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Packaging Design Engineer Jobs in Texas (NOW HIRING)

IngenioRx Inc

Packaging Engineer

El Paso, TX · On-site

Role Description This is a full time on-site Packaging Engineer role based in El Paso, TX. The Packaging Engineer will design and develop packaging solutions for medical devices, ensuring compliance ...

Page Mechanical Group, Inc.

Design Engineer

Houston, TX · On-site

$70 - $110/hr

Design Engineer Founded in 1934, Griffin Fluid Management is the leader in dewatering and ... packages. * Sales Support: Provide technical sales support for our business development team to ...

Artha Nexgen

Design Engineer

San Antonio, TX · On-site

$55 - $96/hr

Prepare documentation packages and support design reviews. Qualifications * Bachelor's degree in Mechanical Engineering or related field. * 10+ years of experience in tooling and fixture design for ...

Nobull Energy LLC

Design Engineer

Early, TX · On-site

$100K - $120K/yr

The Design Engineer will be responsible for designing and developing electrical systems for solar ... Comprehensive benefits package including health, dental, and vision insurance. * Retirement savings ...

Nobull Energy LLC

Design Engineer

Early, TX · On-site

$100K - $120K/yr

The Design Engineer will be responsible for designing and developing electrical systems for solar ... Comprehensive benefits package including health, dental, and vision insurance. * Retirement savings ...

Griffin Fluid Management

Design Engineer

Houston, TX · On-site

Design Engineer Founded in 1934, Griffin Fluid Management is the leader in dewatering and ... packages. * Sales Support: Provide technical sales support for our business development team to ...

Griffin Fluid Management

Design Engineer

Houston, TX · On-site

Design Engineer Founded in 1934, Griffin Fluid Management is the leader in dewatering and ... packages. * Sales Support: Provide technical sales support for our business development team to ...

Central Garden & Pet

Packaging Engineer

Dallas, TX

The Packaging Engineer will serve as a cross-functional partner supporting both manufacturing ... Design, develop, and validate primary, secondary, and tertiary packaging for new and existing ...

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Packaging Design Engineer information

See Texas salary details

$83.8K

$127.2K

How much do packaging design engineer jobs pay per year?

As of Sep 6, 2026, the average yearly pay for packaging design engineer in Texas is $125,810.00, according to ZipRecruiter salary data. Most workers in this role earn between $126,700.00 and $126,700.00 per year, depending on experience, location, and employer.

What are some common challenges faced by a packaging design engineer when developing new packaging solutions?

Packaging Design Engineers often encounter challenges balancing functionality, cost, and sustainability in their designs. They must ensure that packaging protects the product during transit and storage while also considering material efficiency and environmental impact. Additionally, collaborating with cross-functional teams such as marketing, manufacturing, and logistics is crucial to align design with brand requirements and production capabilities. Tight deadlines and changing client specifications can further add to the complexity of the role.

What are the key skills and qualifications needed to thrive as a packaging design engineer, and why are they important?

To thrive as a Packaging Design Engineer, you need a background in engineering or industrial design, strong CAD skills, and a solid understanding of materials science. Familiarity with tools like AutoCAD, SolidWorks, and packaging testing systems, as well as knowledge of industry standards, is typically required. Creativity, problem-solving, and effective collaboration are standout soft skills in this role. These abilities ensure that packaging solutions are innovative, cost-effective, and meet safety and sustainability requirements.

What is the difference between Packaging Design Engineer vs Packaging Technician?

AspectPackaging Design EngineerPackaging Technician
CredentialsBachelor's degree in packaging engineering, industrial design, or related fieldHigh school diploma or associate degree, technical training
Work EnvironmentDesign studios, R&D labs, manufacturing settingsProduction lines, warehouse, testing facilities
Job FocusDeveloping and optimizing packaging designs, materials, and prototypesImplementing packaging processes, testing, and quality control
Industry UsageUsed by companies creating new packaging solutionsUsed in packaging assembly and quality assurance

The Packaging Design Engineer primarily focuses on creating and improving packaging designs, requiring specialized education and working in design environments. In contrast, the Packaging Technician handles the implementation, testing, and quality control of packaging in production settings. Both roles are essential in the packaging industry but differ in responsibilities and skill requirements.

Are packaging design engineers in demand?

Packaging design engineers are in demand due to the growth of e-commerce and consumer product industries, which require innovative and sustainable packaging solutions. They often need skills in CAD software, materials science, and knowledge of industry standards to meet increasing market needs.

How much do packaging design engineers make in the US?

Packaging Design Engineers in the US typically earn a median annual salary of around $70,000 to $90,000, depending on experience, location, and industry. Entry-level positions may start lower, while experienced engineers with specialized skills or certifications can earn over $100,000 annually.

What does a packaging design engineer do?

A packaging design engineer develops and creates packaging solutions that protect products during transportation and storage while also considering branding and user experience. They use CAD software, materials knowledge, and engineering principles to design functional, cost-effective, and sustainable packaging. The role often involves collaboration with manufacturing, marketing, and quality assurance teams to ensure designs meet specifications and standards.

What are popular job titles related to Packaging Design Engineer jobs in Texas?

For Packaging Design Engineer jobs in Texas, the most frequently searched job titles are:

What job categories do people searching Packaging Design Engineer jobs in Texas look for?

The top searched job categories for Packaging Design Engineer jobs in Texas are:

What are popular job titles related to Packaging Design Engineer jobs in TX?

