Packaging Assembly Engineer
Austin, TX · On-site
Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...
Packaging Assembly Engineer
Austin, TX · On-site
Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...
Senior Package Reliability Engineer
San Jose, CA · On-site
$166K - $240K/yr
This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical ...
Senior Package Reliability Engineer
San Jose, CA · On-site
$166K - $240K/yr
This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical ...
Senior Package Reliability Engineer
San Jose, CA · On-site
$166K - $240K/yr
This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical ...
Senior Package Reliability Engineer
San Jose, CA · On-site
$166K - $240K/yr
This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical ...
Senior Package Reliability Engineer
San Jose, CA · On-site
$166K - $240K/yr
This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical ...
Senior Package Reliability Engineer
San Jose, CA · On-site
$166K - $240K/yr
This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical ...
Senior Package Reliability Engineer
San Jose, CA · On-site
$166K - $240K/yr
This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical ...
Senior Package Reliability Engineer
San Jose, CA · On-site
$166K - $240K/yr
This role requires partnering with package development engineers and semiconductor package assembly and manufacturing teams for selection of packaging materials based on thermal and thermomechanical ...
Packaging Assembly Engineer
Austin, TX · On-site
Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ... Semiconductor Packaging field. Working knowledge in materials characterization and analysis
Packaging Assembly Engineer
Austin, TX · On-site
Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ... Semiconductor Packaging field. Working knowledge in materials characterization and analysis
Packaging Assembly Engineer
Austin, TX · On-site
$184K - $324K/yr
Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...
Packaging Assembly Engineer
Austin, TX · On-site
$184K - $324K/yr
Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...
Packaging Assembly Engineer
Austin, TX · On-site
$184K - $324K/yr
Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...
Packaging Assembly Engineer
Austin, TX · On-site
$184K - $324K/yr
Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging ... extensive experience in Semiconductor Packaging field. Working knowledge in materials ...
Principal Systems Packaging & Assembly Engineer
Santa Clara, CA · On-site
$180K - $240K/yr
... semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional ... Lead package and assembly integration of complex multi-component systems which include MEMs devices ...
Principal Systems Packaging & Assembly Engineer
Santa Clara, CA · On-site
$180K - $240K/yr
... semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional ... Lead package and assembly integration of complex multi-component systems which include MEMs devices ...
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part ... packaging. About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry ...
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part ... packaging. About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry ...
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part ... packaging. About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry ...
GlobalFoundries Fab9 is seeking a highly skilled and motivated R&D assembly engineer to become part ... packaging. About GlobalFoundries GlobalFoundries is a leading full-service semiconductor foundry ...
Assembly Engineer
Newburyport, MA · On-site
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With ... Assembly Engineer General Summary The Process Engineer develops and documents manufacturing ...
Assembly Engineer
Newburyport, MA · On-site
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With ... Assembly Engineer General Summary The Process Engineer develops and documents manufacturing ...
Principal Systems Packaging & Assembly Engineer
Santa Clara, CA · Hybrid
$180K - $240K/yr
... semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional ... Lead package and assembly integration of complex multi-component systems which include MEMs devices ...
Principal Systems Packaging & Assembly Engineer
Santa Clara, CA · Hybrid
$180K - $240K/yr
... semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional ... Lead package and assembly integration of complex multi-component systems which include MEMs devices ...
Principal Systems Packaging & Assembly Engineer
Santa Clara, CA · Hybrid
$180K - $240K/yr
... semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional ... Lead package and assembly integration of complex multi-component systems which include MEMs devices ...
Quick apply
Principal Systems Packaging & Assembly Engineer
Santa Clara, CA · Hybrid
$180K - $240K/yr
... semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional ... Lead package and assembly integration of complex multi-component systems which include MEMs devices ...
Assembly Engineer
Newburyport, MA · On-site
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With ... Assembly Engineer General Summary The Process Engineer develops and documents manufacturing ...
Assembly Engineer
Newburyport, MA · On-site
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With ... Assembly Engineer General Summary The Process Engineer develops and documents manufacturing ...
Principal Systems Packaging & Assembly Engineer
Santa Clara, CA · On-site
$180K - $240K/yr
... semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional ... Lead package and assembly integration of complex multi-component systems which include MEMs devices ...
Principal Systems Packaging & Assembly Engineer
Santa Clara, CA · On-site
$180K - $240K/yr
... semiconductor packaging, and complex multi-die assemblies, who can also lead cross-functional ... Lead package and assembly integration of complex multi-component systems which include MEMs devices ...
Risk base review on New Product/Package Introduced and create evaluation based on the risk ... Must have at least 5 years process engineering experience in a Semiconductor backend facility.
Risk base review on New Product/Package Introduced and create evaluation based on the risk ... Must have at least 5 years process engineering experience in a Semiconductor backend facility.
