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IC PACKAGE ENGINEER (STARLINK/AKOUSTIS)

Akoustis is now operating as a wholly owned subsidiary of SpaceX, providing industry leading RF filters using patented XBAW technology to help drive the mission of making human life multi-planetary and connecting the world through Starlink. We design, build, launch, and operate the world's largest constellation of satellites, enabling us to operate a global internet network unbounded by traditional ground infrastructure limitations. The root of SpaceX's success so far lies in our mission to keep all engineering and production in-house, which enables a tight feedback loop, nimble decision-making, and speedy deliverables. With millions of daily users worldwide already online, Starlink is truly a game-changer and levels the playing field for those who were previously unconnected.

We are looking for a highly skilled and motivated IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit (IC) packaging solutions. In this role, you'll play a critical part in enabling high-reliability, high-performance electronics for cutting-edge applications. You will work cross-functionally with design, manufacturing, reliability, supply chain, and failure analysis teams to deliver optimized semiconductor packaging that meets stringent thermal, mechanical, and electrical requirements. The ideal candidate will bring hands-on experience in semiconductor packaging, materials science, and electronics manufacturing processes, with a passion for technical innovation and attention to detail.

RESPONSIBILITIES:

• Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA
• Evaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical properties
• Drive thermal management strategies within packages, including simulation and implementation of heat dissipation techniques
• Define and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designs
• Utilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plus
• Apply DFM methodologies to ensure manufacturability, reliability, and testability from concept through production
• Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation
• Conduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actions
• Perform root cause analysis and data-driven troubleshooting using tools such as FMEA, SPC, and Six Sigma methodologies
• Collaborate with PCB and substrate design teams to ensure co-design compatibility and package-board integration
• Own project timelines, risks, and deliverables related to packaging initiatives and report progress to key stakeholders

BASIC QUALIFICATIONS:

• Bachelor's degree in mechanical Engineering, packaging Engineering, materials science, electrical Engineering, or or other engineering discipline
• 1+ year of experience designing, qualifying, or implementing IC packaging solutions (internships and academic projects are applicable)

PREFERRED QUALIFICATIONS:

• 2+ years of hands-on experience with semiconductor packaging technologies, including:
  • Flip-chip, wire bond, WLP, LGA, CSP, QFN
  • Organic/inorganic substrates and PCB manufacturing
• Deep understanding of packaging materials and their thermal, mechanical, and electrical properties
• Familiarity with thermal management techniques for power-dense or mission-critical electronics
• Experience with reliability testing, including JEDEC and IPC standards (e.g., thermal cycling, uHAST, HTS, vibration)
• Knowledge of assembly processes: SMT, die attach, reflow soldering, encapsulation, underfill, etc.
• Strong analytical skills with expertise in:
  • Root Cause Analysis
  • Statistical Process Control (SPC)
  • Six Sigma / Lean tools
  • Failure Mode and Effects Analysis (FMEA)
• Experience with EDA/CAD tools such as AutoCAD (required); ANSYS or COMSOL (a plus)
• Proven ability to lead cross-functional efforts across design, reliability, manufacturing, and supply chain
• Strong project management, organizational, and communication skills

ADDITIONAL REQUIREMENTS:

• Must be willing to work extended hours and weekends as needed to meet critical milestones
• Ability to travel up to 20% domestically and internationally for supplier and manufacturing support
• Ability to perform light physical tasks (lifting up to 25 lbs, handling packaging samples)