SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its ... wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its ... wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
ADVANCED PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its ... wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
ADVANCED PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its ... wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
Process Integration Engineer
Austin, TX · On-site
$92K - $206K/yr
... Lithography, Etch, Thin Film deposition for example. The scope of the job is 28nm node and above ... The Process Integration Engineering (PIE) team is focused on incoming technology transfer ...
Process Integration Engineer
Austin, TX · On-site
$92K - $206K/yr
... Lithography, Etch, Thin Film deposition for example. The scope of the job is 28nm node and above ... The Process Integration Engineering (PIE) team is focused on incoming technology transfer ...
Process Integration Engineer
$92K - $206K/yr
... Lithography, Etch, Thin Film deposition for example. The scope of the job is 28nm node and above ... The Process Integration Engineering (PIE) team is focused on incoming technology transfer ...
Process Integration Engineer
$92K - $206K/yr
... Lithography, Etch, Thin Film deposition for example. The scope of the job is 28nm node and above ... The Process Integration Engineering (PIE) team is focused on incoming technology transfer ...
Process Integration Engineer
$92K - $206K/yr
... Lithography, Etch, Thin Film deposition for example. The scope of the job is 28nm node and above ... The Process Integration Engineering (PIE) team is focused on incoming technology transfer ...
Process Integration Engineer
$92K - $206K/yr
... Lithography, Etch, Thin Film deposition for example. The scope of the job is 28nm node and above ... The Process Integration Engineering (PIE) team is focused on incoming technology transfer ...
Sr. Process Integration Engineer, SAW R&D
$93K - $121K/yr
Knowledge of the various standard semiconductor processing techniques (PVD, CVD, lithography, etch ... Skills in programming languages such as MATLAB or Python is a plus #LI-KR1 MAKE A DIFFERENCE AT ...
Sr. Process Integration Engineer, SAW R&D
$93K - $121K/yr
Knowledge of the various standard semiconductor processing techniques (PVD, CVD, lithography, etch ... Skills in programming languages such as MATLAB or Python is a plus #LI-KR1 MAKE A DIFFERENCE AT ...
Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)
Bastrop, TX · On-site
$103K - $133K/yr
... PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its experience in building ... wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)
Bastrop, TX · On-site
$103K - $133K/yr
... PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its experience in building ... wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
Process Integration Engineer
$83K - $206K/yr
NTB process integration engineer or NTB module representative (RMG module) The New Technology ... Basic understanding of unit processes including thin films deposition, lithography, etch, diffusion ...
Process Integration Engineer
$83K - $206K/yr
NTB process integration engineer or NTB module representative (RMG module) The New Technology ... Basic understanding of unit processes including thin films deposition, lithography, etch, diffusion ...
Process Integration Engineer
Austin, TX · On-site
$83K - $206K/yr
NTB process integration engineer or NTB module representative (RMG module) The New Technology ... Basic understanding of unit processes including thin films deposition, lithography, etch, diffusion ...
Process Integration Engineer
Austin, TX · On-site
$83K - $206K/yr
NTB process integration engineer or NTB module representative (RMG module) The New Technology ... Basic understanding of unit processes including thin films deposition, lithography, etch, diffusion ...
Process Integration Engineer
Austin, TX · On-site
$83K - $206K/yr
NTB process integration engineer or NTB module representative (RMG module) The New Technology ... Basic understanding of unit processes including thin films deposition, lithography, etch, diffusion ...
Process Integration Engineer
Austin, TX · On-site
$83K - $206K/yr
NTB process integration engineer or NTB module representative (RMG module) The New Technology ... Basic understanding of unit processes including thin films deposition, lithography, etch, diffusion ...
SR. SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its ... wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
SR. SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is leveraging its ... wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding ...
