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Etch Process Engineer Jobs in California (NOW HIRING)

Process Engineer

San Francisco, CA · On-site

$150K - $250K/yr

Process Engineer Substrate is addressing one of the most important technological problems facing ... Iterating through structural designs and tuning lithography, deposition, and etch parameters to ...

... repair reverse engineering including material selection, parameter optimization, equipment ... Proven track record of technical ownership and delivery of dry etch process innovations that ...

Senior Process Engineer

San Francisco, CA · On-site

$200K - $300K/yr

Senior Process Engineer Substrate is addressing one of the most important technological problems ... Ownership of fabrication strategies in lithography, deposition, and etch, as well as designing ...

... repair reverse engineering including material selection, parameter optimization, equipment ... Proven track record of technical ownership and delivery of dry etch process innovations that ...

... repair reverse engineering including material selection, parameter optimization, equipment ... Proven track record of technical ownership and delivery of dry etch process innovations that ...

... repair reverse engineering including material selection, parameter optimization, equipment ... Proven track record of technical ownership and delivery of dry etch process innovations that ...

Process Engineer 3

Fremont, CA · On-site

$104K - $192K/yr

In this role, you will directly contribute to the Etch Product Group. What you'll do * Conduct process engineering research, development, and evaluation in support of Lam's cutting-edge semiconductor ...

Process Engineer 4

Fremont, CA · On-site

$104K - $231K/yr

... Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are ... The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ...

... Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are ... The impact you'll make As a Process Engineer at Lam, you will work with cutting-edge technology ...

PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or a semiconductor ... Demonstrated record of delivering dry etch process solutions that improved yield, reliability ...

... Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are ... The impact you'll make As a Process Engineer at Lam, you will operate on cutting-edge technology ...

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Showing results 1-20

Etch Process Engineer information

See California salary details

$48.9K

$90.8K

$140.6K

How much do etch process engineer jobs pay per year?

As of Jun 10, 2026, the average yearly pay for etch process engineer in California is $90,813.00, according to ZipRecruiter salary data. Most workers in this role earn between $73,500.00 and $101,700.00 per year, depending on experience, location, and employer.

What are the typical challenges faced by an Etch Process Engineer, and how can they be addressed?

Etch Process Engineers often encounter challenges such as maintaining process stability, optimizing etch selectivity, and minimizing defects in semiconductor manufacturing. Addressing these challenges requires strong analytical skills, attention to detail, and frequent collaboration with equipment engineers and process integration teams. Staying current with new etching techniques and maintaining thorough documentation can help resolve issues efficiently. Additionally, clear communication within cross-functional teams is essential for troubleshooting and continuous improvement.

What is the difference between Etch Process Engineer vs Plasma Process Engineer?

AspectEtch Process EngineerPlasma Process Engineer
CredentialsBachelor's in Chemical, Materials, or Electrical EngineeringBachelor's in Chemical, Materials, or Electrical Engineering
Work EnvironmentCleanroom semiconductor fabrication facilitiesCleanroom semiconductor fabrication facilities
Industry UsageSemiconductor manufacturing, microfabricationSemiconductor manufacturing, microfabrication
Job FocusEtching patterns onto wafers using chemical or plasma processesDeveloping and optimizing plasma-based processes for etching and deposition

Both roles are integral to semiconductor fabrication, often working in similar environments and requiring comparable technical backgrounds. The Etch Process Engineer primarily focuses on the etching process itself, while the Plasma Process Engineer specializes in plasma-based techniques that can include etching and deposition. Understanding these distinctions helps in choosing the right career path or job search focus.

What are the key skills and qualifications needed to thrive as an Etch Process Engineer, and why are they important?

To thrive as an Etch Process Engineer, you need a strong background in materials science, chemical engineering, or a related field, typically supported by a relevant bachelor's or master's degree. Familiarity with semiconductor fabrication tools, such as plasma etchers and process control systems, as well as knowledge of industry standards like SEMI and SPC, is essential. Strong analytical thinking, problem-solving abilities, and effective communication skills help in troubleshooting complex processes and collaborating with cross-functional teams. These skills and qualities are vital for optimizing manufacturing yields, ensuring process stability, and driving innovation in semiconductor production.

