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How much do semiconductor packaging sales jobs pay per year?

As of Sep 13, 2026, the average yearly pay for semiconductor packaging sales in the United States is $76,119.00, according to ZipRecruiter salary data. Most workers in this role earn between $57,500.00 and $103,000.00 per year, depending on experience, location, and employer.

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Infographic showing various Semiconductor Packaging Sales job openings in the United States as of July 2026, with employment types broken down into 84% Full Time, 12% Part Time, 2% Contract, and 2% Nights. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution, with an average salary of $76,119 per year, or $36.6 per hour.

Principal Application Engineer - semiconductor packaging

Irvine, CA • On-site

Intermedia Group Inc.
See more jobs at Intermedia Group Inc.external

$130K - $155K/yr

Other

Posted 3 days ago

New

Job description

Principal Application Engineer – semiconductor packaging
  • Irvine, CA
  • $130,000 to $155,000

OPEN JOB: Principal Application Engineer – semiconductor packaging

LOCATION:Irvine, California
***Relocation Assistance Available

INDUSTRY:Manufacturing & Production

BASE SALARY: $130,000 to $155,000

This position is with our client’s Adhesive Technologies business unit (adhesives, sealants and functional coatings)

What you´ll do
  • Develop and evaluate KPI results and drive innovation and continuous improvement via data driven decisions and actions
  • Leverage semiconductor knowledge in advanced packaging e.g. 2.5D, HBM, CoWoS technical requirement and trend to accelerate material testing and test vehicle development
  • Primary technical interface to leading edge clients, addressing and resolving issues related to product implementation, functionality, or performance
  • Responsible for application functions and tasks to sales, marketing, PD and other business units
  • Manage a small (2-4) Application Engineering team to achieve project deliverables
Requirements:
  • Bachelor’s degree in Materials Science, Chemical Engineering, Mechanical Engineering, or related field
  • 12 years of experience in semiconductor packaging or processes with people manager experience
  • Solid understanding of current and emerging packaging trends, including 2.5D and 3D packaging
  • Proven ability to work independently and lead technical discussions with customers
  • Strong communication skills with a customer-focused, ownership-driven mindset
  • Effective project and time management skills, with a consistent focus on quality and delivery
  • Willingness to travel up to 10%
  • Ability to take meetings with our APAC team during off-hours
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