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Thermal Modeling Jobs (NOW HIRING)

Cspeed

Thermal Simulation Engineer

Palo Alto, CA · On-site

The Role This position owns thermal modeling for CspeedIO optical engines, from die-level power maps through cooling boundary conditions, and the correlation of those models against measured hardware.

Apex

Thermal Engineer (Mid)

Los Angeles, CA · On-site

$125K - $155K/yr

This position requires expertise in thermal modeling, testing, and hardware integration to ensure mission success. Responsibilities: * Develop and maintain spacecraft-level thermal models using Ansys ...

Carrier

Thermal Systems Modeling Engineer

Charlotte, NC · On-site

$64K - $129K/yr

About This Role As a Thermal Systems Modeling Engineer at Carrier, you will be a key member of our dynamic engineering team dedicated to developing advanced cooling solutions particularly for the ...

Carrier

Thermal Systems Modeling Engineer

Charlotte, NC · On-site

$64K - $129K/yr

About This Role As a Thermal Systems Modeling Engineer at Carrier, you will be a key member of our dynamic engineering team dedicated to developing advanced cooling solutions particularly for the ...

Approach Venture

Thermal Engineer

Denver, CO

$125K - $165K/yr

You will be responsible for both the analytical and hardware sides of the discipline, including detailed thermal modeling, radiator and heater sizing, MLI, coatings, conductive interfaces, thermal ...

Sheetak, Inc.

Thermal Design Engineer

Austin, TX · On-site

Thermal Modeling & System-Level Design: Develop component and system-level thermal models using SolidWorks Flow Simulation to predict steady-state and transient thermal behavior. * Assist in the ...

Approach Venture LLC

Thermal Engineer

Denver, CO · On-site

$125K - $165K/yr

You will be responsible for both the analytical and hardware sides of the discipline, including detailed thermal modeling, radiator and heater sizing, MLI, coatings, conductive interfaces, thermal ...

NextHop AI

Thermal Engineer

Santa Clara, CA

Lead and execute thermal modeling and simulations using industry-standard tools to optimize performance. * Conduct thorough thermal testing and validation to ensure designs meet rigorous operational ...

NextHop AI

Thermal Engineer

Santa Clara, CA · On-site

Lead and execute thermal modeling and simulations using industry-standard tools to optimize performance. * Conduct thorough thermal testing and validation to ensure designs meet rigorous operational ...

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Showing results 21-40

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Thermal Modeling information

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$43.5K

$104.5K

$167.5K

How much do thermal modeling jobs pay per year?

As of Sep 10, 2026, the average yearly pay for thermal modeling in the United States is $104,528.00, according to ZipRecruiter salary data. Most workers in this role earn between $80,000.00 and $129,000.00 per year, depending on experience, location, and employer.

What is thermal modeling?

Thermal modeling is the process of simulating and analyzing the heat transfer and temperature distribution within physical systems, such as electronic devices, buildings, or mechanical components. It helps engineers and designers predict how heat will flow and accumulate, which is essential for ensuring safety, efficiency, and optimal performance. Thermal models can be created using specialized software and are crucial in industries like electronics, automotive, aerospace, and construction.

What are common challenges faced by professionals working in thermal modeling, and how can they be addressed?

Professionals in thermal modeling often encounter challenges such as accurately simulating complex thermal systems, dealing with limited or incomplete material data, and keeping up with evolving software tools. Addressing these challenges requires strong analytical skills, attention to detail, and continuous learning. Collaborating closely with multidisciplinary teams—such as mechanical engineers, material scientists, and simulation software experts—can help ensure accurate results and innovative solutions. Additionally, staying updated on the latest modeling techniques and validation methods can greatly improve project outcomes.

What are the key skills and qualifications needed to thrive as a thermal modeling engineer, and why are they important?

To thrive as a Thermal Modeling Engineer, you need a strong background in thermodynamics, heat transfer, and computational modeling, often supported by a degree in mechanical or aerospace engineering. Expertise with simulation tools like ANSYS, COMSOL, or MATLAB, as well as knowledge of CAD software, is typically required. Analytical thinking, problem-solving, and effective communication are vital soft skills for translating complex data into actionable insights and collaborating with multidisciplinary teams. These abilities are crucial for optimizing system performance, ensuring reliability, and driving innovation in thermal management solutions.

What is the difference between Thermal Modeling vs Mechanical Design Engineer?

