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Postdoctoral Fellow - DD

The Texas Institute for Electronics (TIE) is a University of Texas at Austin-supported semiconductor consortium of state and local government, preeminent defense electronics and semiconductor companies, national labs and nationally recognized academic institutions. Our mission is to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap, and to provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth.

Join the Texas Institute for Electronics (TIE) and help us push the boundaries in critical semiconductor domains, including advanced packaging, with the aim of reestablishing U.S. prominence in semiconductor manufacturing.

With over $1 billion in funding from the US DoD and the state of Texas, we're at the forefront of creating cutting-edge semiconductor manufacturing equipment and processes that will set the course for future advancements in semiconductor logic, memory, heterogeneous integration, chip cooling and more. Situated in the heart of Austin — named "America's Coolest City" by Expedia and "The Best Place to Live in the U.S." by U.S. News and World Report — the Texas Institute for Electronics embodies the city's innovative spirit.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through LinkedIn Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff ID card
• Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
• For more details, please see: Benefits | Human Resources and UT Austin Employee Experience | Human Resources

Must be authorized to work in the United States on a full-time basis for any employer without sponsorship.

Purpose

The Postdoc employed in this position will conduct/lead applied as well as fundamental research in physics-informed Artificial Intelligence (AI) and Machine Learning (ML) methodologies enabling digital twin functionalities in microelectronics and advanced packaging. The Postdoc will be part of a larger team of engineers-scientists working on cutting edge advancements in heterogeneous integration.

Responsibilities

• Develop multiscale and multiphysics modeling for thermomechanical effects on high performance heat spreaders based on materials such as diamond thin films.
• Collaborate with experimental groups on characterization of thermomechanical properties of diamond thin films and other thermal interface materials.
• Communicate effectively with PI and collaborators in regular meetings.
• Develop manuscripts for publishing in archival journals based on the research results.
• Other duties as assigned.

Required Qualifications

• PhD earned within the last 3 years in Operations Research and Industrial Engineering or a closely related discipline, with a focus on data analytics, AI, ML, advanced process control, and digital twin technologies in semiconductor manufacturing.
• Experience with handling industrial big data problems, physics-informed AI/ML, advanced optimization and control of semiconductor manufacturing processes and systems.
• Experience in working with advanced AI/ML software packages and super-computing cluster systems, including Hadoop, Spark, Python and Matlab.
• Familiarity with co-optimization and co-control of multistage manufacturing systems is a big plus
• Familiarity with microelectronics packaging and heterogeneous integration is also a big plus.

Salary Range

$70,000 + depending on qualifications

Working Conditions

• May work in standard office conditions
• May require repetitive use of keyboard at a workstation
• May require use of manual dexterity
• May work around chemicals
• May work around electrical and mechanical hazards
• Lifting and moving

Work Shift

• Monday to Friday 40 hours per week.

Required Materials

• Resume/CV
• 3 work references with their contact information; at least one reference should be from a supervisor
• Letter of interest