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Semiconductor Package Assembly Engineer Jobs (NOW HIRING)

Micross Company

NY · On-site

$134K/yr

Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...

Micross

Package Design Engineer | Semiconductor

Apopka, FL · On-site

$119K/yr

Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility . Essential Duties and Responsibilities: * The primarily responsible for ...

Micron

Senior/Staff/Principal Package Design Engineer

Boise, ID · On-site

$119K - $164K/yr

... OSAT assembly partners, substrate suppliers, and Technology Development teams to define design ... As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and ...

Navitas Semiconductor

... all Navitas products per assembly location * Prepares bond shell for all new packages being ... Familiar with semiconductor package design rules.

Intel Corporation

$89K - $170K/yr

As a Process Integration and Yield Engineer at Intel, you will play a pivotal role in driving ... Semiconductor experience, Manufacturing experience, Advance assembly packaging experience.

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How much do semiconductor package assembly engineer jobs pay per hour?

As of Sep 11, 2026, the average hourly pay for semiconductor package assembly engineer in the United States is $38.44, according to ZipRecruiter salary data. Most workers in this role earn between $35.58 and $41.35 per hour, depending on experience, location, and employer.

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For Semiconductor Package Assembly Engineer jobs, the most frequently searched job titles are:

Infographic showing various Semiconductor Package Assembly Engineer job openings in the United States as of June 2026, with employment types broken down into 1% Locum Tenens, 87% Full Time, 1% Part Time, 3% Temporary, and 8% Contract. Highlights an 98% Physical, 1% Hybrid, and 1% Remote job distribution, with an average salary of $79,949 per year, or $38.4 per hour.

Package Design Engineer | Semiconductor

NY • On-site

Micross Company
Semiconductor and Electronic Component Manufacturing • 51 - 200 employees
Learn more about Micross Companyexternal

$134K/yr

Other

Medical, Dental, Vision, Life, Retirement, PTO

Posted 9 days ago

Job description

If you are unable to complete this application due to a disability, contact this employer to ask for an accommodation or an alternative application process.

Full Time- ISV Professional Apopka, FL, US

30+ days ago Requisition ID: 1653

Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility.

Essential Duties and Responsibilities:
  • The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization
  • Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates
  • Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up
  • Work with IC design team to define IC package requirements
  • Design package layout using standard CAD tools
  • Extract package parasitics and conduct PI/SI analysis
  • Documentation and release in appropriate archival system
Preferred Knowledge, Skills, And Abilities Layout:
  • Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.
Analysis:
  • Sigrity Advanced SI II: Analysis tools for Signal integrity of parallel busses (DDRx) and serial links (PCIe Gen x), including Package and PCB effects
  • Sigrity Advanced PI II: Power Integrity tools (IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects
RF / Microwave Design
  • AWR, Momentum and HFSS Software Circuit, system, and EM simulation for RF/microwave product development
Qualifications
  • Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline.
  • 8 to 10 years of experience in semiconductor packaging design, modeling, and simulations
  • Strong authority on Cadence Allegro Package Designer Plus (APD+)
  • Experience on interposer and substrate layouts and design in advanced package technologies
  • Experience with 2.5D, 3D package design
  • Experience with design teams on floor plan, bump and layout optimization
  • Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated
  • Record of success in cross-functional team environment
  • Good experience with SI/PI tools for package level extraction/simulation

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.

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