AspectThermal ModelingMechanical Design Engineer
Required credentialsEngineering degree, thermal analysis certificationsEngineering degree, mechanical design certifications
Work environmentDesign labs, simulation software, R&DManufacturing, product development, prototyping
Industry usageElectronics, HVAC, aerospaceAutomotive, consumer products, machinery

Thermal Modeling focuses on analyzing and predicting heat transfer and temperature distribution using simulations, while Mechanical Design Engineering involves creating physical product designs and components. Both roles require engineering knowledge but differ in their primary focus and tools used.

What other helpful pages are available for Thermal Modeling?

Other pages related to Thermal Modeling:

Infographic showing various Thermal Modeling job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 87% Full Time, 10% Part Time, and 2% Contract. Highlights an 81% Physical, 4% Hybrid, and 15% Remote job distribution, with an average salary of $104,528 per year, or $50.3 per hour.

Thermal Simulation Engineer

Palo Alto, CA • On-site

Cspeed
See more jobs at Cspeedexternal

Full-time

Re-posted 7 days ago

Job description

Cspeed IO is a stealth start up backed by Sutter Hill Ventures and Atreides Capital - headquartered in Palo Alto, CA. Our executive team has a demonstrated track record of building and scaling category-defining semiconductor and infrastructure businesses at companies like Broadcom, Lumentum, Tesla, Apple, Samsung, Intel, and VMware.
Cspeed IO is developing next-generation optical semiconductor solutions for the AI infrastructure market, focused on enabling true "scale-up" architectures. Our mission is to replace traditional copper interconnects with advanced fiber-optic technologies that overcome the limitations of existing optics solutions and architectures.
The Role
This position owns thermal modeling for CspeedIO optical engines, from die-level power maps through cooling boundary conditions, and the correlation of those models against measured hardware.
Thermal design here is a functional requirement rather than a reliability margin. Photonic device behavior is temperature-dependent, so wavelength and channel-to-channel uniformity shift with the temperature field across the photonic IC. The assembly also contains a small-footprint, high-flux die whose temperature must be held within a narrow window, and the engine operates adjacent to a host ASIC whose dissipation we do not control. The deliverable is a defensible temperature field, not a junction temperature.
Responsibilities
Thermal modeling and architecture
  • Build and maintain thermal models of the optical engine spanning die, package, interface materials, lid, and cold plate, for air- and liquid-cooled configurations.
  • Establish the cooling boundary condition methodology and its validity limits, and quantify thermal crosstalk from adjacent high-power devices.
  • Resolve the temperature field across the photonic IC to the resolution photonic design requires, and own the resulting gradient and uniformity specifications.

Materials and interfaces
  • Define the heat extraction path for high-flux die within the assembly, die attach, and thermal interface material selection where footprint and power density are constraining.
  • Quantify the sensitivity of engine temperature to material property tolerance and assembly variation.

Correlation and design influence
  • Define the thermal characterization plan and lead simulation-to-hardware correlation to a stated and tracked accuracy tolerance.
  • Provide thermal requirements and constraints to package layout, photonic design, and electrical design during architecture definition rather than after freeze.
  • Generate reduced-order thermal models for system integrators and customers, and engage cold plate, heat sink, and thermal material suppliers.
Required Qualifications
  • MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, or equivalent practical background.
  • 6+ years of thermal simulation for semiconductor packages or electronic systems, including one product carried from architecture through hardware correlation.
  • Expert proficiency in a commercial thermal or CFD tool for electronics: Ansys Icepak or Fluent, Simcenter Flotherm, Cadence Celsius, or equivalent.
  • Command of heat transfer fundamentals sufficient to defend a model rather than only to run one.
  • Demonstrated correlation of thermal simulation against measured hardware, with methodology revised on that basis.
Preferred Qualifications
  • Silicon photonics or optoelectronic thermal work, particularly thermo-optic sensitivity and wavelength stability.
  • Thermal design for small-footprint, high-flux die.
  • Direct-to-chip liquid cooling and cold plate design or specification.
  • 5D/3D package thermal modeling, and coupled electrothermal or thermal-structural workflows.
  • First-generation product experience where the thermal methodology had to be established rather than inherited.
Scope and Impact
The temperature field this position defines sets the operating envelope for the photonic IC and the thermally critical die around it, and therefore constrains link budget, tuning power, and achievable channel density. The methodology does not currently exist in a documented, correlated form.

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