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Internship Packaging Engineer Jobs (NOW HIRING)

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the ... and/or internship experiences. Minimum Qualifications * PhD degree in Mechanical Engineering ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

As a Packaging Module Development Engineer, you will: • Contribute to the advancement of ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

INTEL

Packaging Module Development Engineer

Phoenix, AZ · On-site

$127K - $179K/yr

... packaging technology development and partner engineering groups on process/technology maturity for ... Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or ...

PsiQuantum

Associate Optical Packaging Engineer

Milpitas, CA

$147K - $190K/yr

The Associate Engineer will build fiber-coupled optical packages with photonic chips and work ... internships and research experience may be considered). * Basic understanding of optical alignment ...

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How much do internship packaging engineer jobs pay per hour?

As of Jun 11, 2026, the average hourly pay for internship packaging engineer in the United States is $19.31, according to ZipRecruiter salary data. Most workers in this role earn between $16.11 and $20.91 per hour, depending on experience, location, and employer.

What is the difference between Internship Packaging Engineer vs Packaging Engineer?

AspectInternship Packaging EngineerPackaging Engineer
QualificationsEnrolled in or recent graduate of relevant engineering or packaging programBachelor's or higher in packaging, mechanical, or industrial engineering
Work EnvironmentInternship setting, often in manufacturing or R&D departmentsFull-time professional role in manufacturing, design, or supply chain
ResponsibilitiesAssisting with packaging design, testing, and process improvementsDesigning, testing, and implementing packaging solutions independently
Experience LevelEntry-level, learning-focusedMid-level professional with some experience

The main difference between an Internship Packaging Engineer and a Packaging Engineer is experience and responsibility. Internships are designed for students or recent graduates gaining initial industry exposure, while Packaging Engineers are full-time professionals responsible for designing and optimizing packaging solutions.

What cities are hiring for Internship Packaging Engineer jobs? Cities with the most Internship Packaging Engineer job openings:
What are the most commonly searched types of Packaging Engineer jobs? The most popular types of Packaging Engineer jobs are:
What states have the most Internship Packaging Engineer jobs? States with the most job openings for Internship Packaging Engineer jobs include:
Internship Packaging Engineer jobs near you
Packaging Module Development Engineer

Packaging Module Development Engineer

INTEL

Phoenix, AZ • On-site

$127K - $179K/yr

Full-time

Medical, Retirement, PTO

This job post has expired today. Applications are no longer accepted.

Intel rating

8.8

Company rating: 8.8 out of 10

Based on 143 frontline employees who took The Breakroom Quiz

8th of 139 rated electronics manufacturers

Job description

Job Description

The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing.
The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by:


• Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms.
• Collaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale.
• Managing equipment development, including pathfinding, new equipment definition, equipment selection, technology development, and high-volume manufacturing.
• Managing projects to meet product development timelines.
• Applying formal education and judgment to solve technical problems.
• Providing sustaining support for equipment performance and process health in high-volume manufacturing.
• Responding promptly to foundry customer requests and events.
The ideal candidate will demonstrate:


• Technical leadership, strategic planning, and critical thinking.
• Ability to coach and develop technical teams.
• Tolerance for ambiguity and adaptability in a dynamic environment.
• Flexibility in managing changing priorities and responsibilities.
• Experience leading teams in a highly matrixed organization.
• Initiative and ability to work independently.
• Strong communication, influencing, technical, and analytical skills.
This position requires regular onsite presence.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences.
Minimum Qualifications

  • PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; OR
  • Master’s degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field.
  • Candidates who are within four (4) months of completing the required degree are eligible to apply.
  • Minimum 1+ years of experience in the following:
  • Mechanical design, equipment development, or manufacturing systems, preferably within semiconductor or advanced manufacturing environments.
  • Strong experimental background, including hands-on laboratory or prototype development experience.
  • At least one first-author publication in a peer-reviewed technical journal for PhD candidates.
Posting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $127,400.00-$179,900.00
*Salary range dependent on a number of factors including location and experienceWorking ModelThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968

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