Yield Engineer
Taylor, TX · On-site
$92K - $206K/yr
Position Summary We are seeking an experienced yield engineer to drive yield excellence across ... process (Lithography, Etch, CMP, PVD/CVD). * Coding skills for data manipulation (Python, SQL)
Yield Engineer
Taylor, TX · On-site
$92K - $206K/yr
Position Summary We are seeking an experienced yield engineer to drive yield excellence across ... process (Lithography, Etch, CMP, PVD/CVD). * Coding skills for data manipulation (Python, SQL)
Technologist | III V Semiconductor Technology | Process Development (InP & GaAs)
Sherman, TX · On-site
... lithography, etch, deposition, CMP, implant, and backend steps. * Lead process technology transfers during development bringing to volume manufacturing. * Partner closely with Process Engineering ...
Technologist | III V Semiconductor Technology | Process Development (InP & GaAs)
Sherman, TX · On-site
... lithography, etch, deposition, CMP, implant, and backend steps. * Lead process technology transfers during development bringing to volume manufacturing. * Partner closely with Process Engineering ...
... lithography, etch, deposition, CMP, implant, and backend steps. * Lead process technology transfers during development bringing to volume manufacturing. * Partner closely with Process Engineering ...
... lithography, etch, deposition, CMP, implant, and backend steps. * Lead process technology transfers during development bringing to volume manufacturing. * Partner closely with Process Engineering ...
Technologist | III V Semiconductor Technology | Process Development (InP & GaAs)
Sherman, TX · On-site
... lithography, etch, deposition, CMP, implant, and backend steps. * Lead process technology transfers during development bringing to volume manufacturing. * Partner closely with Process Engineering ...
Technologist | III V Semiconductor Technology | Process Development (InP & GaAs)
Sherman, TX · On-site
... lithography, etch, deposition, CMP, implant, and backend steps. * Lead process technology transfers during development bringing to volume manufacturing. * Partner closely with Process Engineering ...
Technologist | III V Semiconductor Technology | Process Development (InP & GaAs)
Sherman, TX · On-site
... lithography, etch, deposition, CMP, implant, and backend steps. * Lead process technology transfers during development bringing to volume manufacturing. * Partner closely with Process Engineering ...
Technologist | III V Semiconductor Technology | Process Development (InP & GaAs)
Sherman, TX · On-site
... lithography, etch, deposition, CMP, implant, and backend steps. * Lead process technology transfers during development bringing to volume manufacturing. * Partner closely with Process Engineering ...
... e.g., lithography, etch, deposition, CMP). * Perform routine equipment checks, basic ... maintenance or engineering teams. * Follow detailed work instructions, standard operating ...
New
... e.g., lithography, etch, deposition, CMP). * Perform routine equipment checks, basic ... maintenance or engineering teams. * Follow detailed work instructions, standard operating ...
New
Sr. Principal Assembly & Test Engineer - SMT (Surface Mount Technology), Probe Card Manufacturing
Farmers Branch, TX · On-site
$87K - $119K/yr
... lithography, mechanical assembly, and electrical test teams. Key Responsibilities: SMT Process Engineering * Develop, qualify, and maintain SMT processes, solder pasteselection,solder paste injection ...
Sr. Principal Assembly & Test Engineer - SMT (Surface Mount Technology), Probe Card Manufacturing
Farmers Branch, TX · On-site
$87K - $119K/yr
... lithography, mechanical assembly, and electrical test teams. Key Responsibilities: SMT Process Engineering * Develop, qualify, and maintain SMT processes, solder pasteselection,solder paste injection ...
Sr. Principal Assembly & Test Engineer - SMT (Surface Mount Technology), Probe Card Manufacturing
Farmers Branch, TX · On-site
$87K - $119K/yr
... lithography, mechanical assembly, and electrical test teams. Key Responsibilities: SMT Process Engineering * Develop, qualify, and maintain SMT processes, solder paste selection, solder paste ...
