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Package Design Jobs (NOW HIRING)

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA · On-site

$141K - $226K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

Austin, TX · On-site

$134K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part ...

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

San Jose, CA · On-site

$159K/yr

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part ...

Package Design Engineer

Sunnyvale, CA · On-site

$159K/yr

Experience in chip package substrate layout, design verification, DFM and taping out for production. * Experience in design automation and scripting. Preferred qualifications: * Master's degree or ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

IC Package Design Engineer

Los Angeles, CA · On-site

$146K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Micross is seeking a Semiconductor Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility . Essential Duties and Responsibilities: * The primarily responsible for ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

We are seeking a Staff Package Design Engineer to join our dynamic team in Austin, TX. In this role, you'll work closely with internal and external customers to develop cutting-edge packaging ...

Lead end-to-end package design development for new and existing products, including dielines, typography, layout, color, and final production files. * Review and apply label data from R&D, including ...

Description As a Package design engineer, you will lead advanced package architecture, drive next-generation package structure and configuration optimization, and own Package/SiP/module physical ...

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Package Design information

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How much do package design jobs pay per hour?

As of Aug 5, 2026, the average hourly pay for package design in the United States is $17.97, according to ZipRecruiter salary data. Most workers in this role earn between $15.87 and $18.75 per hour, depending on experience, location, and employer.

What is the difference between Package Design vs Graphic Designer?

AspectPackage DesignGraphic Designer
CredentialsDesign degree or related certificationDesign degree or related certification
Work EnvironmentPackaging companies, branding agencies, manufacturingAdvertising agencies, media companies, freelance
Industry UsageProduct packaging, branding, retailMarketing materials, digital media, branding

Package Design focuses on creating packaging solutions for products, emphasizing structural and visual aspects of packaging. Graphic Designers work on visual content across various media, including branding, advertising, and digital design. While both roles require design skills and similar credentials, Package Designers specialize in packaging materials and structures, whereas Graphic Designers have a broader scope in visual communication across multiple platforms.

More about Package Design jobs
What cities are hiring for Package Design jobs? Cities with the most Package Design job openings:
What are the most commonly searched types of Package Design jobs? The most popular types of Package Design jobs are:
What states have the most Package Design jobs? States with the most job openings for Package Design jobs include:
Infographic showing various Package Design job openings in the United States as of July 2026, with employment types broken down into 88% Full Time, 9% Part Time, and 3% Contract. Highlights an 85% Physical, 4% Hybrid, and 11% Remote job distribution, with an average salary of $37,374 per year, or $18 per hour.

Package Design Engineer

Broadcom

San Jose, CA

$159K/yr

Full-time

Medical, Dental, Vision, Retirement, PTO

Re-posted 18 days ago


Broadcom rating

8.7

Company rating: 8.7 out of 10

Based on 23 frontline employees who took The Breakroom Quiz

19th of 156 rated electronics manufacturers


Job description

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Job Description:

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs.You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations.These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

  • Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.

  • Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

  • Schedule, prioritize, & track your work across 2+ projects simultaneously

  • General flip-chip BGA package design & engineering

  • Project management and customer interface for your design projects

  • Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.

  • Physical design (layout) is a foundational responsibility in this role


EDUCATION/EXPERIENCE & REQUIREMENTS:

  • BSEE or similar field and 8+ years' experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 6+ years' work experience

  • Knowledge of package-level signal integrity and power integrity, to apply to package designs

  • Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

  • Self-management and organization skills

  • Preferred candidates will also have1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

  • This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.


Compensation and Benefits


The annual base salary range for this position is USD 121,900.00 To USD 195,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.


Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.


Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.


If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.


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