ZipRecruiter

Log In

1

Package Design Jobs (NOW HIRING)

K2 Space

OR · On-site

$200K - $280K/yr

The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...

K2 Space

Senior ASIC Package Design Engineer

Seattle, WA · On-site

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

K2 Space

OR

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

K2 Space

Principal ASIC Package Design Engineer

$200K - $280K/yr

The Role We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM ...

K2 Space

Senior ASIC Package Design Engineer

$180K - $260K/yr

The Role We are seeking a Senior ASIC Package Design Engineer to implement advanced ASIC package architecture, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions.

Etched

IC Package Engineer

Cupertino, CA

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive ...

next page

Showing results 1-20

All JobsPackage Design Jobs

Package Design information

See salary details

$9

$17

$24

How much do package design jobs pay per hour?

As of Jul 16, 2026, the average hourly pay for package design in the United States is $17.97, according to ZipRecruiter salary data. Most workers in this role earn between $15.87 and $18.75 per hour, depending on experience, location, and employer.

Is packaging design in demand?

Packaging design is in demand due to the growth of e-commerce and retail industries, which require attractive and functional packaging to stand out and protect products. Professionals in this field often use design software like Adobe Illustrator and need a strong understanding of branding and consumer appeal. The job outlook remains positive as companies prioritize innovative packaging solutions to enhance customer experience.

What is the highest paid design job?

In the field of package design, senior roles such as Creative Director or Design Director tend to have the highest salaries, often exceeding six figures, especially in large companies or agencies. These positions require extensive experience, leadership skills, and proficiency with design tools like Adobe Creative Suite and 3D modeling software.

What does a package designer do?

A package designer creates the visual and structural design of product packaging to attract consumers and communicate brand identity. They use graphic design tools and knowledge of materials to develop functional, appealing packaging that meets safety and regulatory standards. The role often involves collaboration with marketing, product development, and manufacturing teams.

What is the difference between Package Design vs Graphic Designer?

AspectPackage DesignGraphic Designer
CredentialsDesign degree or related certificationDesign degree or related certification
Work EnvironmentPackaging companies, branding agencies, manufacturingAdvertising agencies, media companies, freelance
Industry UsageProduct packaging, branding, retailMarketing materials, digital media, branding

Package Design focuses on creating packaging solutions for products, emphasizing structural and visual aspects of packaging. Graphic Designers work on visual content across various media, including branding, advertising, and digital design. While both roles require design skills and similar credentials, Package Designers specialize in packaging materials and structures, whereas Graphic Designers have a broader scope in visual communication across multiple platforms.

How do you get into package design?

To pursue a career in package design, develop skills in graphic design, illustration, and 3D modeling using tools like Adobe Illustrator and Photoshop. A relevant degree in graphic design, industrial design, or a related field can be helpful, along with building a portfolio to showcase your work and gaining experience through internships or freelance projects.
More about Package Design jobs
What cities are hiring for Package Design jobs? Cities with the most Package Design job openings:
What are the most commonly searched types of Package Design jobs? The most popular types of Package Design jobs are:
What states have the most Package Design jobs? States with the most job openings for Package Design jobs include:
Package Design jobs near you
Infographic showing various Package Design job openings in the United States as of July 2026, with employment types broken down into 89% Full Time, 8% Part Time, and 3% Contract. Highlights an 87% Physical, 3% Hybrid, and 10% Remote job distribution, with an average salary of $37,374 per year, or $18 per hour.
Sr. Engineer, Package Design

Sr. Engineer, Package Design

SiTime Corporation

Santa Clara, CA • On-site

$138K - $190K/yr

Full-time

Medical, Dental, Vision, Life, Retirement

Re-posted 7 days ago

Job description

About SiTime


SiTime is the Precision Timing company.


Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT.


Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com.


Job Summary


The Senior Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules, all of which incorporate custom-designed MEMS and CMOS components.

Responsibilities:

  • Develop new packaging technology for SiTime’s MEMS-based timing solutions
  • Lead activities for package design, development, and release-to-production
  • Develop, manage, and analyze DoEs running locally and overseas
  • Manage development activities at OSATs
  • Work with OSATs to prototype and test new custom package designs
  • Ensure new technologies achieve required performance, reliability, and quality requirements
  • Lead troubleshooting activities related to package design or performance


Qualifications & Requirements:

  • M.S or PhD. Degree in Mechanical Engineering, Material Science, or other relevant field
  • 5+ years’ experience in semiconductor IC packaging technology and methodology
  • Experience managing overseas OSATs to bring products into production
  • Knowledge of leadframe-based, flip-chip, and substrate-based packages
  • Experience with flip-chip and bumping technologies
  • Understanding of thermal, stress, and electrical considerations in package design
  • Hands-on experience with CAD software (AutoCAD preferred but not required)
  • The desire to work in a fast-paced, challenging, and risk-taking environment

Desired Characteristics & Attributes:

  • Understanding of thermal, mechanical, and electrical modeling for semiconductor packages
  • Understanding of material characterization techniques (DMA, TMA, TGA, etc.)

Compensation Range:

At SiTime, we believe great work deserves great rewards. We offer a comprehensive and highly competitive compensation package designed to attract top talent.


The annual base salary range for this role is $138,800.00 - $190,850.00. The final offer is determined by factors such as location, experience, education, and training.


In addition to base salary, this role is eligible for a quarterly bonus tied to the achievement of innovation goals—reflecting our commitment to recognizing meaningful impact. We also offer equity grants, providing a meaningful opportunity to share in the company’s future growth and success.

Benefits offered: 401k plan, health and wellness that includes medical, dental, vision, life, parental leave, legal services, and time off plans.


SiTime is an Equal Opportunity Employer. We treat each person fairly and we do not tolerate discrimination or harassment against anyone on the basis of any protected characteristics, including race, color, religion, national or ethnic origin, sex, sexual orientation, gender identity or expression, age, disability, pregnancy, political affiliation, protected veteran status, protected genetic information, or marital status or other characteristics protected by law. SiTime participates in the E-Verify program.

Learn More about SiTime: Review the Get to Know SiTime section of our career page to explore our culture, values, and what makes us unique.

  • Innovation on Top – Philosophies of Innovation with Rajesh Vashist
  • Fabrication Knowledge – An Interview with Rajesh Vashist
  • SiTime Corporation – YouTube

#LI-SITIME