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Remote Soc Design Engineer Jobs in Utah (NOW HIRING)

US - UT - Remote (144200) Job Title: Core Engineering - Design Engineer V PCB Layout Engineer, AR Product Team As a PCB Layout Engineer on Meta's AR Product Team, you will be responsible for driving ...

Principal Site Reliability Engineer

Lehi, UT · On-site +1

$53.50 - $71/hr

Design and implement observability pipelines (metrics, logs, traces) using tools such as Splunk ... Familiarity with compliance frameworks such as SOC 2, FedRAMP, or ISO 27001 in cloud environments

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Senior Infrastructure Software Engineer | DX

UT · On-site +1

$106K - $144K/yr

This is a full time, remote role across USA. Responsibilities: Responsibilities You'll design and ... Experience with frameworks like SOC 2, FedRAMP, HIPAA, or ISO 27001 is a plus--you know how to ...

Remote; Ability to travel up to 25% * Sales motion: Technical consultative selling across net-new ... protection, SOC 2, and ISO as they apply to print and output management deployments. * Domain ...

Remote; Ability to travel up to 25% * Sales motion: Technical consultative selling across net-new ... protection, SOC 2, and ISO as they apply to print and output management deployments. * Domain ...

Sr. Power Systems Engineer

Salt Lake City, UT · On-site +1

$101K - $138K/yr

This role will own the design, engineering and performance capability of utility-scale solar and ... Define communication protocols, data acquisition requirements, alarm management, and remote ...

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Remote Soc Design Engineer information

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Design Engineer V

Design Engineer V

Infotech Sourcing

Logan, UT • On-site, Remote

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Posted 10 days ago


Job description

Request ID: 71044-1
Start/End Dates: 7/20/2026 - 12/25/2026
Tax Work Location: US - UT - Remote (144200)
Job Title: Core Engineering - Design Engineer V
Job Description: PCB Layout Engineer, AR Product Team
As a PCB Layout Engineer on Meta’s AR Product Team, you will be responsible for driving world-class, complex PCB layouts that incorporate cutting-edge component and stack-up technologies. A core focus of this role is implementing miniaturization solutions within AR product designs. You will collaborate closely with internal electrical and mechanical engineers, DFM, SiPi, and other layout and library teams, as well as external suppliers.
RESPONSIBILITIES
Project Management & Execution:
Manage multiple complex layout projects, providing timely status reports within Meta systems.
Lead designs from kick-off through tape-out, encompassing rigid, rigid-flex, and flex PCBs for both product and non-product/test projects.
Proactively schedule and drive project meetings (Kick-off, Placement, Constraint, and Design Reviews) to ensure design verification using Meta's Design Traveler document.
Create and modify engineering tool project templates, meta-data, configuration data, and rules.
Technical Expertise & Problem Solving:
Apply a solid understanding of electrical engineering principles, particularly for power distribution, high-speed circuits, and RF signals.
Identify project execution risks or slowdowns proactively and collaborate with managers and/or technical program managers to propose alternative PCB development workflow solutions.
Understand and propose practical fit and function solutions related to miniaturization concepts.
Cross-Functional Collaboration & Supplier Engagement:
Proactively partner with EE Leads, Mechanical Engineering, TPMs, and other cross-functional teams (XFNs) to resolve design issues.
Work with internal DFM engineers to confirm supplier requirements at project launch.
Engage with external suppliers and Supplier Quality/Process Engineering (SQE/PE) to resolve DFM issues and ensure high-yield builds.
MINIMUM QUALIFICATIONS
8+ years of experience in complex PCB Design.
5+ years of experience using Allegro PCB Design Tools (version 23.1 or newer).
Strong understanding of the mechanical aspects of electronics design.
Excellent communication skills.
Proficiency with Microsoft Office tools.
PREFERRED QUALIFICATIONS
BS in Electrical Engineering.
3+ years of experience implementing miniaturization solutions in dense form-factor designs (e.g., wearable products, mobile phone design).