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Package Design Director Jobs in California (NOW HIRING)

We are looking for a Director of package design to join the team to support our mission as a key leader of the advanced packaging design team. #SCHIE #CSME #SMPE Responsibilities * Lead and mentor a ...

Package Design Engineer

Sunnyvale, CA · On-site

$159K/yr

... direct-to-consumer products. You'll contribute to the innovation behind products loved by millions ... Develop physical package substrate design of large form-factor package for ML high-performance ...

Design Director

Los Angeles, CA · On-site

$160K - $175K/yr

... benefits package of $100 via Juno. * We offer access to YCN and fund relevant training ... Department Design Role Design Director Locations Los Angeles Remote status Hybrid Yearly salary ...

Design Director

San Francisco, CA · On-site

$242 - $335/hr

About the role Chime is looking for a Product Design Director to lead our Growth Design ... Full-time employees are also eligible for a bonus, competitive equity package, and benefits. The ...

About the role We're hiring a Design Director to lead Product Design across our Spending, Savings ... Full-time employees are also eligible for a bonus, competitive equity package, and benefits. The ...

About the role We're hiring a Design Director to lead Product Design across our Spending, Savings ... Full-time employees are also eligible for a bonus, competitive equity package, and benefits. The ...

... benefits package via Juno of $105 per month. * We offer YCN access and fund relevant training ... Department Design Role Design Director Locations Los Angeles Remote status Hybrid Yearly salary 165 ...

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Package Design Director information

What does a package design director do?

A Package Design Director leads the creative process for designing product packaging, ensuring it is both visually appealing and functional. They manage a team of designers, collaborate with marketing and product development teams, and oversee the entire packaging design lifecycle—from conceptualization to production. Their role involves setting design standards, staying updated on industry trends, and ensuring that packaging aligns with brand identity and regulatory requirements. Additionally, they may work with external vendors and suppliers to ensure quality and cost-effectiveness.

What are the key skills and qualifications needed to thrive as a package design director?

To thrive as a Package Design Director, you need deep expertise in graphic and industrial design, brand strategy, and consumer packaging trends, often supported by a degree in design or a related field. Proficiency in design software such as Adobe Creative Suite, 3D modeling tools, and project management platforms is typically required. Strong leadership, creative vision, and effective communication are crucial soft skills that help guide teams and collaborate with cross-functional stakeholders. These skills ensure the creation of innovative, marketable packaging solutions that align with brand goals and consumer demands.

How does a package design director typically collaborate with marketing and product development teams?

As a Package Design Director, you will regularly collaborate with marketing and product development teams to ensure packaging aligns with both brand strategy and functional requirements. This involves participating in brainstorming sessions, reviewing market research insights, and providing design solutions that meet product protection, shelf impact, and sustainability goals. Clear communication and an ability to balance creative vision with business objectives are essential, as you'll often mediate between creative ideas and practical constraints such as cost or manufacturing processes.

What is the difference between Package Design Director vs Package Designer?

AspectPackage Design DirectorPackage Designer
CredentialsBachelor's or Master's in Graphic Design, Packaging, or related fields; extensive experienceBachelor's in Graphic Design, Packaging, or related fields; entry to mid-level experience
Work EnvironmentLeadership role overseeing teams, collaborating with marketing and productionDesigning packaging concepts, working under creative leads
Industry UsageUsed in large corporations, branding agencies, and packaging firmsCommon in design studios, branding agencies, and in-house teams

The Package Design Director focuses on leading and managing packaging projects, setting strategic vision, and overseeing teams. In contrast, the Package Designer is responsible for creating and executing packaging designs under guidance. Both roles require strong design skills, but the director role emphasizes leadership and strategic planning, while the designer role centers on hands-on design work.

What are the most commonly searched types of Package Design jobs in California?

The most popular types of Package Design jobs in California are:

What are popular job titles related to Package Design Director jobs in California?

For Package Design Director jobs in California, the most frequently searched job titles are:

What cities in California are hiring for Package Design Director jobs?

