ZipRecruiter

Log In

1

Wafer Dicing Engineer Jobs (NOW HIRING)

Teledyne FLIR LLC

Wafer Dicing Technician

Camarillo, CA · On-site

$51K - $68K/yr

Join Teledyne Imaging Sensors as a Wafer Dicing Technician! Are you ready to launch your career to ... Work with responsible engineers in dicing operation for quality control, process control and ...

Teledyne

Wafer Dicing Technician

Camarillo, CA

$51K - $68K/yr

Join Teledyne Imaging Sensors as a Wafer Dicing Technician! Are you ready to launch your career to ... Work with responsible engineers in dicing operation for quality control, process control and ...

Apple

Package Integration Engineer

San Francisco, CA · On-site

$122K - $164K/yr

Looking for a senior level IC packaging engineer to develop exciting new products. You will be ... back-grind, wafer dicing, Flip Chip die attach (including multilayer thin die stacking ...

Apple

Packaging Engineer

San Francisco, CA · On-site

Looking for a senior level IC packaging engineer to develop exciting new products. You will be ... Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing ...

University of Florida

Engineer II

Gainesville, FL · On-site

$68K - $75K/yr

Engineer II Job no: 541206 Work type: Staff Full-Time Location: Main Campus (Gainesville, FL ... dicing, wafer bonding, thin film deposition, plasma etching. Additional instrument, tools, and ...

Apple

Process Engineer

San Francisco, CA · On-site

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development ... Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip ...

GPD Optoelectronics

GPD's engineering teams utilize production staff for many projects - this role requires ability to ... Dicing/Scribing, Grinding, Wafer probe, Pick-and-Place, and Wafer/Device Testing. · Front End ...

next page

Showing results 1-20

All JobsManufacturing JobsProduct Manufacturing JobsProduction Machine Operator JobsWafer Dicing Engineer Jobs

Wafer Dicing Engineer information

See salary details

$33.5K

$87K

$130.5K

How much do wafer dicing engineer jobs pay per year?

As of Sep 8, 2026, the average yearly pay for wafer dicing engineer in the United States is $87,037.00, according to ZipRecruiter salary data. Most workers in this role earn between $71,000.00 and $114,500.00 per year, depending on experience, location, and employer.

What does a wafer dicing engineer do?

A Wafer Dicing Engineer is responsible for cutting semiconductor wafers into individual chips or dies using precision equipment such as dicing saws or lasers. Their work involves setting up and maintaining dicing tools, optimizing cutting parameters, and ensuring high-quality yields with minimal damage or contamination to the chips. They also troubleshoot equipment issues, implement process improvements, and adhere to cleanroom protocols to maintain product integrity. This role is crucial in the semiconductor manufacturing process, as it directly impacts the quality and performance of the finished devices.

What are the key skills and qualifications needed to thrive as a wafer dicing engineer, and why are they important?

To thrive as a Wafer Dicing Engineer, you need a solid background in semiconductor manufacturing processes, materials science, and precision engineering, often supported by a degree in engineering or a related field. Familiarity with dicing saws, laser dicing equipment, cleanroom protocols, and statistical process control tools is typically required. Strong problem-solving skills, attention to detail, and effective communication help ensure quality and efficiency in a team environment. These skills and qualifications are crucial for maintaining high yields, minimizing defects, and supporting advanced semiconductor device production.

What are some typical challenges faced by wafer dicing engineers, and how can candidates prepare to address them?

Wafer Dicing Engineers often encounter challenges related to maintaining high precision and yield while minimizing wafer breakage and contamination. These challenges require strong attention to detail, familiarity with dicing equipment such as saws or lasers, and the ability to troubleshoot process issues quickly. Candidates can prepare by gaining hands-on experience with semiconductor fabrication tools, understanding cleanroom protocols, and staying updated on emerging dicing technologies. Collaborating closely with process engineers and technicians is also essential for optimizing workflows and resolving production bottlenecks.

What is the difference between Wafer Dicing Engineer vs Semiconductor Process Engineer?

AspectWafer Dicing EngineerSemiconductor Process Engineer
CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications are optionalRequires a degree in chemical, electrical, or materials engineering; certifications may enhance prospects
Work EnvironmentWorks in cleanroom or manufacturing settings focused on wafer slicing and dicingWorks in cleanrooms or labs involved in process development and optimization
Industry UsageCommonly employed in semiconductor fabrication plants for wafer singulationUsed across semiconductor manufacturing for process improvement and quality control

While both roles operate within the semiconductor industry, a Wafer Dicing Engineer specializes in cutting and separating wafers into individual chips, whereas a Semiconductor Process Engineer focuses on developing and refining manufacturing processes. Understanding these differences helps in choosing the right career path or job search focus.

What are popular job titles related to Wafer Dicing Engineer jobs?

For Wafer Dicing Engineer jobs, the most frequently searched job titles are:

Infographic showing various Wafer Dicing Engineer job openings in the United States as of September 2026, with employment types broken down into 100% Full Time. Highlights an 88% In-person, 6% Hybrid, and 6% Remote job distribution, with an average salary of $87,037 per year, or $41.8 per hour.

Wafer Dicing Technician

Camarillo, CA • On-site

Teledyne FLIR LLC
IT Services • 1 - 5K employees
Learn more about Teledyne FLIR LLCexternal

$51K - $68K/yr

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Re-posted 12 days ago

Job description

Be visionary
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.
We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.
Job Description
Join Teledyne Imaging Sensors as a Wafer Dicing Technician!
Are you ready to launch your career to the next level? Join our mission-focused team, where we value technical excellence, collaboration, and agility. We're the world's leading provider of infrared sensors for space, with customers like NASA, ESA, and the US Department of Defense.
What You'll Do:
  • Support daily wafer dicing operation that includes container labels, wafer mounting, saw dicing, demounting, cleaning, measuring and inspection duties.
  • Work with responsible engineers in dicing operation for quality control, process control and continuous improvements in dicing processes and procedures.
  • Document and report any nonconformal event and assist root cause analysis.
  • Work with Manufacturing Execution System (MES) for process execution, data recording and reporting.
  • Follow all laboratory protocols and safety procedures.
  • Assist with maintaining equipment to ensure optimal operation and proper calibration.

What You Need:
  • Ability to work second shift or split shift.
  • Strong understanding of mechanical drawings on dimensions and tolerances.
  • Ability to use digital microscope and metrology tools.
  • Proficiency with Microsoft Word, PowerPoint, and Excel.
  • Manual dexterity to handle small, precision components.
  • High School Diploma with 3 years of relevant experience.
  • U.S. citizenship due to access restrictions.

What We Offer:
  • Competitive Salary & Benefits Package
  • Health, Dental, Vision, and Life Insurance from Day 1
  • Paid Vacation, Sick Time, and Holidays
  • 401(k) with Company Match
  • Employee Stock Purchase Plan
  • Educational Tuition Reimbursement
  • Fun Employee Events throughout the year

Why Teledyne? Our infrared sensors are "Everywhere You Look"™ - from the James Webb Space Telescope to climate change studies. Join us and make a difference!
Ready to take the next step? Apply now and become part of a team that's pushing the boundaries of technology and innovation.
#TS&I
Salary Range:
$51,600.00-$68,800.000
The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.
Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.
Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.

Apply