This role directly supports ASM's mission to accelerate next-generation semiconductor manufacturing ... or internship experience in materials science, chemical engineering, or physics * Hands-on ...
This role directly supports ASM's mission to accelerate next-generation semiconductor manufacturing ... or internship experience in materials science, chemical engineering, or physics * Hands-on ...
We provide growth and development opportunities through our Internal Internship Program. Experience ... or engineer is needed, in addition to making suggestions for improvement to productivity.
We provide growth and development opportunities through our Internal Internship Program. Experience ... or engineer is needed, in addition to making suggestions for improvement to productivity.
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
Yield Engineer
Hillsboro, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Yield Engineer
Hillsboro, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Yield Engineer
Lafayette, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Yield Engineer
Lafayette, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
Yield Engineer
Vernonia, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Yield Engineer
Vernonia, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Module Development Engineering Manager
Hillsboro, OR · On-site
$133K - $219K/yr
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
Module Development Engineering Manager
Hillsboro, OR · On-site
$133K - $219K/yr
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
Yield Engineer
Portland, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Yield Engineer
Portland, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
Hardware Design Engineer
Beaverton, OR · On-site
Support manufacturing and sustaining engineering activities, including troubleshooting production ... Internship or project experience involving hardware or PCB design. * Experience with schematic ...
Hardware Design Engineer
Beaverton, OR · On-site
Support manufacturing and sustaining engineering activities, including troubleshooting production ... Internship or project experience involving hardware or PCB design. * Experience with schematic ...
Module Development Engineering Manager
Hillsboro, OR · On-site
$133K - $219K/yr
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
Module Development Engineering Manager
Hillsboro, OR · On-site
$133K - $219K/yr
... impact on Intel's global manufacturing capabilities and future technological roadmap. Key ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: - Bachelor ...
Repair and maintenance of complex IC manufacturing equipment (pneumatics, robotics, electronics ... internships, teaching assistance, research work, or military experience). * Will have completed at ...
Repair and maintenance of complex IC manufacturing equipment (pneumatics, robotics, electronics ... internships, teaching assistance, research work, or military experience). * Will have completed at ...
Packaging Engineer
Portland, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Packaging Engineer
Portland, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Packaging Engineer
Lafayette, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Packaging Engineer
Lafayette, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Packaging Engineer
Hillsboro, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Packaging Engineer
Hillsboro, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Packaging Engineer
Vernonia, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
Packaging Engineer
Vernonia, OR · Hybrid
... manufacturability for next-generation hybrid bonding technologies, enabling Intel's leadership in ... You will bring deep technical expertise in hybrid bonding process or equipment engineering ...
We provide growth and development opportunities through our Internal Internship Program. Experience ... or engineer is needed, in addition to making suggestions for improvement to productivity.
We provide growth and development opportunities through our Internal Internship Program. Experience ... or engineer is needed, in addition to making suggestions for improvement to productivity.
You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: * Bachelor ...
You will play a vital role in overseeing the wafer manufacturing process and ensuring a seamless ... internship experiences and or schoolwork/classes/research. Minimum Qualifications: * Bachelor ...
Internship Manufacturing Engineering information
See Oregon salary details
$11.69 - $13.47
2% of jobs
$13.47 - $15.25
4% of jobs
$17.03 is the 25th percentile. Wages below this are outliers.
$15.25 - $17.03
19% of jobs
$17.03 - $18.81
24% of jobs
The median wage is $18.92 / hr.
$18.81 - $20.59
17% of jobs
$21.65 is the 75th percentile. Wages above this are outliers.
$20.59 - $22.37
16% of jobs
$22.37 - $24.15
6% of jobs
$24.15 - $25.92
5% of jobs
$25.92 - $27.70
3% of jobs
$27.70 - $29.48
3% of jobs
$29.48 - $31.26
1% of jobs
$11
$20
$31
How much do internship manufacturing engineering jobs pay per hour?
What is the difference between Internship Manufacturing Engineering vs Manufacturing Engineer?
| Aspect | Internship Manufacturing Engineering | Manufacturing Engineer |
|---|---|---|
| Credentials | Typically pursuing or recently completed a relevant degree; no professional certification required | Bachelor's degree in engineering or related field; professional certifications optional |
| Work Environment | Internship setting, often in manufacturing plants or corporate offices, supervised closely | Full-time role in manufacturing facilities, responsible for process improvements and production oversight |
| Responsibilities | Assisting with projects, learning manufacturing processes, supporting engineering teams | Designing, implementing, and optimizing manufacturing processes, troubleshooting production issues |
In summary, an Internship Manufacturing Engineering is a temporary, learning-focused position for students or recent graduates, while a Manufacturing Engineer is a full-time professional responsible for ongoing manufacturing process improvements and operations.
What does an internship manufacturing engineer do?
What skills and qualifications are needed to thrive as an internship manufacturing engineer?
What is an internship manufacturing engineering?

Job description
For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we're more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
Engineer, Field Process (Hillsboro, OR)
As a Field Process Engineer, you will help expand ASM's advanced film technologies at a customer site in Oregon by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, Epitaxy, and LPCVD processes. You will serve as the technical interface between customer engineering teams and ASM's global Business Unit, ensuring smooth and successful introduction of new products and processes. This role directly supports ASM's mission to accelerate next-generation semiconductor manufacturing through collaboration, technical excellence, and strong customer partnerships.
What you will be working on
- Support New Product Introduction (NPI) by training with the Business Unit to gain deep expertise in new deposition processes and hardware
- Lead the introduction, qualification, and transfer of new processes to the customer site
- Partner closely with field hardware engineers and Business Unit teams to troubleshoot new products and develop process or hardware improvement proposals
- Design and execute on-site experiments with customers to support development, integration, and continuous improvement projects
- Escalate technical issues in a timely manner to maintain scope, timelines, and customer alignment
- Document key learnings during NPI and ensure effective knowledge transfer to local service and manufacturing teams
- Analyze baseline system and process performance against technology-node requirements to identify gaps
- Perform structured problem solving and root-cause analysis on process or system nonconformances
- Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption
- Support process transfer to high-volume manufacturing (HVM) fabs, creating and maintaining best-known methods (BKMs) and documentation
- Maintain strong discipline around IP boundaries, customer communication, and escalation leadership
What we are looking for
- MS degree with relevant internship, research, or academic project experience, or PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics
- Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, epitaxy, or LPCVD reactors through internships, research, or academic projects
- Demonstrated troubleshooting and structured problem-analysis skills (e.g., KT, FMEA, Ishikawa, 7-step methodologies)
- Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings
- Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin-film characterization
- Willingness and ability to travel for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations
- Strong written and verbal communication skills with the ability to clearly explain technical concepts
- Ability to maintain confidentiality and uphold IP boundaries
What sets you apart
- Internship, research, or academic experience with ASM ALD, PEALD, PECVD, epitaxy, or vertical furnace LPCVD equipment
- Demonstrated success optimizing deposition processes in research, pilot, or HVM-adjacent environments
- Exposure to customer-facing technical discussions, presentations, or reviews
- Experience supporting process transfer, scale-up, or qualification activities
- Proven ability to collaborate cross-functionally and contribute to structured action plans during technical challenges or escalations
Apply today to be part of what's next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what's possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.
About Action Seating & Mobility
Sourced by ZipRecruiter
Industry
Medical equipment and supplies manufacturing
Company size
11 - 50 Employees
Headquarters location
Tulsa, OK, US
Year founded
2007