Semiconductor Package Design Engineer
Apopka, FL · On-site
$119K/yr
Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...
Semiconductor Package Design Engineer
Apopka, FL · On-site
$119K/yr
Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline. * 8 to 10 years of experience in semiconductor packaging design, modeling, and ...
Senior Engineer Package Designer
$190K - $220K/yr
MS preferred * 8-10 years of experience in semiconductor package design * Strong SI/PI analysis ... Familiarity with reliability analysis and packaging/assembly rules
Quick apply
Senior Engineer Package Designer
$190K - $220K/yr
MS preferred * 8-10 years of experience in semiconductor package design * Strong SI/PI analysis ... Familiarity with reliability analysis and packaging/assembly rules
MS preferred * 8-10 years of experience in semiconductor package design * Strong SI/PI analysis ... Familiarity with reliability analysis and packaging/assembly rules Education:Employment Type ...
MS preferred * 8-10 years of experience in semiconductor package design * Strong SI/PI analysis ... Familiarity with reliability analysis and packaging/assembly rules Education:Employment Type ...
Semiconductor Package Assembly Engineer information
See salary details
$20.91 - $23.43
4% of jobs
$23.43 - $25.94
1% of jobs
$25.94 - $28.45
1% of jobs
$28.45 - $30.97
0% of jobs
$30.97 - $33.48
9% of jobs
$35.87 is the 25th percentile. Wages below this are outliers.
$33.48 - $35.99
11% of jobs
$35.99 - $38.51
21% of jobs
The median wage is $38.78 / hr.
$38.51 - $41.02
29% of jobs
$41.02 - $43.53
16% of jobs
$43.53 - $46.04
6% of jobs
$46.04 - $48.56
2% of jobs
$20
$38
$48
How much do semiconductor package assembly engineer jobs pay per hour?
As of Sep 11, 2026, the average hourly pay for semiconductor package assembly engineer in the United States is $38.44, according to ZipRecruiter salary data. Most workers in this role earn between $35.58 and $41.35 per hour, depending on experience, location, and employer.
What are popular job titles related to Semiconductor Package Assembly Engineer jobs?
For Semiconductor Package Assembly Engineer jobs, the most frequently searched job titles are:
Packaging Assembly Engineer
Austin, TX • On-site
Apple
• Computer and Electronic Product Manufacturing • 10K+ employees10,000+ employees
Full-time
Re-posted 2 days ago
Apple rating
8.1
Based on 684 frontline employees who took The Breakroom Quiz
Job description
Do you like to work on ground breaking technologies that enable amazing new products? Do you have the attention for details and love for excellence to work towards an extraordinary result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will own development, optimization and sustaining the advanced flip-chip BGA (FCBGA) assembly process from pathfinding, NPI through high-volume manufacturing by defining assembly baseline processes, deciding package BOM, establishing package design rules that are optimized for performance, reliability, yield and cost for a variety of projects including SoC.
Description
Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel.
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience or equivalent
Preferred Qualifications
M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired.
5+ years of extensive experience in Semiconductor Packaging field. Working knowledge in materials characterization and analysis
Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology. General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
Ability to work independently and take on projects with minimum supervision.
Good engineering problem solving skills with strong engineering physics and fundamentals.
Can use package design softwares, APD, Virtuoso, etc. Working knowledge in memory packaging.
Good program management skill
Description
Responsible to lead packaging assembly technology development. Work with cross functional team and lead SoC Package development efforts. Package architecture / Package integration Innovation Work with foundry and OSAT to bring packaging solution from concept to HVM. Drive industry with advanced Package solutions, new material development, and specs. Minimum 5% International travel.
Minimum Qualifications
BS and 10+ years of experience in relevant industry experience or equivalent
Preferred Qualifications
M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering or an equivalent field is desired.
5+ years of extensive experience in Semiconductor Packaging field. Working knowledge in materials characterization and analysis
Working knowledge of large FCBGA package, MCM package, 2.5D packaging and 3D packaging technology. General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Good communication skills that can enable you to work well with internal multi-functional teams and overseas suppliers.
Ability to work independently and take on projects with minimum supervision.
Good engineering problem solving skills with strong engineering physics and fundamentals.
Can use package design softwares, APD, Virtuoso, etc. Working knowledge in memory packaging.
Good program management skill
About Apple
Sourced by ZipRecruiter
Imagine what you could do here! At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. Dynamic, intelligent people and inspiring, innovative technologies are the norm here. The people who work here have reinvented entire industries with all Apple Hardware products. The same real passion for innovation that goes into our products also applies to our practices strengthening our dedication to leave the world better than we found it.
Industry
Computer and electronic product manufacturing
Company size
10,000+ Employees
Headquarters location
Cupertino, CA, US
Year founded
1976