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Semiconductor Packaging Jobs in Texas (NOW HIRING)

Apple

Packaging Assembly Engineer

Austin, TX

$184K - $324K/yr

S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired. 5+ years of extensive experience in Semiconductor Packaging ...

Apple

Packaging Assembly Engineer

Austin, TX

$184K - $324K/yr

S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired. 5+ years of extensive experience in Semiconductor Packaging ...

Apple

IC Package Integration Lead

Austin, TX · On-site

Preferred Qualifications We are looking for someone with experience in Semiconductor Packaging Design, Process & Technology Development, Managerial skills highly desired. Good understanding of cross ...

Apple

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... and integration of advanced semiconductor packages across SoC, memory, RF, and cellular ...

Pied Piper

Semiconductor Chip Expert

Austin, TX · On-site

Competitive salary and benefits package * Opportunity to work with a talented and collaborative team * Chance to work on cutting-edge semiconductor technology * Opportunities for career growth and ...

Approach Venture LLC

Senior Process Engineer

Austin, TX · On-site

$140K - $180K/yr

Hands-on experience with semiconductor packaging, wafer processing, advanced assembly, precision manufacturing, or related technologies * Experience applying statistical process control, process ...

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Semiconductor Packaging information

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How much do semiconductor packaging jobs pay per hour?

As of Sep 2, 2026, the average hourly pay for semiconductor packaging in Texas is $17.56, according to ZipRecruiter salary data. Most workers in this role earn between $15.24 and $18.61 per hour, depending on experience, location, and employer.

What is semiconductor packaging?

Semiconductor packaging is the process of enclosing and protecting integrated circuits or chips so they can be safely handled, connected to circuit boards, and function reliably in electronic devices. The packaging provides physical protection, electrical connections, heat dissipation, and shields the chip from environmental factors such as moisture and contaminants. Advanced packaging techniques are crucial for improving device performance, reducing size, and enabling new applications like smartphones, computers, and automotive electronics.

What are the key skills and qualifications needed to thrive in semiconductor packaging, and why are they important?

To thrive in Semiconductor Packaging, you need a solid understanding of materials science, microelectronics, and process engineering, typically supported by a degree in engineering or a related field. Familiarity with CAD software, wire bonding machines, and industry standards such as IPC and JEDEC is essential. Strong problem-solving abilities, attention to detail, and teamwork are critical soft skills in this role. These skills ensure the reliable assembly and protection of semiconductor devices, directly impacting product performance and yield.

What are some of the common challenges faced in a semiconductor packaging role, and how can new hires effectively address them?

Professionals in semiconductor packaging often encounter challenges such as staying updated with rapidly evolving technologies, managing precision in the assembly process, and ensuring product reliability under tight deadlines. New hires can effectively address these by actively seeking mentorship from experienced colleagues, participating in ongoing training programs, and closely following standard operating procedures. Collaborating with cross-functional teams, such as design and quality assurance, also helps in gaining comprehensive insights and troubleshooting issues more efficiently.

What is the difference between Semiconductor Packaging vs Semiconductor Test Engineer?

AspectSemiconductor PackagingSemiconductor Test Engineer
Primary FocusDesigning and assembling packaging solutions for chipsTesting and validating semiconductor devices for performance
Required SkillsMaterials, mechanical design, manufacturing processesElectrical testing, data analysis, test equipment operation
Work EnvironmentManufacturing floors, R&D labsTesting labs, production lines
Common CertificationsNone specific, often engineering degrees

Semiconductor Packaging and Semiconductor Test Engineer roles both operate within the semiconductor industry but focus on different stages of product development. Packaging involves creating protective and functional enclosures for chips, while testing ensures the chips meet performance standards. Both roles require technical knowledge and often collaborate during product development.

Is it hard to get a job in semiconductor packaging?

Securing a job in semiconductor packaging can be competitive, but candidates with relevant technical skills, such as knowledge of cleanroom environments, soldering, and inspection tools, have good opportunities. Entry-level positions may require some training or certifications, but experience with industry-standard processes can improve job prospects.

What are the most commonly searched types of Semiconductor Packaging jobs in Texas?

The most popular types of Semiconductor Packaging jobs in Texas are:

What are popular job titles related to Semiconductor Packaging jobs in Texas?

For Semiconductor Packaging jobs in Texas, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging jobs in Texas look for?

The top searched job categories for Semiconductor Packaging jobs in Texas are:

What cities in Texas are hiring for Semiconductor Packaging jobs?

Cities in Texas with the most Semiconductor Packaging job openings:

Semiconductor Packaging jobs near you
Infographic showing various Semiconductor Packaging job openings in Texas as of August 2026, with employment types broken down into 82% Full Time, 13% Part Time, 1% Temporary, 2% Contract, and 2% Nights. Highlights an 95% Physical, 1% Hybrid, and 4% Remote job distribution, with an average salary of $36,519 per year, or $17.6 per hour.

Package Thermal & Mechanical Simulation Engineer

NXP Semiconductors

Austin, TX • Hybrid

Full-time

Re-posted 5 days ago

Job description

The future starts here! Are you ready to join NXP in Package Innovation?

The Package Innovation organization is responsible for the design of new packaging concepts and the development of new packaging technologies and assembly processes. It partners with all of the businesses of NXP Semiconductors to deliver the right package for each market and application.

Package Innovation is a multi-national organization. Development in our case means working together in teams with business lines, internal factories and subcontractors and suppliers across the globe.

The Package Innovation Mechanical & Thermal Modelling team uses Finite Element and Finite Volume simulation methodologies. They are used to shorten development cycles and deliver optimized design solutions for semiconductor packages. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains along with complex 3-D structures containing many non-linearities.

To reinforce our modeling and simulation team, we are looking for a mechanical engineer, located in Austin TX, USA. Your role is to develop simulation models of semiconductor components and assemblies, predict mechanical reliability, help identify technology limits and optimize packaging solutions aiming at a first-time right product qualification. A second key focus area will be to analyze the thermal performance of package concepts and technologies in modelized and actual applications.

Your responsibilities

  • Be a part of the on-site Package Innovation simulation team at NXP Austin and collaboratively solve engineering questions for package development projects.
  • Collaborate with product development teams and package project leads in support of risk mitigation and design optimization.
  • Support problem-solving of package related issues during lifetime testing.
  • Analyze thermal performance of products.

Your team

The modelling team's responsibility is to support new product and technology developments with thermal and mechanical modelling. When unexpected results are found during testing the simulation team helps with root cause finding and deriving potential solutions. The team has a global presence but also has several other members on site in Austin. The team reports into the Package Core Technologies department within Package innovation and will interface with several other internal departments, including all the business lines.

Your profile

To be successful in this role you have:

  • A Master or Ph.D. degree qualified in Mechanical Engineering or equivalent is required
  • Experience with Finite Element Modelling, preferably with Ansys or Marc Mentat
  • Fluent in English
  • Understanding of semiconductor packaging technologies is preferred.
  • Willingness to be present on site for at least 3 days/week

Furthermore, you are:

  • An excellent communicator, teamplayer, influencer and networker.
  • A self-starter with initiative, flexibility and command skills.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

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