Soc Physical Design Engineer information
See Colorado salary details
$99.9K - $104.3K
0% of jobs
$104.3K - $108.8K
0% of jobs
$108.8K - $113.2K
0% of jobs
$113.2K - $117.7K
0% of jobs
$117.7K - $122.1K
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$122.1K - $126.6K
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$126.6K - $131K
0% of jobs
$131K - $135.5K
0% of jobs
$135.5K - $139.9K
1% of jobs
$142.4K is the 25th percentile. Wages below this are outliers.
$139.9K - $144.3K
43% of jobs
The median wage is $144.8K / yr.
$144.3K - $148.8K
56% of jobs
How much do soc physical design engineer jobs pay per year?
As of Sep 6, 2026, the average yearly pay for soc physical design engineer in Colorado is $146,590.00, according to ZipRecruiter salary data. Most workers in this role earn between $143,000.00 and $147,200.00 per year, depending on experience, location, and employer.
SoC Physical Design Engineers are professionals who specialize in the layout and implementation of System-on-Chip (SoC) designs at the physical level. They are responsible for translating logical circuit designs into physical layouts that can be manufactured on silicon chips. Their tasks include floorplanning, placement, routing, timing analysis, and ensuring design for manufacturability. These engineers work closely with other teams to optimize power, performance, and area (PPA) while meeting strict technical specifications.
To thrive as a SoC Physical Design Engineer, you need a solid background in electrical engineering, digital logic design, and ASIC/FPGA development, usually supported by a relevant degree. Proficiency with EDA tools such as Cadence, Synopsys, and Mentor Graphics, as well as understanding of scripting languages like TCL and Perl, is typically required. Attention to detail, problem-solving skills, and effective teamwork are crucial soft skills for excelling in this role. These competencies ensure precise, efficient chip layouts that meet performance, power, and area targets in complex semiconductor projects.
SoC Physical Design Engineers often encounter challenges such as meeting tight timing closure, managing power consumption, and resolving congestion during the tape-out phase. These issues require close collaboration with verification, synthesis, and DFT teams to iteratively optimize the physical layout and ensure all design constraints are satisfied. Effective use of EDA tools, proactive communication, and attention to detail are essential to address last-minute design rule violations and to deliver a high-quality, manufacturable chip on schedule.
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