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Semiconductor Tpm Program Manager Jobs (NOW HIRING)

$116K - $159K/yr

... generation semiconductor chips. Join us and push the boundaries of materials science and ... Technical Program Manager (TPM) - this is an individual contributor role Location: Austin, TX or ...

$116K - $159K/yr

... generation semiconductor chips. Join us and push the boundaries of materials science and ... Technical Program Manager (TPM) - this is an individual contributor role Location: Austin, TX or ...

... generation semiconductor chips. Join us and push the boundaries of materials science and ... Technical Program Manager (TPM) - this is an individual contributor role Location: Austin, TX or ...

Being a TPM at Meta means driving impact by delivering measurable results across a wide range of ... Familiar with semiconductor technology and manufacturing processes * Experience with data center ...

Meta is seeking a Technical Program Manager (TPM) to lead complex programs for our silicon ... with semiconductor manufacturing processes and foundry relationships • Experience managing ...

The Meta Product Technical Program Management (TPM) community is pioneering technologies to bring ... with semiconductor technology and manufacturing processes • Experience with data center ...

This Technical Program Manager (TPM) will lead cross-functional and multi-site teams on delivering ... Familiar with semiconductor technology and manufacturing processes * Excellent interpersonal skills ...

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Semiconductor Tpm Program Manager information

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$38.5K

$107.5K

$157K

How much do semiconductor tpm program manager jobs pay per year?

As of Sep 11, 2026, the average yearly pay for semiconductor tpm program manager in the United States is $107,460.00, according to ZipRecruiter salary data. Most workers in this role earn between $79,500.00 and $132,500.00 per year, depending on experience, location, and employer.

What does a semiconductor TPM program manager do?

A Semiconductor TPM (Technical Program Manager) oversees and coordinates complex semiconductor projects from concept to production. They bridge the gap between engineering, manufacturing, and business teams to ensure projects are delivered on time and meet technical requirements. Their responsibilities include setting project timelines, managing risks, aligning stakeholders, and resolving technical issues. TPMs play a critical role in semiconductor companies by ensuring smooth cross-functional collaboration and successful product launches.

How does a semiconductor TPM program manager typically collaborate with cross-functional teams during product development?

A Semiconductor TPM (Technical Program Manager) Program Manager acts as a central point of coordination between engineering, product, manufacturing, and supply chain teams. They facilitate regular meetings, ensure alignment on project goals, and proactively resolve roadblocks that could impact timelines. Effective communication and stakeholder management are crucial, as the TPM must balance technical requirements with business objectives and keep all teams updated on progress and changes. This collaborative approach ensures that complex semiconductor projects stay on track and meet quality, cost, and delivery targets.

What are the key skills and qualifications needed to thrive as a semiconductor TPM program manager, and why are they important?

To thrive as a Semiconductor TPM Program Manager, you need expertise in semiconductor manufacturing processes, project management, and a relevant engineering or technical degree. Familiarity with project management tools (like Jira or MS Project), process control systems, and certifications such as PMP or Six Sigma is typically required. Excellent leadership, communication, and cross-functional collaboration skills help drive complex projects and resolve issues efficiently. These abilities are critical for delivering projects on time, maintaining product quality, and ensuring seamless coordination in a highly technical, fast-paced industry.

What is the difference between Semiconductor Tpm Program Manager vs Semiconductor Manufacturing Engineer?

AspectSemiconductor Tpm Program ManagerSemiconductor Manufacturing Engineer
CredentialsBachelor's in Engineering, PMP or similar certifications often preferredBachelor's or Master's in Electrical, Mechanical, or Chemical Engineering
Work EnvironmentProject management offices, cross-functional teams, manufacturing facilitiesManufacturing floors, R&D labs, process development areas
Industry UsageUsed across semiconductor companies to oversee projects and programsFocuses on process optimization, equipment, and production efficiency

The Semiconductor Tpm Program Manager primarily manages projects and programs related to manufacturing processes, ensuring timely delivery and cross-team coordination. In contrast, the Semiconductor Manufacturing Engineer focuses on developing and improving manufacturing processes and equipment. Both roles are vital in semiconductor production but differ in scope and daily responsibilities.

What are popular job titles related to Semiconductor Tpm Program Manager jobs?

For Semiconductor Tpm Program Manager jobs, the most frequently searched job titles are:

Infographic showing various Semiconductor Tpm Program Manager job openings in the United States as of September 2026, with employment types broken down into 1% Internship, 1% As Needed, 74% Full Time, 20% Part Time, and 4% Contract. Highlights an 94% Physical, 1% Hybrid, and 5% Remote job distribution, with an average salary of $107,460 per year, or $51.7 per hour.

IC packaging Technical Program Manager

Santa Clara, CA • On-site

$150K - $194K/yr

Other

Posted 26 days ago


Key responsibilities

  • Coordinate and manage all customer project activities, including risk analysis, planning, and milestone delivery.

  • Manage and resolve customer quality events by collaborating with factory teams such as RnD, NPI, SCM, and sales.

  • Coordinate customer visits and audits to the factory.


Job description

About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Responsibilities


Senior Technical Program Manager will support the VP of field application engineering. The TPM manager must have hands-on experience in semiconductor packaging technologies with a focus on flip chip, bumping, and wafer level packaging and their applications. Must be familiar with all phases of IC packaging processes and equipment. The TPM will coordinate with the factory RnD, NPI, SCM, and Production teams to ensure successful execution of customers’ projects and programs. Requires excellent verbal and written communication skills. Good interpersonal skills are essential.


Responsibilities: Will include the following, other duties may be assigned:

  1. Coordinate and manage all customer project related activities, including initiating the risk analysis and mitigation actions, establishing plans and key milestones for the customer projects and delivering the objectives on time.
  2. Manage and resolve customer quality events through closely collaborating with factory teams including RnD, NPI, SCM, and sales account managers.
  3. Coordinate customer visits and audit to the factory
  4. Establish technical credibility, building trust and strong relationships with the customers to ensure quick problem solving above and beyond customer expectations.


Essential Attributes


Qualifications

  1. Bachelor’s degree in engineering or related fields.
  2. Minimum of 10+ years of semiconductor manufacturing experience in assembly and test with in-depth understanding of the IC assembly and test processes, focusing on flip chip assembly and wafer level technologies. Knowledge on wire bond process is a plus.
  3. Experience in working with customers and stakeholders to resolve technical issues to support the business success.
  4. Strong verbal and written communication skills in English are essential along with interpersonal communications skills. Must be a team player with good organizational, computer and project management skills.
  5. Be a quick learner, a good listener, like a fast pace and matrix organization, able to follow instructions and work independently


Desired Experience Level

  1. MS with 5 years or PhD degree with 3 years of experience
  2. Working experience with a major OSAT for three years or more