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Semiconductor Plating Engineer Jobs (NOW HIRING)

Airbus Ventures

Chemical Process Engineer

Tempe, AZ · On-site

As a Chemical Process Engineer , you will support and develop electroplating and wet chemical ... metal plating processes. * Experience supporting semiconductor, photovoltaic, PCB, advanced ...

Industrious Ventures

As a Chemical Process Engineer , you will support and develop electroplating and wet chemical ... metal plating processes. * Experience supporting semiconductor, photovoltaic, PCB, advanced ...

Northrop Grumman Corp. (JP)

NY · On-site

... less plating, and solder-sphere transfer to support flip chips, 2.5D, and 3D packaging. The Semiconductor Equipment Engineer will lead and manage engineering projects such as equipment layout ...

Lam Research

Mechanical Engineer 4

Tualatin, OR · On-site

Wet Equipment and Technology Solutions is an exciting, rapidly evolving field as the semiconductor ... on plating performance. Our team partners closely with process engineering and customer account ...

Micron Technology, Inc

Wet Process Engineer

Boise, ID · On-site

... plating, and conventional bath and spin processes) * Good understanding of Agentic AI or ... Strong understanding of semiconductor fabrication processes and equipment * Excellent analytical ...

black.ai

Process Engineer (Metallization)

Tempe, AZ · On-site

$100K - $130K/yr

We are building a world‑class team where seasoned engineers and ambitious emerging talent ... Experience in semiconductor fabs (FEOL/BEOL plating, RDL, bumping) or OSAT environments

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Semiconductor Plating Engineer information

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$38K

$90.5K

$150.5K

How much do semiconductor plating engineer jobs pay per year?

As of Sep 10, 2026, the average yearly pay for semiconductor plating engineer in the United States is $90,538.00, according to ZipRecruiter salary data. Most workers in this role earn between $71,500.00 and $100,000.00 per year, depending on experience, location, and employer.

What are popular job titles related to Semiconductor Plating Engineer jobs?

For Semiconductor Plating Engineer jobs, the most frequently searched job titles are:

Infographic showing various Semiconductor Plating Engineer job openings in the United States as of August 2026, with employment types broken down into 92% Full Time, 2% Part Time, and 6% Contract. Highlights an 87% Physical, 4% Hybrid, and 9% Remote job distribution, with an average salary of $90,538 per year, or $43.5 per hour.

Field Service Engineer for Semiconductor Packaging Equipment

Santa Clara, CA • On-site

PacTech Packaging Technologies GmbH
See more jobs at PacTech Packaging Technologies GmbHexternal

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Posted 22 days ago

Job description

Position location: Remote or Hybrid

PacTech is a technology‑focused company specializing in advanced packaging equipment manufacturing and wafer‑level services. Since our inception, our teams have been working relentlessly to develop new leading‑edge technologies for next‑generation applications. We are known for being highly adaptive to customization and unique applications. PacTech has been serving the semiconductor industry by providing wafer plating, soldering, and die‑sort subcontractor processing since 1995. Our headquarters are located in Nauen, Germany, with two operation and manufacturing sites in Santa Clara, CA, USA and Penang, Malaysia. To support our expanding equipment install base in the U.S., we seek additional Field Service Engineers to join our dynamic, technology‑driven company.

Summary of Responsibilities

Field Service Engineers (FSE) play a crucial role in delivering exceptional onsite customer service and support at our customer facilities. Responsibilities include proficiently handling equipment installations, upgrades, repairs, and conducting preventive maintenance on sophisticated semiconductor packaging equipment. By collaborating closely with customers, FSEs ensure that PacTech equipment operates at the best possible performance levels.

Job Description
  • Basic troubleshooting, installation, maintenance and repair on designated equipment.
  • Supporting customer applications and equipment process optimization.
  • Completing preventive maintenance and field modifications and upgrades.
  • Ordering and coordinating replacement parts.
  • Keeping up‑to‑date on administrative responsibilities such as maintaining customer service logs and internal service records and reports.
  • Maintaining daily communications with customers to ensure resolution and proper follow‑up.
  • Maintaining tools and test equipment and ensuring they are properly calibrated.
  • Meeting all applicable regulatory requirements (Health and Human Services, Environmental Health and Safety, etc.).
  • Utilizing the escalation process to resolve customer service delivery issues.
  • Traveling to customer locations within North America and occasionally to other international locations.
  • Working as a member of the local team to provide efficient service delivery to all accounts within the assigned area and, when necessary, globally to support headquarters.
  • Ability to lift and carry heavy toolboxes and machine parts that can weigh up to 15 lbs.
  • Adhering to current regulatory standards.
Job Responsibilities
  • Candidate must possess at least a Bachelor’s Degree in an Engineering or Science discipline with at least three years of working experience as a process or service engineer within the semiconductor industry.
  • Must be self‑motivated and able to demonstrate technical competence in electrical, mechanical, and pneumatic systems.
  • Familiar with concepts and documents such as FMEA, Control Plan, SPC, Work Instruction, etc.
  • Good presentation, excellent communication, and team‑working skills.
  • Having a “hands‑on” attitude and a creative problem‑solving mindset to get the work done quickly and effectively to meet customers’ schedules.
  • Applicants should be U.S. citizens or at a minimum U.S. permanent residents.
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