1

Package Design Jobs (NOW HIRING)

Package Design: * Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of ...

Package Design Engineer

Santa Clara, CA · On-site

$159K/yr

Package Design: * Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA · On-site

$141K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

IC Package Design Engineer

Los Angeles, CA · On-site

$146K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Package Design Engineer | Semiconductor

Apopka, FL · On-site

$119K/yr

Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility . Essential Duties and Responsibilities: * The primarily responsible for ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Lead end-to-end package design development for new and existing products, including dielines, typography, layout, color, and final production files. * Review and apply label data from R&D, including ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Position also requires: 1. Semiconductor-to-Package Codesign Coordination and Management. 2. Feasibility Studies and Design Assessment. 3. Package Technology Development including material selection ...

Package Design Engineer

Boise, ID · On-site

$129K/yr

Position also requires: 1. Semiconductor-to-Package Codesign Coordination and Management. 2. Feasibility Studies and Design Assessment. 3. Package Technology Development including material selection ...

next page

Showing results 1-20

Package Design information

See salary details

$9

$17

$24

How much do package design jobs pay per hour?

As of Jun 24, 2026, the average hourly pay for package design in the United States is $17.97, according to ZipRecruiter salary data. Most workers in this role earn between $15.87 and $18.75 per hour, depending on experience, location, and employer.

What qualifications do you need to be a packaging designer?

A packaging designer typically needs a bachelor's degree in graphic design, industrial design, or a related field. Strong skills in design software such as Adobe Illustrator and Photoshop, an understanding of materials and manufacturing processes, and a good sense of branding and marketing are also important for this role.

What is the highest paid design job?

In the field of package design, senior roles such as Creative Director or Design Director typically earn the highest salaries, often exceeding six figures, especially in large companies or agencies. These positions require extensive experience, leadership skills, and proficiency with design tools like Adobe Creative Suite and knowledge of branding strategies.

What does a package designer do?

A package designer creates the visual and structural design of product packaging to attract consumers and communicate brand identity. They use graphic design tools and knowledge of materials to develop functional, appealing packaging that meets safety and regulatory standards. The role often involves collaboration with marketing, product development, and manufacturing teams.

What is the difference between Package Design vs Graphic Designer?

AspectPackage DesignGraphic Designer
CredentialsDesign degree or related certificationDesign degree or related certification
Work EnvironmentPackaging companies, branding agencies, manufacturingAdvertising agencies, media companies, freelance
Industry UsageProduct packaging, branding, retailMarketing materials, digital media, branding

Package Design focuses on creating packaging solutions for products, emphasizing structural and visual aspects of packaging. Graphic Designers work on visual content across various media, including branding, advertising, and digital design. While both roles require design skills and similar credentials, Package Designers specialize in packaging materials and structures, whereas Graphic Designers have a broader scope in visual communication across multiple platforms.

Is packaging design a good career?

Packaging design is a viable career that involves creating attractive and functional packaging for products, often requiring skills in graphic design, creativity, and knowledge of printing processes. Professionals in this field typically work with design software and may need a portfolio or relevant education. Job prospects depend on industry demand and individual skill level.
More about Package Design jobs
What cities are hiring for Package Design jobs? Cities with the most Package Design job openings:
What are the most commonly searched types of Package Design jobs? The most popular types of Package Design jobs are:
What states have the most Package Design jobs? States with the most job openings for Package Design jobs include:
Infographic showing various Package Design job openings in the United States as of June 2026, with employment types broken down into 79% Full Time, 4% Part Time, 16% Contract, and 1% Nights. Highlights an 86% Physical, 4% Hybrid, and 10% Remote job distribution, with an average salary of $37,374 per year, or $18 per hour.
Package Design Engineer

Package Design Engineer

Marvell

Chandler, AZ

$133K/yr

Full-time

Life, Retirement

Posted 29 days ago


Job description

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

Advanced Packaging Physical Design for Photonic Fabric BU

What You Can Expect

  • Package Design:
    • Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Marvell products.
    • Scope all aspects of package design feasibility at Silicon interposer and substrate level for multi-chip SiP packaging.
    • Support pre/post silicon bring up, yield improvement activities, qualification, failure analysis, and system implementation.
  • Package Layout Expertise:
    • Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing.
    • Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes.
  • 2.5D and 3D Package Design Planning and Execution:
    • Plan and execute Silicon interposer and RDL based design layout solutions for advanced packaging architectures.
    • Netlist management for heterogeneous chiplet assemblies using latest EDA solutions.
  • Substrate Manufacturing and OSAT Assembly Engagement:
    • Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs.
    • Work with cross-functional teams and support package integration and architecture efforts with vendors.
    • Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design.
    • Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Marvell

What We're Looking For

  • Education:BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines.
  • Experience:5-10 years of experience in Semiconductor Packaging Design of heterogeneous architectures, including silicon interposer and RDL designs.
  • Technical Expertise:
    • Extensive experience working with advanced packaging design tools such as Cadence APD.
    • Experience working with MCAD tools such as SolidWorks, AutoCAD and interconversion of package design databases to MCAD files.
    • Knowledge and insights to deliver high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB.
    • Good understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost.
    • Familiarity with photonics packaging is a plus but not necessary.
  • Substrate Vendor and OSAT Engagement:
    • Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability.
    • Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements.
  • Industry Knowledge:Experience in High Speed Signaling best practices, Signal and Power integrity requirements.
  • Soft Skills:Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills.

Expected Base Pay Range (USD)

166,520 - 249,500, $ per annum

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life's most important moments. Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition. Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones. We look forward to sharing more with you during the interview process.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.

Interview Integrity

To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews.

These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

#LI-MM1