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Internship Ansys Fea Jobs in California (NOW HIRING)

Dynamics Engineer

Los Angeles, CA · On-site

$125K - $200K/yr

... internship, and/or professional experience. * 1+ year of experience in structural dynamic analysis or modeling using FEA tools such as Ansys, Femap, Nastran, Abaqus, LS-Dyna, or similar. * Excellent ...

Dynamics Engineer

Los Angeles, CA · On-site

$125K - $200K/yr

... internship, and/or professional experience. * 1+ year of experience in structural dynamic analysis or modeling using FEA tools such as Ansys, Femap, Nastran, Abaqus, LS-Dyna, or similar. * Excellent ...

Mechanical Engineer

Los Angeles, CA · On-site

$91K - $140K/yr

... internships and significant student project experience qualify) Preferred Skills and Experience ... Proficiency in CAD (NX preferred), FEA (Ansys preferred), and PLM tools (Teamcenter preferred)

... internships and significant student project experience qualify) Preferred Skills and Experience ... Proficiency in CAD (NX preferred), FEA (Ansys preferred), and PLM tools (Teamcenter preferred)

Mechanical Engineer

Los Angeles, CA · On-site

$91K - $140K/yr

... internships and significant student project experience qualify) Preferred Skills and Experience ... Proficiency in CAD (NX preferred), FEA (Ansys preferred), and PLM tools (Teamcenter preferred)

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Internship Ansys Fea information

What is the difference between Internship Ansys Fea vs Internship Mechanical Engineer?

AspectInternship Ansys FeaInternship Mechanical Engineer
Required SkillsBasic knowledge of FEA software, Ansys, CAD toolsFundamentals of mechanical design, CAD, and analysis
Work EnvironmentSimulation labs, software-focused tasksDesign, testing, and manufacturing settings
Industry UsagePrimarily in engineering simulation and product developmentBroader manufacturing, design, and R&D sectors

Internship Ansys Fea focuses on simulation and finite element analysis using Ansys software, ideal for those interested in computational modeling. Internship Mechanical Engineer covers a wider range of mechanical design and testing tasks. Both roles require foundational engineering knowledge, but Ansys Fea internships are more software-centric, while Mechanical Engineer internships involve hands-on design and testing activities.

What are the most commonly searched types of Ansys Fea jobs in California?

The most popular types of Ansys Fea jobs in California are:

What cities in California are hiring for Internship Ansys Fea jobs?

Cities in California with the most Internship Ansys Fea job openings:

IC Packaging Thermal / Mechanical Simulation Co-Op (Winter/Spring, January - June 2027)

Irvine, CA

Skyworks
Construction • 201 - 500 employees

$26 - $47.50/hr

Full-time

Posted 11 days ago


Job description

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 78217

Job Description:

Description

The Skyworks Packaging team is looking for a IC Packaging Thermal / Mechanical Simulation co-op student. This internship will focus on integrated cirucit (IC) packaging process flow and support the development and reliability assessment of advanced semiconductor packages through thermal and mechanical finite element analysis (FEA).

The internship will be for Winter/Spring (January - June 2027) timeframe.

Responsibilities

-Work with engineers to understand package structures, materials, and manufacturing processes used in semiconductor packaging.

-Learn and use finite element analysis (FEA) tools such as ANSYS to evaluate package behavior under thermal and mechanical loading conditions.

-Support analysis of package warpage, stress, deformation, and temperature distribution.

-Help prepare engineering reports, presentations, and summaries of simulation findings.

-Develop basic automation scripts or data analysis tools using ANSYS APDL scripting / Python or similar software.

-Collaborate with cross-functional teams including package design, reliability, process, and product engineers.

Required Experience and Skills

-Pursuing a Ph.D. degree in Mechanical Engineering, Materials Science, Aerospace Engineering, Engineering Physics, or a related field.

-Basic understanding of mechanics, heat transfer, and engineering fundamentals.

-Exposure to CAD, FEA, Python, or other engineering software is a plus.

-Strong analytical, problem-solving, and communication skills.

-Eagerness to learn semiconductor packaging technologies and simulation methodologies.

The typical pay range for an Engineering intern across the U.S. is currently USD $26.00 - $47.50 per hour and for a Non-Engineering intern across the U.S. is currently USD $22.50 - $42.00 per hour. Starting pay will depend on level of education, the ultimate job duties and requirements, and work location. Skyworks has different pay ranges for different work locations in the U.S.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.


Skyworks logo

About Skyworks

Sourced by ZipRecruiter

We are empowering the wireless networking revolution, connecting people, places and things around the world. As the demand for ubiquitous, “always-on” connectivity increasingly expands, our innovative, high performance analog semiconductors are enabling breakthrough communication platforms from global industry leaders – changing the way we live, work, play and learn. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

Industry

Construction

Company size

201 - 500 Employees

Headquarters location

Buffalo, NY, US