What are Etch Process Engineers?

Etch Process Engineers are specialized professionals who develop, optimize, and monitor the etching processes used in semiconductor manufacturing. They work to ensure precise removal of material from silicon wafers using chemical or plasma etching techniques, which is critical for defining micro- and nano-scale patterns on chips. Their responsibilities include process development, troubleshooting, equipment maintenance, and data analysis to improve yield and device performance. Etch Process Engineers often collaborate with other engineering teams to support new technology introductions and meet production goals.
What job categories do people searching Etch Process Engineer jobs in California look for? The top searched job categories for Etch Process Engineer jobs in California are:
What cities in California are hiring for Etch Process Engineer jobs? Cities in California with the most Etch Process Engineer job openings:
Infographic showing various Etch Process Engineer job openings in California as of June 2026, with employment types broken down into 100% Locum Tenens. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $90,813 per year, or $43.7 per hour.
Process Engineer III - Dry Etch

Process Engineer III - Dry Etch

Fujifilm

Santa Clara, CA

$135K - $165K/yr

Full-time

Posted 4 days ago


Fujifilm rating

8.3

Company rating: 8.3 out of 10

Based on 66 frontline employees who took The Breakroom Quiz

46th of 516 rated manufacturers


Job description

Fujifilm Dimatix, Inc. strives to offer a healthy work environment that promotes individual responsibility and growth, a collaborative spirit, and an atmosphere that encourages learning, professional development and achievement.

We search for the most talented and qualified people for both external and internal opportunities. At Fujifilm, performance, development and accountability are the standards to which the company and its people strive toward. And to support its employees, we offer programs that motivate, educate and promote a healthy work-life balance, which increase employee satisfaction and overall personal well-being.

Fujifilm is committed to offering a comprehensive and flexible benefit program to meet the needs of employees and their families. This flexible approach allows employees to create a program that fits their lives.  At Fujifilm, INNOVATION and PEOPLE matter.

FUJIFILM Dimatix, Inc. is an E-Verify Employer

 EO-employer-M/F/Vets/Disabled

 ATTN Staffing Services:  We do not accept unsolicited resumes.


At FUJIFILM Dimatix Inc., printing and material deposition devices are only as good as their printheads.  We are a recognized leader in the manufacturing and design of durable and productive drop-on-demand inkjet printheads that power cutting-edge systems, as well as integrated inkjet solutions that add digital inkjet capabilities to other equipment. These are part of the digitization and transformation of many applications such as commercial printing, graphics, label & packaging, additive manufacturing, ceramic tiles, textiles, electronics and life science research.


We’re looking for forward-thinkers eager to spark innovation in inkjet technology. Bring your talents to a team built on collaboration, creativity, and a passion for excellence. At FUJIFILM Dimatix, every product we make begins with the extraordinary people behind it. Join us for groundbreaking work in a flexible, engaging environment.


We’re based in two incredible locations: Lebanon, New Hampshire, surrounded by picturesque New England landscapes, and Santa Clara, California, a dynamic hub in Silicon Valley with a mix of innovation, diversity, and sunshine.


Fujifilm is globally headquartered in Tokyo with over 70,000 employees across four key business segments of healthcare, electronics, business innovation, and imaging. We are guided and united by our Group Purpose of “giving our world more smiles.” Visit: https://www.fujifilm.com/us/en/about/region/careers


Salary range for position: $135,000 - $165,000, commensurate with experience.

POSITION SUMMARY:

 

Develop and improve wafer fab processes.  Own tools and processes run on them, minimizing yield loss and maximizing process performance.  Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production.  Sustain products with cost reduction and yield improvement efforts.  Interface with other engineers to solve technical problems.  Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

Knowledge:  Having ranging experience, uses professional concepts and company objectives to resolve complex issues in creative and effective ways. 

Job Complexity:  Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results. Internal and external contacts often pertain to company plans and objectives.

 

Supervision: Determines methods and procedures on new assignments and may coordinate activities of other personnel (Team Lead). Be able to work self-directed. 

