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Synopsys Inc Jobs in Raleigh, NC (NOW HIRING)

NCSU

CLAWS III-N RF Integration Engineer

Raleigh, NC · On-site

... Inc. This collaborative effort will propel the development of semiconductors crucial for national ... Utilize TCAD simulation (e.g., Synopsys, Silvaco, etc.) for process and device modeling, electrical ...

NCSU

CLAWS III-N Power Integration Engineer

Raleigh, NC

$101K - $136K/yr

... Inc. This collaborative effort will propel the development of semiconductors crucial for national ... Utilize TCAD simulation (e.g., Synopsys, Silvaco, etc.) for process and device modeling, electrical ...

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Synopsys Inc information

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How much do synopsys inc jobs pay per hour?

As of Aug 6, 2026, the average hourly pay for synopsys inc in Raleigh, NC is $60.85, according to ZipRecruiter salary data. Most workers in this role earn between $42.55 and $81.30 per hour, depending on experience, location, and employer.

What does Synopsys Inc do?

Synopsys Inc is a leading company specializing in electronic design automation (EDA) and semiconductor intellectual property (IP). They provide software, tools, and services that help engineers design and test integrated circuits, commonly used in chips and electronic systems. Synopsys also offers solutions for software security, quality, and silicon design, enabling innovation in areas like artificial intelligence, automotive, and IoT. Their products are widely used by semiconductor companies to accelerate product development and ensure high-quality, secure designs.

What are some common challenges faced by engineers working at Synopsys Inc and how can new hires prepare for them?

Engineers at Synopsys Inc. often work on highly complex electronic design automation (EDA) tools and semiconductor IP solutions, which can involve steep learning curves and rapidly evolving technologies. New hires may initially find it challenging to adapt to the pace of innovation and the need for deep domain expertise, especially when collaborating with cross-functional teams on large-scale projects. To prepare, candidates should be proactive in seeking mentorship, engage in continuous learning, and stay up to date with industry trends. Embracing a collaborative mindset and leveraging Synopsys’s internal resources can help new hires integrate more smoothly and contribute effectively to project goals.

What are the key skills and qualifications needed to thrive as an employee at Synopsys Inc?

To thrive at Synopsys Inc., strong expertise in electronic design automation (EDA), semiconductor engineering, and a relevant degree in electrical engineering or computer science are essential. Familiarity with industry-standard tools like Verilog, VHDL, and Synopsys design software, along with certifications in chip design or verification, is highly valued. Critical thinking, problem-solving, and effective collaboration are standout soft skills for this innovative and fast-paced environment. These abilities ensure effective development of advanced technology solutions and foster teamwork necessary to drive product success.
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Synopsys Inc jobs near you
Infographic showing various Synopsys Inc job openings in Raleigh, NC as of July 2026, with employment types broken down into 1% As Needed, 78% Full Time, 16% Part Time, and 5% Contract. Highlights an 94% Physical, 1% Hybrid, and 5% Remote job distribution, with an average salary of $126,552 per year, or $60.8 per hour.

Applications Engineer- SiC in Advanced Packaging (AI/HPC Data Centers)

Wolfspeed, Inc.

Durham, NC • On-site

Full-time

Posted 14 days ago

Wolfspeed rating

6.1

Company rating: 6.1 out of 10

Based on 15 frontline employees who took The Breakroom Quiz

Job description

As an Applications Engineer for Advanced Packaging, you will provide pre- and post-sales technical support to customers integrating Wolfspeed SiC substrates into 2.5D and 3D packaging architectures for high-performance computing (HPC) and AI data center applications. Building on Wolfspeed's 35+ years of SiC materials leadership and an established portfolio of proven use cases, you will act as the technical bridge between our materials expertise and the customer's package design - showing customers exactly where and why SiC delivers value across heat spreaders and carriers, passive and active interposers, and package substrates. Beyond supporting today's use cases, you are expected to generate your own ideas for new SiC applications and to engage closely with partners, customers, and foundries to co-design next-generation architectures. With a defined product roadmap and active foundry, OSAT, and hyperscaler engagements already underway, you will guide customers with authority through use-case identification, material selection, design validation, and qualification. The ideal candidate brings a strong technical foundation in semiconductor packaging, thermal simulation, and process integration.
Key responsibilities:
  • Guide customer packaging engineers, foundries, and OSATs in selecting the optimal SiC use case (heat spreader, carrier, passive/active interposer, or package substrate) and incorporating Wolfspeed SiC wafers and substrates into advanced packaging architectures (2.5D/3D heterogeneous integration, CoWoS-style platforms). Provide remote and on-site technical support.
  • Proactively identify and propose new SiC use cases, and partner closely with customers, foundries, OSATs, and ecosystem players to co-design novel packaging architectures that extend SiC beyond today's applications.
  • Lead the design, development, and documentation of reference demonstrations for SiC interposer, heat-spreader, and substrate applications, including thermal performance benchmarks that quantify SiC's operating-temperature, hot-spot, and thermal-cross-talk advantages over silicon, glass, and ceramic.
  • Supply customers with validated SiC material characteristics - including anisotropic/directional thermal conductivity and bond-interface data - to drive accurate package-level thermal modeling.
  • Develop and present technical materials at packaging industry conferences and tradeshows and ecosystem partner workshops.
  • Support new product and PDK launches, including training for Wolfspeed sales teams, foundry partners, and EDA ecosystem players (e.g., Cadence, Synopsys) on SiC design rules, process windows, and integration guidelines.
  • Provide product managers with consolidated customer requirements and use-case prioritization to define new SiC packaging products, interposer specifications, and PDK enhancements.

Qualifications:
  • Bachelor's Degree in Electrical Engineering, Materials Science, or equivalent with relevant experience.
  • Deep industry know-how- an insider's understanding of how hyperscalers, foundries, and OSATs specify advanced packages, and the ability to translate their thermal, power-density, warpage, cost, and reliability requirements into SiC material and product specifications.
  • Understanding of advanced packaging architectures including 2.5D/3D integration, interposer structures, TSV/TSiCV fabrication, and chiplet design.
  • Experience with thermal simulation tools (e.g., ANSYS Icepak, FloTHERM) for package-level thermal analysis; ability to model and communicate SiC's thermal advantages in high-power-density scenarios (AI chips approaching 250+ W/cm² by 2030).
  • Familiarity with packaging process flows: wafer thinning, via etching (RIE), metallization, micro-bump/hybrid bonding, and CTE mismatch considerations for SiC integration.
  • Experience with EDA or simulation environments relevant to packaging (e.g., Cadence Sigrity, Synopsys) is a plus.
  • Strong oral and written communication and presentation skills.

The ideal candidate will be located at our headquarter in Durham, North Carolina.
We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.

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