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High Speed Adc Design Engineer Jobs (NOW HIRING)

WI ยท On-site

$185K/yr

... band filters, High Speed ADC to send data to the Modem. Reverse Chain namely for Transmitter ... The Design Engineer in RF Connectivity gets introduced to a Holistic view of the product including ...

Senior Hardware Engineer

Milpitas, CA ยท Hybrid

$128K - $171K/yr

S. in Electrical Engineering or a related field * 5+ years of hands-on PCB design and hardware ... Demonstrated experience characterizing high-speed ADC or DAC devices * High-speed/RF PCB design ...

High-Speed Package Design Engineer

Murray Hill, NJ ยท On-site

$143K/yr

Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.

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Senior Electrical Engineer (FPGA / High-Speed / Mixed-Signal)

San Jose, CA โ€ข On-site

$121K - $164K/yr

Other

Re-posted 21 days ago


Job description

Key Responsibilities
  1. FPGA-Based System Architecture
    • Define FPGA-centric system architectures for high-throughput data processing platforms
    • Partition functionality across FPGA, ADC/DAC, and host interfaces
    • Collaborate with FPGA/FW teams on interface definition, timing, and performance
  2. High-Speed Digital & SerDes Design
    • Design and integrate high-speed interfaces including:
    • DDR4/DDR memory subsystems
    • PCIe Gen3/Gen4 interfaces
    • QSFP (10G/25G/40G/100G) links
    • 10G+ SerDes channels
    • Define routing constraints, stack-up, and impedance control
    • Ensure signal integrity, timing closure, and link stability
  3. Mixed-Signal & Analog Front-End Design
    • Design and integrate high-speed ADC/DAC signal chains
    • Data Converter Architectures (DCA)
    • Precision analog front-end (AFE) circuits
    • Develop circuits using low-noise OpAmps, filters, and gain stages
    • Optimize performance metrics such as SNR, ENOB, bandwidth, and jitter sensitivity
  4. Power System Design
    • Design multi-rail DC/DC power systems for FPGA and high-speed circuits
    • Manage power sequencing, noise, ripple, and efficiency
    • Ensure power integrity for sensitive ADC and high-speed SerDes subsystems
  5. Hardware Design & PCB Implementation
    • Own schematic design and hardware architecture (Xpedition preferred)
    • Guide PCB layout for high-layer-count, high-speed boards
    • Lead design reviews focusing on SI/PI/EMI risks
    • Ensure manufacturability (DFM) and testability (DFT)
  6. System Bring-up & Debug
    • Lead board bring-up and system integration:
      1. DDR training
      2. PCIe and SerDes link-up
      3. ADC performance validation
    • Debug issues related to:
      1. Signal integrity
      2. Jitter and noise
      3. Power coupling and system interaction
    • Use lab tools such as oscilloscopes, TDR/VNA, and protocol analyzers
  7. Cross-Functional Collaboration
    • Work closely with FPGA, firmware, software, mechanical, and system engineering teams
    • Align electrical design with system-level performance requirements
    • Drive cross-domain trade-offs
  8. Technical Leadership
    • Lead architectural decisions and technical reviews
    • Mentor junior engineers in high-speed and mixed-signal design
    • Drive structured problem-solving across complex systems
Required Qualifications
  • Bachelorโ€™s or Masterโ€™s degree in Electrical Engineering or related field
  • 8-12+ years of experience in high-speed, FPGA, or mixed-signal systems
Core Technical Requirements
  • FPGA-based system design experience
  • DDR4 memory subsystem design experience
  • PCIe / SerDes / high-speed link experience
  • ADC and analog front-end design experienceDC/DC power system design experience
Fundamentals
  • Strong understanding of:
    • Signal Integrity (SI)
    • Power Integrity (PI)
    • High-speed timing and jitter analysis
Preferred Qualifications
  • Hands-on experience with FPGA platforms (Intel / Xilinx)
  • Experience with:
    • High-speed data converters
    • Optical interfaces / QSFP modules
    • JESD204 or similar high-speed data links
  • Strong PCB design experience with high-speed constraints
  • Experience with tools such as:
    • Xpedition (Mentor / Siemens)
    • SI/PI analysis tools
Strong Plus
  • Experience in semiconductor equipment, imaging, or instrumentation systems
  • Experience with multi-board or modular systems
  • Understanding of signal-power-thermal coupling effects
  • Full product lifecycle experience (R&D -> NPI -> production)
Soft Skills
  • Strong ownership mindset and accountability
  • Ability to solve complex multi-domain engineering problems
  • Excellent communication and cross-functional collaboration skills
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