 

Experience:  Typically requires a minimum of 8 years of related experience with a Bachelor’s degree; or 6 years and a  Master’s degree’ or PhD with 3 years' experience; or equivalent work experience.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

 

·         Develop and improve wafer fab processes (Silicon Oxide, Deep Silicon, Ion Mill...etch processes).

·         Use and run wafer metrology tools to analyze problems, failures and other technical issues.

·         Use good problem solving and project management skills to solve the wide array of technical product problems.

·         Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.

·         Organize technical problem solving strategies clearly and present them effectively to all concerned parties.

·         Use statistical process control (SPC), design of experiments (DoE), and yield data to help resolve or correct all identified problems.

SUPERVISORY RESPONSIBILITIES:

 

·         None

 

 

QUALIFICATIONS:

 

To perform this job successfully, an individual must be able to perform each essential duty satisfactorily.  The requirements listed below are representative of the knowledge, skill, and/or ability required.  Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

 

REQUIRED:

·         Bachelor’s degree in Engineering, Material Science, Chemistry, or Physics with a minimum of 8 years relevant experience.  Experience should include process and design engineering work in a MEMS wafer fab.

·         Must have related experience in Plasma Etching, Ash, photo processes...

·         Ability to find root causes of wafer fab problems.

·         Excellent problem identification and problem-solving skills.

·         Ability to apply advanced mathematical concepts such as exponents, logarithms, quadratic equations, and permutations.

·         Ability to apply mathematical operations to such tasks as frequency distribution, determination of test reliability and validity, analysis of variance, correlation techniques, sampling theory, and factor analysis.

·         Ability to respond to common inquiries or complaints from internal resources and customers.

·         Must have excellent written, verbal and presentation skills, in order to effectively present information to subordinates, customers and management.

PHYSICAL DEMANDS:

 

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job.  Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

 

·         Standing, walking, using hands to finger, handle or feel, and talk or hear under one-third of the time.

·         Sitting one-third to two-thirds of the time.

 

WORK ENVIRONMENT:

 

The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job.  Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

 

·         Works in wafer fabrication and clean room environment.

·         Exposure to moderate noise levels.

·         May potentially handle hazardous waste in accordance with the safe work practices defined in Hazardous Communication and Hazardous Waste training programs. Initial training is required upon hiring status and every 3 years thereafter. Employees handling hazardous waste will insure that waste containers in their work areas are properly labeled and dated. Employees will ensure that waste containers are closed after transferring waste to them. Report any incidents involving hazardous waste to supervisor.

 

OTHER:

·         Other duties as may be assigned.

·         Each employee’s primary objective is to assure that the quality, delivery and cost controls within his/her control meet or exceed all of our internal and external customers’ requirements.

·         Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session.  Special attention must be given to the safety aspects of these documents

 

       

FUJIFILM Dimatix provides competitive wages, a generous benefits package and a friendly, dynamic working environment.

Equal Opportunity Employer

Fujifilm Dimatix is an E-Verify Employer


Fujifilm is committed to providing equal opportunities in hiring, promotion and advancement, compensation, benefits, and training regardless of nationality, age, gender, sexual orientation or gender identity, race, ethnicity, religion, political creed, ideology, national, or social origin, disability, veteran status, etc.


If you require reasonable accommodation in completing this application, interviewing, completing any pre-employment testing, or otherwise participating in the employee selection process, please direct your inquiries to our HR Department (fdmxbenefits@fujifilm.com).


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About Fujifilm

Sourced by ZipRecruiter

With each Industry we enter, We’ve learned to Leverage and Adapt our knowledge, Expertise and rRsources to make the World a better place. When it comes to Innovating for a Healthier World and a more sustainable society, we’ll NEVER STOP. Fujifilm will contribute to the social challenges by creating new value in a wide range of business domains through innovation in Products, Services, and Technological Development. We launched our Healthcare Business with X-ray film in 1936. And now, We are developing our business in areas of prevention, diagnosis, and treatment as a Comprehensive Healthcare Company. We will never stop Innovating for a Healthier World.

Industry

Chemical manufacturing

Company size

10,000+ Employees

Headquarters location

Minato-ku, Tokyo, JP

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