, with an average salary of $87,037 per year, or $41.8 per hour.

Process Development Engineer (Photonics)

Rochester, NY • On-site

NY Creates
Semiconductor and Electronic Component Manufacturing • 501 - 1,000 employees

$100K - $135K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

This job post has expired today. Applications are no longer accepted.


NY Creates rating

8.5

Company rating: 8.5 out of 10

Based on 7 frontline employees who took The Breakroom Quiz

23rd of 75 rated research


Job description

About NY Creates:
 

NY Creates serves as a bridge for advanced electronics, leads projects that advance R&D in emerging technologies, and generates the jobs of tomorrow. NY Creates also runs some of the most advanced facilities in the world, boasts more than 3,000 industry experts and faculty, and manages public and private investments of approximately $25 billion - placing it at the global epicenter of high-tech innovation and commercialization.

Job Description:
 

Position Summary, Process Development Engineer (Photonics)

AIM Photonics is looking for a Process Development Engineer who will be hands-on working with advanced solder interconnect equipment and materials for the assembly of optoelectronic packages.

AIM Photonics is one of nine United States Department of Defense Manufacturing Innovation Institutes which are industry-driven, public-private partnerships that focus on the nation's premiere capabilities and expertise to capture critical global manufacturing leadership. AIM Photonics is headquarters at NY Creates in Albany, NY. The AIM Photonics Test, Assembly, and Packaging facility (TAP) is new state-of-the-art electronic photonic packaging facility in Rochester, NY. Photonics packaging is 90% of the cost of photonic products and can be a differentiator in the success of the final product.

Key Responsibilities

  • Develop interconnect processes and build heterogeneously integrated electronic and optoelectronic packages using state of the art equipment at TAP.
  • Run DOE experiments to find best machine parameters to achieve successful builds of advanced packages. Such processes include flip chip, solder, attach, plasma cleaning, thermal compression bonding, additive printing, and dispensing.
  • Evaluate and qualify materials including solders used in electronic and optoelectronic packages as required by customers' application.
  • Work with high precision equipment to build parts with good solder interconnect integrity and reliability.
  • Perform continuous inspection, characterization, and metrology of a process to make sure process is robust.
  • Serve as a liaison with marketing, vendors, purchasing and customer on technical information
  • Interpret failure analysis reports and cross-sections to understand solder joint integrity.
  • Gather and analyze data: Conduct root cause and failure mode analysis to efficiently improve yields and device performance.
  • Develop and perform semiconductor assembly processes such as:
    • Active alignment fiber attach
    • Optical component alignment
    • Wafer Dicing
    • Die pick/sort
    • Other reasonable duties assigned. 
       

Requirements:
 

Minimum Qualifications, Process Development Engineer (Photonics)

  • Bachelor's degree in mechanical engineering, materials Science, engineering physics, or equivalent from a college or University accredited by the USDOE or internationally recognized accrediting organization.
  • 3+ years of experience in fabrication, packaging, or semiconductor devices as well as experience in fiber attach, dicing, or wire bonding.
  • This position is contingent on the satisfactory completion of a background check.

Preferred Qualifications, Process Development Engineer (Photonics)

  • Master's Degree or PhD in Mechanical Engineer, Materials Science, Engineering, Physics or equivalent from a college or University accredited by the USDOE or internationally recognized accrediting organization.
  • Strong understanding of engineering and materials science fundamentals and a demonstrated aptitude to learn.
  • Experience in cleanroom, high precision equipment, inspection, and characterization equipment in semiconductor assembly line.
  • Experience in back-end assembly process including flip-chip bumping, thermal compression bonding, and solder reflow will be highly desirable.
  • Experience with flux and fluxless soldering of eutectic solder alloys and intermetallic formation.
  • Experience with failure analysis of solder joints
  • Strict discipline to follow rules, specifications, have good attention to details as well as have good organization skills.
  • DOE experience is a plus.
  • Excellent oral and written communication skills.


Don't meet every requirement? At NY Creates we are dedicated to building a welcoming team. If you are excited about working for NY Creates but your experience doesn't exactly align perfectly with the job description, we encourage you to apply anyway, you might still be a perfect fit for this or another role.

Benefits

  • Medical, Vision, and Dental
  • Competitive Pay and PTO
  • Flexible Heath Spending and Dependent Care Accounts
  • Basic / Optional Life Insurance
  • Post-Retirement Health Insurance
  • Employer contribution of 7% of earnings to a Basic Retirement plan after meeting one year of service.
  • Optional employee contributed retirement account.

Location: 257 Fuller Road, Albany, NY 12203

Salary Range: $100,000-$135,000

Eng Level I $100,000-$110,000

Eng Level II $110,000-$120,000

Eng Level III $120,000-$135,000

*Posted salary rates are determined upon experience and education

Additional Information:
 

NOTE: Some positions require access to export-controlled commodities, technical data, technology, software, or restricted programs where U.S. Government authorization may be required.  
 
For positions requiring such access, offers of employment are contingent upon the employer being able to obtain the necessary authorization, including, if required, an export license from the U.S. Department of Commerce's Bureau of Industry and Security, the U.S. Department of State's Directorate of Defense Trade Controls, or other government agencies. The decision to pursue an export license application is at The Research Foundation for SUNY's sole discretion. Proof of status may be required prior to employment in connection with necessary authorizations.  
 
Employment is with the Research Foundation for SUNY. The Research Foundation is an Equal Opportunity Employer, including individuals with disabilities and protected veterans.
 
In compliance with the Americans with Disabilities Act (ADA), if you have a disability and require a reasonable accommodation to apply please call Human Resources at 518-437-8686.


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