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Plating Process Engineer Jobs (NOW HIRING)

samtec

Plating Engineering Supervisor

New Albany, IN · On-site

The Plating Engineer Supervisor is responsible for continuous improvement of the plating process on quality, on time delivery and cost. The Plating Engineering Supervisor is the leader of the Plating ...

Amphenol

Plating Engineer

Springfield, MO · On-site

$70K - $85K/yr

Applicants may request an accommodation to complete the application process by calling 417-866-2322 ... Discover more at Summary The Plating Engineer will be responsible for the development, optimization ...

Stellant Systems

Materials & Process Engineer

Torrance, CA · On-site

$100K - $165K/yr

Materials & Process Engineer Job Location: Torrance, CA Salary: $100,000-$165,000/yr DOE Stellant ... Additional support may be provided with cleaning, plating, brazing, soldering, adhesives, paints ...

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Plating Process Engineer information

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$38K

$90.5K

$150.5K

How much do plating process engineer jobs pay per year?

As of Jun 20, 2026, the average yearly pay for plating process engineer in the United States is $90,538.00, according to ZipRecruiter salary data. Most workers in this role earn between $71,500.00 and $100,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Plating Process Engineer, and why are they important?

A Plating Process Engineer requires a solid background in chemical engineering, materials science, and process optimization, often supported by a relevant engineering degree. Familiarity with plating equipment, chemical bath controls, statistical process control (SPC), and industry standards such as ISO 9001 is crucial. Strong analytical thinking, attention to detail, and effective problem-solving and communication skills help excel in this role. These abilities ensure high-quality metal finishing, process efficiency, and compliance with safety and environmental regulations.

What is the difference between Plating Process Engineer vs Electroplating Technician?

AspectPlating Process EngineerElectroplating Technician
CredentialsBachelor's degree in materials, chemistry, or engineeringHigh school diploma or technical certification
Work EnvironmentDesign, develop, and optimize plating processes in manufacturing settingsOperate and maintain plating equipment on the production line
Industry UsageUsed in industries like aerospace, automotive, electronicsPrimarily in manufacturing and finishing departments
ResponsibilitiesProcess development, troubleshooting, quality controlSetup, operation, and basic maintenance of plating equipment

The Plating Process Engineer focuses on designing and improving plating processes, requiring higher education and analytical skills. In contrast, the Electroplating Technician handles day-to-day operations and equipment maintenance. Both roles are essential in the plating industry but differ in responsibilities and qualifications.

What are Plating Process Engineers?

Plating Process Engineers are professionals who design, optimize, and oversee electroplating and metal finishing processes in manufacturing environments. They are responsible for developing procedures to deposit metal coatings onto various substrates, ensuring product quality and adherence to industry standards. Their work often involves troubleshooting plating issues, maintaining equipment, implementing safety protocols, and collaborating with other engineers to improve process efficiency. These engineers are essential in industries such as automotive, electronics, aerospace, and jewelry where surface finishing is critical to product performance and appearance.

What are some of the common challenges faced by Plating Process Engineers, and how can they be addressed?

Plating Process Engineers often encounter challenges such as maintaining consistent coating quality, managing chemical bath composition, and ensuring compliance with environmental and safety regulations. Variations in process parameters or contamination can affect product quality, so meticulous monitoring and regular maintenance of equipment are vital. Collaboration with quality assurance teams and production staff helps quickly identify and resolve any issues, while ongoing training and process audits can further enhance reliability and efficiency in plating operations.
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What states have the most Plating Process Engineer jobs? States with the most job openings for Plating Process Engineer jobs include:
What job categories do people searching Plating Process Engineer jobs look for? The top searched job categories for Plating Process Engineer jobs are:
Plating Process Engineer jobs near you
Infographic showing various Plating Process Engineer job openings in the United States as of June 2026, with employment types broken down into 1% Locum Tenens, 94% Full Time, 1% Temporary, and 4% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $90,538 per year, or $43.5 per hour.
Copper Plating Engineering Group Leader

