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Senior Wafer Fab Process Engineer Jobs (NOW HIRING)

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The wafer fab process engineer will collaborate with product R&D teams to make decisions on process quality based on data and statistical analysis. Duties and Responsibilities * Develop fundamental ...

Execute wafer fab processes with precision, adhering to all specifications and documented procedures. * Collaborate effectively with Production and Wafer Fab Engineering Teams to resolve production ...

Execute wafer fab processes with precision, adhering to all specifications and documented procedures. * Collaborate effectively with Production and Wafer Fab Engineering Teams to resolve production ...

Execute wafer fab processes with precision, adhering to all specifications and documented procedures. * Collaborate effectively with Production and Wafer Fab Engineering Teams to resolve production ...

Execute wafer fab processes with precision, adhering to all specifications and documented procedures. * Collaborate effectively with Production and Wafer Fab Engineering Teams to resolve production ...

You will collaborate closely with engineers, production teams, and fellow operators to ensure ... Execute wafer fab processes with precision, adhering to established protocols and standards.

You will collaborate closely with engineers, production teams, and fellow operators to ensure ... Execute wafer fab processes with precision, adhering to established protocols and standards.

You will collaborate closely with engineers, production teams, and fellow operators to ensure ... Execute wafer fab processes with precision, adhering to established protocols and standards.

Semiconductor Wafer Fab * Photolithography, Wet Etch, Dry Etch, Plating, Lapping, Polishing ... Interact with engineering for process training and execution of non-standard work instructions on ...

Semiconductor Wafer Fab * Photolithography, Wet Etch, Dry Etch, Plating, Lapping, Polishing ... Interact with engineering for process training and execution of non-standard work instructions on ...

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Senior Wafer Fab Process Engineer information

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$75K

$121.1K

$170.5K

How much do senior wafer fab process engineer jobs pay per year?

As of Jun 9, 2026, the average yearly pay for senior wafer fab process engineer in the United States is $121,116.00, according to ZipRecruiter salary data. Most workers in this role earn between $104,000.00 and $134,500.00 per year, depending on experience, location, and employer.

What is the difference between Senior Wafer Fab Process Engineer vs Process Integration Engineer?

AspectSenior Wafer Fab Process EngineerProcess Integration Engineer
Primary FocusDeveloping and optimizing fabrication processes for semiconductor wafersIntegrating various process steps to improve overall device performance
Required SkillsProcess engineering, equipment operation, troubleshootingProcess development, cross-disciplinary collaboration, data analysis
Work EnvironmentCleanroom manufacturing facilities, wafer fabsDesign labs, R&D centers, manufacturing settings
Common CertificationsSEMICON process certifications, engineering degreesSimilar certifications, often with additional focus on device physics

The Senior Wafer Fab Process Engineer primarily focuses on developing and refining manufacturing processes within the wafer fabrication environment. In contrast, the Process Integration Engineer concentrates on integrating various process steps to enhance device performance. While both roles require strong process engineering skills and industry certifications, their day-to-day tasks and work environments differ, with the former more manufacturing-oriented and the latter more R&D-focused.

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What cities are hiring for Senior Wafer Fab Process Engineer jobs? Cities with the most Senior Wafer Fab Process Engineer job openings:
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MEMS Process Engineer

MEMS Process Engineer

RLA Engineering LLC

Corvallis, OR • On-site

Full-time

Medical, Dental, Vision, Life, Retirement, PTO

Posted 12 days ago

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Job description

Position Summary

This position is responsible for supporting various wafer bonding processes (microbond WC) for the high-volume fabrication of MEMS (silicon wafer). The candidate will use their understanding of fabrication processes and product development methodologies to achieve the yield goals of assigned toolset/process step(s). The wafer fab process engineer will collaborate with product R&D teams to make decisions on process quality based on data and statistical analysis.

Duties and Responsibilities

  • Develop fundamental understanding of assigned fabrication processes and product development methodologies against target yields
  • Determine wafer surface preparation and pre-bond cleaning requirements (plasma, wet cleans, dehydration bakes) to achieve high bond strength and low defectivity
  • Confirm bond alignment, bond tool operation, and post-bond thermal processing (bakes/cures) to ensure mechanical integrity and yield
  • Collaborate with:

· Other process and tooling engineers to execute process characterization, optimization, and margin studies including SPC, DOE, yield analysis, and defect reduction

·Equipment engineering, integration, and quality teams to drive process stability and continuous improvement

  • Contribute to FA by troubleshooting bond-related excursions such as delamination, voiding, particle-driven defects, and thickness non-uniformity
  • Support NPI, process transfer, and documentation (work instructions, process flows, FMEA, and control plans)
  • Occasionally work 40+ hours in a week to meet certain team milestones
  • Perform other duties as needed

Education and Credential Requirements

  • Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field
  • Due to project scope - US Citizenship is a requirement to be eligible for this role. Eligible to work in the US without RLA sponsorship for employment visa status

Experience Requirements

  • 3-5 years of experience in a wafer bonding process engineer role
  • Wafer bonding processes supporting volume manufacturing and R&D environments
  • Wafer-to-wafer and wafer-to-carrier bonding (e.g., direct bond, adhesive bond, oxide bond, plasma/anodic bond) used in MEMS and advanced device integration
  • Familiar with IR inspection, metrology, and cross-section analysis to evaluate bond voids, alignment accuracy, and interface quality
  • Use of Quality Systems, Statistical Process Control, Design of Experiments, and basic statistical data analysis on tooling design, process development, and improvements
  • Preferred experience:

· Worked on MEMS products

· Collaboration with Mechanical Tooling and Process Engineers on designing custom jigs/fixtures for wafer handling

Skills Requirements

  • Ability to read, write, and speak English proficiently
  • High proficiency using productivity software such as M365 (Word, Outlook, Excel, PowerPoint, Visio, Teams and SharePoint)
  • Ability to use agile/scrum project/program management principles and methodologies to consistently meet task deadlines, triage changing priorities, and track issues to resolution
  • Ability to collaborate across diverse teams with a customer service mindset

Work Environment

  • The position typically operates in a standard office environment and/or from employee’s home
  • Be able to lift and/or move up to 25 pounds

Company Description

Founded in 2010 and based in Vancouver, WA, RLA Engineering is a premier engineering design firm. We partner with clients from start-ups to industry leaders across the U.S. to help bring great products to life. From concept to prototype, we provide test & measurement and product design solutions powered by deep technical expertise.