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Position Summary:

The Process Engineering Manager - (Metrology, ETest, Failure Analysis, Tape & Reel & Yield) leads a team of process engineers and technical contributors responsible for wafer fabrication process development, sustaining, yield improvement, process control, and technology transfer activities across assigned modules. This role provides senior technical and people leadership across metrology, inspection, test interface, yield analysis, data-driven process improvement, and related module integration in a cleanroom manufacturing environment.

Primary Scope: Metrology, inspection, test interface, yield analysis, process control, sustaining, development, qualification, and transfer.

Major Area of Accountability:

• Lead the engineering team through clear goals, strong performance management, coaching, development, and succession planning.
• Build and strengthen technical capability through knowledge sharing, development planning, and meaningful delegation.
• Drive process development, optimization, qualification, and sustaining across metrology, inspection, test interface, and yield analysis.
• Lead rootcause investigations, corrective actions, and yield/defect reduction using strong statistical and engineering methods.
• Partner crossfunctionally to resolve complex technical issues, support new technology introductions, maintain compliance, and communicate priorities and risks to leadership.

Required Qualifications:

Education

• B.S., M.S., or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, or another relevant engineering discipline.

Experience and/or Training

• Minimum of 15 years of experience in a wafer fabrication cleanroom environment.
• Minimum of 2 years of leadership, supervisory, or management experience, preferably with direct people leadership responsibility.

• Experience as a process or area owner for at least two relevant process areas such as provide senior-level technical direction Metrology strategy, Failure Analysis, Etest, Tape & Reel, inspection methods, yield monitoring, and module-level integration interactions.
• Experience working in CMOS, MEMS, photonics, photovoltaic, or heterogeneous integration / advanced packaging fabrication environments.

• Demonstrated experience leading structured problem-solving efforts using 8D, 3D, Fishbone, 5 Why, fault-tree analysis, or similar methodologies.
• Strong working knowledge of DOE, SPC, process capability analysis, and statistical methods, with the ability to teach and lead others in their application.
• Demonstrated ability to lead cross-functional teams, manage multiple technical priorities, and deliver results in a fast-paced manufacturing or development environment.
• Strong interpersonal skills with the ability to influence, coach, and develop engineers and technical staff.
• Excellent written and verbal communication skills.
• Demonstrated ability to meet commitments, manage multiple projects simultaneously, and shift priorities based on business needs.
• Passion for leading teams, developing people, and building strong engineering capability.
• U.S. Citizenship is required - This position will require the holding of, or ability to obtain, a government security clearance.

Preferred Qualifications:

• Experience with Wafer Metrology, inspection systems, measurement correlation, process control plans, data systems, or yield analytics.
• Experience translating test, yield, and metrology signals into process improvement actions in a manufacturing or development fab environment.
• Advanced degree in engineering, materials science, physics, or a related technical field.
• Experience supporting both process development and production sustaining environments.
• Experience supporting government, aerospace, defense, or other high-reliability customer programs.
• Experience with security-sensitive manufacturing environments.

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