Copper Plating Engineering Group Leader

3D Glass Solutions

Albuquerque, NM • On-site

Full-time

Posted yesterday

Job description

Job/Position Summary
The Copper Plating Engineering Group Leader is a hands-on leader who will lead process development and provide manufacturing support for advanced copper plating technologies. This role requires deep technical expertise in electroplating and electroless copper processes, strong experimental leadership, and the ability to mentor and guide a team of process engineers. The ideal candidate will be both a technical authority and an active contributor in lab and fab environments.
Primary Responsibilities
  • Lead and manage a team of process engineers focused on copper plating and related unit processes.
  • Drive experimental design, execution, and data analysis to optimize plating performance, yield, and reliability.
  • Provide hands-on technical leadership in lab and production environments, including tool setup, process tuning, and troubleshooting.
  • Develop, qualify, and maintain copper plating processes for wafer-level and/or panel-level manufacturing.
  • Serve as the technical owner for copper electroplating and electroless plating modules.
  • Collaborate cross-functionally with equipment, integration, yield, reliability, and manufacturing teams.
  • Establish robust problem-solving methodologies (DOE, SPC, FMEA, root cause analysis) to address process challenges.
  • Support technology transfers from R&D to high-volume manufacturing
  • Mentor junior engineers and elevate the overall team's technical capability
  • Interface with chemical and equipment suppliers for process optimization and roadmap alignment.
  • Perform additional functions and other duties as assigned or required.

Requirements
  • Bachelor's degree or higher in Materials Science, Chemical Engineering, Electrical Engineering, or a related field required.
  • 5-10 years of industry experience in copper plating or advanced packaging process engineering.
  • Willing to relocate to Albuquerque, New Mexico, for 1-2 years and willing to relocate to India for 2 years or permanently.
  • This position will require lawful access to ITAR/EAR controlled information, and employees in these roles will need to meet those requirements. Requirements include US Citizenship, US Permanent Resident, or the ability to meet contract-specific licensure requirements.

Knowledge, Skills, and Abilities
  • Demonstrated experience leading technical teams or serving as a senior technical authority.
  • Proven track record of solving complex plating and integration challenges.
  • Experience with plating equipment operation, optimization, and qualification.
  • Experience with plating chemistry additives, including suppressors, accelerators, and levelers.
  • Knowledge of wafer-level and/or panel-level plating process development and manufacturing.
  • Knowledge of microvia electroplating and void-free fill techniques.
  • Knowledge of plating seed layer etching and related metallization removal processes.
  • Experience in through Glass Via (TGV) filling.
  • Familiarity with high-volume manufacturing requirements and process control methodologies.
  • Ability to balance technical depth with project and people leadership.
  • Excellent communication and mentoring skills.
  • Supplier and equipment vendor engagement experience.
  • Experience in advanced packaging, heterogeneous integration, or semiconductor manufacturing environments.
  • Experience in through Silicon Via (TSV) filling.
  • Knowledge of photoresist stripping and post-plating cleaning processes.
  • Experience with redistribution Layer (RDL) electroplating.
  • Knowledge of electroless copper plating chemistries, including copper seed layer formation.
  • Experience with Electroplating waveforms, including DC, pulse, and pulse-reverse plating.
  • Demonstrated experience with Copper electroplating chemistries, including acid copper systems and additive interactions.
  • Strong experimental design and data analysis skills.

Physical/Working Requirements
  • Must be able to wear personal protective gear most of the day (where applicable).
  • Prolonged periods of sitting or standing.

Behavioral Traits
  • Strong verbal and written communication skills to convey quality standards, expectations, and feedback clearly to team members and stakeholders.
  • A willingness to adjust to changing circumstances, processes, or technologies for continuous improvement in dynamic environments.
  • The ability to work well with others, fostering a cooperative atmosphere, driving data management initiatives, and engaging all levels of the organization.
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About 3D Glass Solutions

Sourced by ZipRecruiter

Industry

Electrical equipment, appliance, and component manufacturing

Company size

11 - 50 Employees

Headquarters location

Albuquerque, NM, US

Year founded

2006

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