ZipRecruiter

Log In

1

Ic Package Assembly Process Engineer Jobs (NOW HIRING)

Socket.dev

IC Packaging Engineer - WLP

California, MO · On-site

$90 - $130/hr

Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging ... Solution-oriented mindset with strong fundamentals in engineering physics * Good program management ...

Valeo

Assembly Process Engineer

Smyrna, TN · On-site

Care.Share. You will receive a best in class, total compensation package that provides a ... Engineer, that arise during the Assembly process to ensure quality components are being ...

Analog Devices

Staff Semi Packaging Engineer

San Jose, CA · On-site

$130K - $188K/yr

We are looking for a highly motivated Packaging Engineer who will drive IC package and power module ... Knowledge in IC package reliability requirements, failure analysis techniques, assembly process ...

Analog Devices

Staff Semi Packaging Engineer

San Jose, CA · On-site

$130 - $188/hr

We are looking for a highly motivated Packaging Engineer who will drive IC package and power module ... Knowledge in IC package reliability requirements, failure analysis techniques, assembly process ...

Analogdevices

Staff Semi Packaging Engineer

San Jose, CA · On-site

$130K - $188K/yr

We are looking for a highly motivated Packaging Engineer who will drive IC package and power module ... Knowledge in IC package reliability requirements, failure analysis techniques, assembly process ...

Valeo

Assembly Process Engineer

Smyrna, TN · On-site

Care.Share. You will receive a best in class, total compensation package that provides a ... Engineer, that arise during the Assembly process to ensure quality components are being ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all ... Own the end-to-end package design process, including substrate layout and IC package design, while ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all ... Own the end-to-end package design process, including substrate layout and IC package design, while ...

Etched

IC Package Engineer

Cupertino, CA · On-site

$2.0K/mo

IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all ... Own the end-to-end package design process, including substrate layout and IC package design, while ...

previous pagenext page

Showing results 21-40

All JobsManufacturing JobsProduct Manufacturing JobsAssembly Line Worker JobsIc Package Assembly Process Engineer Jobs

Ic Package Assembly Process Engineer information

See salary details

$49.5K

$92K

$142.5K

How much do ic package assembly process engineer jobs pay per year?

As of Sep 4, 2026, the average yearly pay for ic package assembly process engineer in the United States is $92,018.00, according to ZipRecruiter salary data. Most workers in this role earn between $74,500.00 and $103,000.00 per year, depending on experience, location, and employer.

What is the difference between Ic Package Assembly Process Engineer vs IC Design Engineer?

AspectIc Package Assembly Process EngineerIC Design Engineer
Primary FocusManufacturing, assembly processes, and production efficiency of IC packagesDesign and development of integrated circuit architectures and layouts
Required SkillsProcess engineering, manufacturing techniques, quality controlElectronic design, simulation, circuit theory
Work EnvironmentManufacturing plants, production linesDesign labs, R&D centers
Common CertificationsProcess engineering certifications, Six SigmaElectrical engineering degrees, CAD tools proficiency

The Ic Package Assembly Process Engineer focuses on the manufacturing and assembly processes of IC packages, ensuring efficient production and quality. In contrast, the IC Design Engineer concentrates on creating the electronic designs and layouts of integrated circuits. While both roles require a strong understanding of electronics, their daily tasks, skills, and work environments differ significantly, catering to different stages of the IC development lifecycle.

More about Ic Package Assembly Process Engineer jobs

What cities are hiring for Ic Package Assembly Process Engineer jobs?

Cities with the most Ic Package Assembly Process Engineer job openings:

What states have the most Ic Package Assembly Process Engineer jobs?

States with the most job openings for Ic Package Assembly Process Engineer jobs include:

What job categories do people searching Ic Package Assembly Process Engineer jobs look for?

The top searched job categories for Ic Package Assembly Process Engineer jobs are:

Ic Package Assembly Process Engineer jobs near you
Infographic showing various Ic Package Assembly Process Engineer job openings in the United States as of August 2026, with employment types broken down into 1% As Needed, 79% Full Time, 16% Part Time, 3% Contract, and 1% Nights. Highlights an 92% Physical, 2% Hybrid, and 6% Remote job distribution, with an average salary of $92,018 per year, or $44.2 per hour.

IC Packaging Engineer - WLP

Socket.dev

California, MO • On-site

$90 - $130/hr

Other

Posted 16 days ago

Job description

DESCRIPTION

Do you like to work on groundbreaking technology? Have a passion for creating amazing products? Our team is looking for a curious, detail-oriented IC Packaging Engineer, with a strong technical foundation and a love for excellence and precision, to help deliver extraordinary results. In this role, you will contribute to package concept exploration, support package selection and configuration studies, and grow into ownership of package integration across SoC and advanced packaging projects.

Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.

MINIMUM QUALIFICATIONS
  • Minimum requirement of a bachelors degree
PREFERRED QUALIFICATIONS
  • MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab. Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards. Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
  • Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
  • Ability to work independently and orchestrate projects with cross functional teams
  • Solution-oriented mindset with strong fundamentals in engineering physics
  • Good program management skills.
#J-18808-Ljbffr

Apply