Sr. Principal Assembly & Test Engineer - SMT (Surface Mount Technology), Probe Card Manufacturing
Farmers Branch, TX · On-site
$87K - $119K/yr
... lithography, mechanical assembly, and electrical test teams. Key Responsibilities: SMT Process Engineering * Develop, qualify, and maintain SMT processes, solder paste selection, solder paste ...
Field Service Engineer (Pflugerville/ Taylor, TX) x6
Austin, TX · On-site
$90K - $100K/yr
Support system integration, calibration, and testing processes. * Collaborate with global ... Experience with photomask, mask inspection, metrology (EUV/DUV), lithography, optics, camera ...
Field Service Engineer (Pflugerville/ Taylor, TX) x6
Austin, TX · On-site
$90K - $100K/yr
Support system integration, calibration, and testing processes. * Collaborate with global ... Experience with photomask, mask inspection, metrology (EUV/DUV), lithography, optics, camera ...
Lithography Process Engineer information
What are the key skills and qualifications needed to thrive as a Lithography Process Engineer, and why are they important?
What does a Lithography Process Engineer do?
What is the difference between Lithography Process Engineer vs Semiconductor Process Engineer?
| Aspect | Lithography Process Engineer | Semiconductor Process Engineer |
|---|---|---|
| Credentials | Bachelor's or Master's in Electrical Engineering, Materials Science, or related fields; certifications in process engineering | Bachelor's or Master's in Chemical, Electrical, or Materials Engineering; similar certifications |
| Work Environment | Cleanroom environments focused on photolithography steps in chip fabrication | Cleanroom or fab environments covering multiple process steps in semiconductor manufacturing |
| Industry Usage | Primarily in semiconductor fabrication plants, focusing on lithography processes | Across semiconductor manufacturing, including process development and production |
While both roles operate in semiconductor manufacturing and require similar technical backgrounds, the Lithography Process Engineer specializes in photolithography techniques, whereas the Semiconductor Process Engineer oversees broader process steps. The Lithography Process Engineer focuses on patterning and imaging, making their role more specialized within the manufacturing process.
What are some common challenges faced by Lithography Process Engineers and how can they be addressed?

Full-time
Posted 22 days ago
SpaceX rating
8.7
Based on 144 frontline employees who took The Breakroom Quiz
13th of 60 rated aerospace companies
Job description
SILICON PACKAGING PROCESS ENGINEER, SILICON TECHNOLOGY (STARLINK)
SpaceX is leveraging its experience building rockets and spacecraft to deploy Starlink, the world's most advanced broadband internet system. Starlink is the world's largest satellite constellation, providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system - thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together. We've only begun to scratch the surface of Starlink's potential global impact. As we continue to upgrade and expand the constellation, we're looking for best-in-class engineers to join the team.
In true SpaceX fashion, Starlink is taking the next step in vertical integration by bringing advanced silicon packaging and assembly in-house for development and manufacturing. We are looking for hands-on, dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and testing. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable to those who need it most.
RESPONSIBILITIES:
- Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems
- Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes
- Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
- Own packaging prototypes, product development, and release to production
- Select equipment and material to meet quality, reliability, cost, yield, and production targets
- Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
- Cross-functional interface with silicon design, materials, thermal, systems, and production teams
- Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond
BASIC QUALIFICATIONS:
- Bachelor's degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline
- 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable)
PREFERRED SKILLS AND EXPERIENCE:
- Advanced technical degree
- 3+ years industry experience with microelectronics packaging development
- Hands-on packaging, PCB, PCBA, or SMT assembly experience
- OSAT (outsource semiconductor assembly and test) experience
ADDITIONAL REQUIREMENTS:
- Ability to work extended hours or weekends as needed for mission critical deadlines
ITAR REQUIREMENTS:
- To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.
SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.
Applicants wishing to view a copy of SpaceX's Affirmative Action Plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to EEOCompliance@spacex.com.
About SpaceX
Sourced by ZipRecruiter
Industry
Accounting services
Company size
1,001 - 5,000 Employees
Headquarters location
Hawthorne, CA, US
Year founded
2002