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Internship Packaging Designer Jobs (NOW HIRING)

Silicon Packaging Design Engineer

Phoenix, AZ · On-site

$135K/yr

Drive the physical layout and routing of package designs, ensuring alignment with silicon, package ... experience, internship experiences and or schoolwork/classes/research. This position is not ...

Drive the physical layout and routing of package designs, ensuring alignment with silicon, package ... experience, internship experiences and or schoolwork/classes/research. This position is not ...

Electrical Designer

Chicago, IL · On-site

$80K - $95K/yr

Prepare feasibility studies and schematic design packages of lighting, power systems, etc ... Our robust internship program recognizes undergraduate and graduate students from across the world ...

Lighting Designer

Chicago, IL · On-site +1

$70K - $85K/yr

Prepare feasibility studies and schematic design packages of lighting, lighting control systems ... Our robust internship program recognizes undergraduate and graduate students from across the world ...

Lighting Designer

Chicago, IL · On-site

$70K - $85K/yr

Prepare feasibility studies and schematic design packages of lighting, lighting control systems ... Our robust internship program recognizes undergraduate and graduate students from across the world ...

Prepare feasibility studies and schematic design packages of lighting, power systems, etc ... Our robust internship program recognizes undergraduate and graduate students from across the world ...

... of experience designing, qualifying, or implementing packaging solutions (internships and project work are applicable) PREFERRED SKILLS AND EXPERIENCE: * 2+ years of experience working in a ...

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Internship Packaging Designer information

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$6

$16

$23

How much do internship packaging designer jobs pay per hour?

As of Jun 24, 2026, the average hourly pay for internship packaging designer in the United States is $16.33, according to ZipRecruiter salary data. Most workers in this role earn between $14.42 and $19.23 per hour, depending on experience, location, and employer.

What is the difference between Internship Packaging Designer vs Packaging Designer?

AspectInternship Packaging DesignerPackaging Designer
CredentialsTypically pursuing or recently completed relevant educationProfessional certification or degree in design or related field
Work EnvironmentInternship setting, often in a corporate or agency environmentFull-time or freelance roles in design firms or manufacturing companies
ResponsibilitiesAssisting with design concepts, learning industry standardsCreating and developing packaging designs independently
Experience LevelEntry-level, learning-focusedMid-level or experienced professional

The main difference is that an Internship Packaging Designer is a learning role aimed at gaining experience, while a Packaging Designer is a professional role with established skills and responsibilities. Interns focus on assisting and learning, whereas experienced designers handle complete projects independently.

What are the key skills and qualifications needed to thrive as an Internship Packaging Designer, and why are they important?

To thrive as an Internship Packaging Designer, you typically need a solid foundation in graphic design principles, creativity, and proficiency with design software, often supported by coursework in design or a related field. Familiarity with Adobe Creative Suite (Illustrator, Photoshop, InDesign) and knowledge of packaging materials and production processes are essential technical requirements. Strong attention to detail, collaboration, and effective communication help interns stand out when working with design teams and clients. These skills ensure the creation of visually appealing, functional, and brand-consistent packaging that meets both client needs and production standards.

What are Internship Packaging Designers?

Internship Packaging Designers are students or recent graduates who work temporarily with companies to assist in creating and developing packaging concepts for products. They typically support senior designers by brainstorming ideas, preparing design mockups, and ensuring packaging meets branding and functional requirements. This role helps interns gain practical experience in design software, materials selection, and the overall packaging development process. It also provides exposure to industry standards and teamwork within a creative environment.

What types of projects and responsibilities can an Internship Packaging Designer expect during their placement?

As an Internship Packaging Designer, you can expect to work on real-world design projects such as creating packaging concepts, assisting in developing prototypes, and preparing design files for production. You'll likely collaborate with senior designers, marketing teams, and production staff to ensure the packaging meets branding and functional requirements. Interns often participate in brainstorming sessions, receive feedback on their work, and learn about printing processes and material selection. This hands-on experience provides valuable insights into industry standards and helps build a strong portfolio for future career opportunities.
What cities are hiring for Internship Packaging Designer jobs? Cities with the most Internship Packaging Designer job openings:
What are the most commonly searched types of Packaging Designer jobs? The most popular types of Packaging Designer jobs are:
What states have the most Internship Packaging Designer jobs? States with the most job openings for Internship Packaging Designer jobs include:
Packaging Module Development Engineer

Packaging Module Development Engineer

Intel Corporation

Phoenix, AZ • On-site

Full-time

Medical, Retirement, PTO

This job post has expired 2 days ago. Applications are no longer accepted.


Intel rating

8.7

Company rating: 8.7 out of 10

Based on 144 frontline employees who took The Breakroom Quiz

10th of 139 rated electronics manufacturers


Job description

Job Details:
Job Description:
Join our team as a Packaging Module Development Engineer, where you will play a pivotal role in advancing Intel's next-generation assembly and packaging platform technologies. This role is integral to driving innovation in semiconductor packaging, enabling Intel to remain at the forefront of the technology landscape. You will directly contribute to the development, optimization, and integration of processes and equipment that shape the future of product performance, quality, and reliability. By leveraging your technical expertise, you will help ensure that Intel delivers exceptional results to meet the demands of a rapidly evolving industry.
Key Responsibilities:
  • Design and develop assembly processes and equipment to enable future packaging technologies.
  • Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
  • Create and maintain specifications for processes and equipment using Design of Experiments (DOE) and data analysis principles.
  • Conduct tests under simulated field conditions, including heat, humidity, temperature cycling, and dynamic forces, to evaluate silicon and packaging technologies.
  • Oversee the manufacturability of package designs and manage their manufacturing cycles.
  • Establish material specifications and collaborate with supplier quality and procurement teams to ensure compliance with performance requirements.
  • Develop innovative techniques, tools, and quality screens to assess packaging quality and reliability.
  • Set reliability standards based on a strong understanding of failure mechanisms and influence design, material selection, and process development accordingly.
  • Provide consultation and technical support for packaging process improvements and respond to customer and client needs.
  • Drive standardization in product qualification and manufacturing quality systems while collaborating with engineering teams to meet key product milestones.

Qualifications:
You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Relevant experience can be obtained through schoolwork, classes, project work, internships, and/or military experience. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
  • Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field with 1+ years of relevant experience or Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field.
  • Experience listed above should be a combination of the following:
    • Familiarity with equipment adjustment, process characterization, and manufacturability or electronics assembly.

Preferred Qualifications
  • Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
  • Hands-on experience in a technology manufacturing environment or semiconductor packaging processes.
  • Demonstrated ability to collaborate with cross-functional teams and contribute to time-sensitive projects.

We invite you to apply and bring your expertise, creativity, and passion for innovation to Intel. Be a part of our mission to create world-class packaging solutions and help shape the future of technology.
Job Type:
College Grad
Shift:
Shift 1 (United States of America)
Primary Location:
US, Arizona, Phoenix
Additional Locations:
Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Posting Statement:
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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About Intel

Sourced by ZipRecruiter

Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Industry

Manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

Year founded

1968