For Packaging Design Engineer jobs in TX, the most frequently searched job titles are:

Packaging Design Engineer jobs near you
Infographic showing various Packaging Design Engineer job openings in Texas as of August 2026, with employment types broken down into 90% Full Time, 7% Part Time, and 3% Contract. Highlights an 82% Physical, 5% Hybrid, and 13% Remote job distribution, with an average salary of $125,810 per year, or $60.5 per hour.

Principal Package Design Engineer

Renesas Electronics

Austin, TX • On-site

Full-time

Posted 18 days ago

Job description

Company Description
At Renesas, we are more than just a semiconductor company; we are the engine behind a "safer, smarter, and more sustainable" future. Headquartered locally in the heart of San Jose, our Silicon Valley team is at the forefront of innovation in Automotive, Industrial, Infrastructure, and IoT technologies. By blending cutting-edge embedded processing with world-class analog and power expertise, we develop "Winning Combinations" that power billions of intelligent devices globally. Joining our San Jose office means joining a collaborative, forward-thinking environment where your work directly impacts the next generation of AI-driven infrastructure and green energy solutions.
Job Description
Principal Package Design Engineer
Location: Hybrid at main Renesas Electronics America locations (San Jose, CA / Austin, TX)
Department: Semiconductor Power Product Group
Reports To: Senior Principal, Device Design Packaging Technology, Strategy, Operations
Position Summary
We are seeking a Principal Package Design Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architecture, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, applications, product engineering, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.
Key Responsibilities
  • Lead Advanced Packaging Initiatives: Lead the design, development, and qualification of advanced semiconductor packaging solutions, including:
    • Flip-chip, Chip Embedding
    • Wafer-level packaging (WLP/FOWLP)
    • Panel-level packaging (laminate, molding)
    • 2.5D/3D packaging
    • System-in-package (SiP)
    • Ball grid array (BGA/CSP)
    • Wafer-to-wafer and die-to-wafer heterogeneous bonding
  • Architecture & Simulation: Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements with hands-on, deep simulation expertise.
  • OSAT & Vendor Strategy: Drive package technology and OSAT selection and development for new product introductions (NPI).
  • Cross-Functional Collaboration: Work closely with IC design, product definers, substrate, board, thermal, reliability, applications, and manufacturing teams to ensure package compatibility and performance.
  • Layout & Stack-Up: Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
  • Simulations & Modeling: Perform and guide others on simulations and analysis related to:
    • Signal integrity / power integrity
    • Thermal performance
    • Mechanical stress / warpage
    • Design for manufacturability (DFM)
  • Assembly & Qualification: Develop assembly flows and process requirements for OSATs and manufacturing partners. Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.
  • Yield & Issue Resolution: Resolve packaging-related issues and challenges during NPI prototype builds, qualification, and production ramp. Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.
  • Documentation & Leadership: Create and maintain package specifications, design rules, process documentation, and technical reports. Mentor junior engineers and provide technical leadership across packaging initiatives.

Qualifications
Required Qualifications
  • Education: MSc or PhD degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related field.
  • Experience: 5+ years of experience in advanced semiconductor packaging or advanced electronics packaging and system integration.
  • Technical Depth: Strong hands-on knowledge of advanced packaging technologies, materials, assembly processes, and application system integration as they apply to AI infrastructure and data center power management.
  • Reliability & Tools: Deep understanding of thermal, mechanical, and electrical interactions in package design and extensive, hands-on model setup, simulations, and analysis. Strong background in CAD and simulation tools. Experience with package reliability testing and qualification standards.
  • Supply Chain: Experience working with OSATs, substrate vendors, assembly houses, and semiconductor supply chains.
  • Problem Solving & Leadership: Proven ability to troubleshoot packaging failures, drive root cause/corrective action, and demonstrate strong project leadership and cross-functional communication skills.

Preferred Qualifications
  • Master's or PhD in a relevant engineering discipline.
  • Experience with power semiconductor devices and packaging including Si/SiC/GaN MOSFETs, Power Modules, Intelligent Power Modules, and their applications in consumer, industrial, automotive, and high-performance computing markets.
  • Experience with power products in high-performance computing, AI/ML hardware, or mobile products.
  • Hands-on experience with tools for package design and simulation such as:
    • Cadence Allegro Package Designer
    • SolidWorks
    • ANSYS
    • COMSOL
    • JMP / Minitab
  • Knowledge of JEDEC standards, IPC standards, and semiconductor qualification methods.
  • Experience in W2W, D2W, D2D 3D heterogeneous integration and chiplet-based packaging.

Key Skills
  • Advanced package concept engineering and design
  • Materials selection and development
  • Thermal and mechanical simulations and analysis
  • Failure analysis & reliability engineering
  • Design for Manufacturability (DFM/DFX)
  • Process development & supplier collaboration
  • Technical leadership & problem-solving

Success in This Role
A successful Principal Package Design Engineer will:
  • Deliver robust package solutions that meet performance, reliability, and cost targets.
  • Enable smooth product transfer from concept to development to manufacturing.
  • Reduce packaging risks through strong technical analysis, hands-on simulations, and qualification planning.
  • Improve yield, quality, and manufacturability through collaboration with internal and external partners.

Working Conditions
  • May require occasional travel to supplier, OSAT, or design/manufacturing/R&D sites.

Additional Information
Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.
At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.
We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.
Are you ready to join our team and shape the future with us?
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.
Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.
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