Cities in California with the most Package Design Director job openings:

Infographic showing various Package Design Director job openings in California as of August 2026, with employment types broken down into 1% As Needed, 80% Full Time, 8% Part Time, and 11% Contract. Highlights an 78% Physical, 3% Hybrid, and 19% Remote job distribution.

Director of Package Design

Microsoft

Mountain View, CA • On-site

Full-time

Posted 7 days ago


Microsoft rating

8.5

Company rating: 8.5 out of 10

Based on 132 frontline employees who took The Breakroom Quiz

80th of 246 rated software companies


Job description

Overview
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft's expanding Cloud Infrastructure and responsible for powering Microsoft's "Intelligent Cloud" mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.
The Compute Silicon & Manufacturing Engineering (CSME) organization within SCHIE is responsible for design, development, manufacturing and packaging of Microsoft's state-of-the-art computer chips, notably the Azure Cobalt. Our solutions provide sustainable strategic advantages to Microsoft and enable our customers to achieve more.
As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the Silicon Manufacturing and Product Engineering (SMPE) team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.
We are looking for a Director of package design to join the team to support our mission as a key leader of the advanced packaging design team.
#SCHIE #CSME #SMPE
Responsibilities
  • Lead and mentor a team of talented package design engineers, supporting their career growth and professional development.
  • Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.
  • Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.
  • Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout
  • Define, design and develop test vehicles to validate Silicon, Package, System performance.
  • Drive supplier assessments and manage suppliers through definition, development, qualification and production.
  • Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.
  • Define EDA tools requirements for advanced 3DIC packaging designs
  • Design and develop package and assembly drawings to support the manufacturing.
  • Lead supplier assessments and manage suppliers through definition, development, qualification and production.
  • Assess and characterize the reliability of Integrated Circuits (IC) packages.
  • Design and develop package and assembly drawings to support the manufacturing.
  • Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
  • Drive execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.
  • Drive engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

Qualifications
Required Qualifications:
Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor's Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Equivalent Experience.
Other Requirements
  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
  • This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate's citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

Preferred Qualifications:
  • Doctorate in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 10+ years technical engineering experience OR Master's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 15+ years technical engineering experience OR Bachelor's Degree in Physics, Electrical Engineering, Computer Engineering, Computer Science, Chemistry, or related field AND 18+ years technical engineering experience OR equivalent experience.
  • 15+ years of hands-on experience in Semiconductor Package design, development, manufacturing, supplier management or quality management
  • Experience with Advanced Semiconductor Package technologies (e.g. BGA/2.5D/3D)
  • Foundation in advanced packaging technologies, manufacturing and supplier management
  • Proficient in IC package or PCB board layout CAD tools Cadence Allegro*
  • Working knowledge in high-speed signaling, layout, electrical, mechanical and thermal co-designs.
  • Working knowledge in 2D and 3D simulation tools for full package layout extractions for power and signals analysis
  • Experience with OSAT, Supplier & Foundry technologies.
  • Experience in physical failure analysis
  • Experience in subcontract supplier management.
  • Experience in cross-functional team environment

Silicon Engineering M5 - The typical base pay range for this role across the U.S. is USD $142,800 - $274,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $188,000 - $304,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here:
https://careers.microsoft.com/us/en/us-corporate-pay
This position will be open for a minimum of 5 days, with applications accepted on an ongoing basis until the position is filled.
Microsoft is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance with religious accommodations and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations.

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About Microsoft

Sourced by ZipRecruiter

Our infrastructure is comprised of a large global portfolio of more than 100 datacenters and 1 million servers. Our foundation is built upon and managed by a team of subject matter experts working to support services for more than 1 billion customers and 20 million businesses in over 90 countries worldwide. With environmental sustainability and optimization at the forefront of our datacenter design and operations, we continue to grow and evolve as we meet the ever-changing business demands that hold Microsoft as a world-class cloud provider.

Industry

Computer and computer peripheral equipment and software wholesalers

Company size

10,000+ Employees

Headquarters location

Redmond, WA, US

Year founded

1975

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