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Wafer Dicing Engineer Jobs (NOW HIRING)

Apple

Process Engineer

Bodega Bay, CA

$184K - $324K/yr

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development ... Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip ...

Apple

Process Engineer

Bodega Bay, CA

$184K - $324K/yr

Join Apple's ATG Sensing Group as a Senior Electronic Packaging Engineer to drive the development ... Expert-level knowledge in assembly steps: wafer thinning, wafer dicing, die attach (including flip ...

Apple Inc.

Packaging Engineer

San Francisco, CA · On-site

$184K - $324K/yr

D. degree in mechanical engineering, physics, materials science or similar disciplines with a ... Some hands-on knowledge in Manufacturing assembly processes; such as wafer back-grind, wafer dicing ...

NCSU

CLAWS III-N RF Integration Engineer

Raleigh, NC

... etching, wafer dicing, and others as needed. * Characterization and Reliability Testing (20 ... Work with process engineers and R&D partners to drive technology improvements. * Collaborate with ...

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Wafer Dicing Engineer information

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$33.5K

$87K

$130.5K

How much do wafer dicing engineer jobs pay per year?

As of Sep 11, 2026, the average yearly pay for wafer dicing engineer in the United States is $87,037.00, according to ZipRecruiter salary data. Most workers in this role earn between $71,000.00 and $114,500.00 per year, depending on experience, location, and employer.

What does a wafer dicing engineer do?

A Wafer Dicing Engineer is responsible for cutting semiconductor wafers into individual chips or dies using precision equipment such as dicing saws or lasers. Their work involves setting up and maintaining dicing tools, optimizing cutting parameters, and ensuring high-quality yields with minimal damage or contamination to the chips. They also troubleshoot equipment issues, implement process improvements, and adhere to cleanroom protocols to maintain product integrity. This role is crucial in the semiconductor manufacturing process, as it directly impacts the quality and performance of the finished devices.

What are the key skills and qualifications needed to thrive as a wafer dicing engineer, and why are they important?

To thrive as a Wafer Dicing Engineer, you need a solid background in semiconductor manufacturing processes, materials science, and precision engineering, often supported by a degree in engineering or a related field. Familiarity with dicing saws, laser dicing equipment, cleanroom protocols, and statistical process control tools is typically required. Strong problem-solving skills, attention to detail, and effective communication help ensure quality and efficiency in a team environment. These skills and qualifications are crucial for maintaining high yields, minimizing defects, and supporting advanced semiconductor device production.

What are some typical challenges faced by wafer dicing engineers, and how can candidates prepare to address them?

Wafer Dicing Engineers often encounter challenges related to maintaining high precision and yield while minimizing wafer breakage and contamination. These challenges require strong attention to detail, familiarity with dicing equipment such as saws or lasers, and the ability to troubleshoot process issues quickly. Candidates can prepare by gaining hands-on experience with semiconductor fabrication tools, understanding cleanroom protocols, and staying updated on emerging dicing technologies. Collaborating closely with process engineers and technicians is also essential for optimizing workflows and resolving production bottlenecks.

What is the difference between Wafer Dicing Engineer vs Semiconductor Process Engineer?

AspectWafer Dicing EngineerSemiconductor Process Engineer
CredentialsTypically requires a degree in electrical engineering, materials science, or related fields; certifications are optionalRequires a degree in chemical, electrical, or materials engineering; certifications may enhance prospects
Work EnvironmentWorks in cleanroom or manufacturing settings focused on wafer slicing and dicingWorks in cleanrooms or labs involved in process development and optimization
Industry UsageCommonly employed in semiconductor fabrication plants for wafer singulationUsed across semiconductor manufacturing for process improvement and quality control

While both roles operate within the semiconductor industry, a Wafer Dicing Engineer specializes in cutting and separating wafers into individual chips, whereas a Semiconductor Process Engineer focuses on developing and refining manufacturing processes. Understanding these differences helps in choosing the right career path or job search focus.

What are popular job titles related to Wafer Dicing Engineer jobs?

For Wafer Dicing Engineer jobs, the most frequently searched job titles are:

Infographic showing various Wafer Dicing Engineer job openings in the United States as of September 2026, with employment types broken down into 100% Full Time. Highlights an 88% In-person, 6% Hybrid, and 6% Remote job distribution, with an average salary of $87,037 per year, or $41.8 per hour.

Staff Package Development Engineer

Austin, TX • On-site

Renesas Electronics
See more jobs at Renesas Electronicsexternal

Full-time

Re-posted 12 days ago

Job description

Job Description

The Package Development Engineer is responsible for developing, qualifying, and industrializing semiconductor package solutions that meet product performance, reliability, manufacturability, cost, and schedule requirements. This role works closely with cross-functional teams, including silicon design, package design, manufacturing, reliability, quality, and OSAT partners to bring new package technologies from concept through high-volume manufacturing.

The ideal candidate combines strong semiconductor packaging expertise with a hands-on, problem-solving mindset and the ability to drive complex technology development activities in a global environment.

Qualifications
  • Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
  • Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
  • Strong knowledge of semiconductor assembly processes, including,
    • Wafer backgrind
    • Wafer dicing
    • Die attach
    • Flip-chip assembly
    • Wire bonding
    • Underfill
    • Encapsulation and molding
    • Ball attach
    • Package singulation
    • Surface-mount technology (SMT)
  • Experience developing and qualifying semiconductor packages in collaboration with OSAT partners.
  • Knowledge of Design of Experiments (DOE), statistical analysis, and structured problem-solving methodologies.
  • Experience conducting package reliability testing, failure analysis, and root-cause investigations.
  • Strong analytical, project management, and communication skills.
  • Ability to work independently and effectively within cross-functional global teams.

 Preferred Qualifications

  • Master's degree or Ph.D. in Packaging Engineering, Mechanical Engineering, Materials Science, Physics, Chemistry, or a related field.
  • Experience with advanced packaging technologies such as:
    • Flip-Chip CSP (FCCSP)
    • System-in-Package (SiP)
    • Fan-Out Packaging (FOPLP/FOWLP)
    • Wafer-Level Packaging (WLP/WLCSP)
    • 2.5D/3D Packaging
  • Knowledge of package thermal, mechanical, and electrical characterization techniques.
  • Experience supporting automotive-grade product qualification and reliability standards.
  • Knowledge of sustainability initiatives, packaging materials selection, and cost optimization techniques.

Education/Experience:

Ph.D. - 2 plus years relevant industry experience

Master's Degree - 5 plus years relevant industry experience

Bachelor's Degree - 7 plus years relevant industry experience

Key Competencies:

  • Strong technical problem-solving skills
  • Engineering rigor and attention to detail
  • Innovation and research mindset
  • Project ownership and execution
  • Cross-functional leadership
  • Vendor and supplier management
  • Effective technical communication
  • Ability to thrive in a fast-paced development environment
  • Continuous learning and improvement orientation
Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on worldleading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

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