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Electronics Packaging Engineer Jobs in Texas (NOW HIRING)

Cnpc Usa Corporation

Sr. Mechanical Engineer

Katy, TX · On-site

$90K - $119K/yr

Define mechanical packaging for downhole electronics and sensors, including chassis, mounting ... Bachelor's degree in Mechanical Engineering or a related discipline; Master's degree or above is ...

Diodes Incorporated

Be Seen First

Senior Director of Packaging Technology

Plano, TX · On-site

... Engineering, or related field. * 15+ years of direct experience in semiconductor packaging or advanced electronics packaging. * 10+ years of global team management and leadership roles. * Strong ...

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Electronics Packaging Engineer information

See Texas salary details

$38.2K

$82.8K

$128.1K

How much do electronics packaging engineer jobs pay per year?

As of Aug 16, 2026, the average yearly pay for electronics packaging engineer in Texas is $82,820.00, according to ZipRecruiter salary data. Most workers in this role earn between $55,400.00 and $102,000.00 per year, depending on experience, location, and employer.

What does an electronics packaging engineer do?

An electronics packaging engineer designs and develops protective enclosures and interconnections for electronic components to ensure durability, thermal management, and electrical performance. They work with CAD software, materials, and manufacturing processes to optimize product reliability and manufacturability, often collaborating with design and manufacturing teams. Knowledge of industry standards and testing methods is essential in this role.

Are electronics packaging engineers in demand?

Electronics packaging engineers are in demand due to the growth of consumer electronics, telecommunications, and semiconductor industries. They require skills in materials, thermal management, and CAD tools, and often find opportunities in manufacturing and R&D environments. The field offers steady job prospects as electronic devices continue to evolve and expand.

What are the typical daily responsibilities of an electronics packaging engineer?

An Electronics Packaging Engineer typically spends their days designing mechanical enclosures for electronic components, performing thermal and structural analyses, selecting appropriate materials, and creating detailed drawings using CAD software. They collaborate closely with electrical engineers, mechanical designers, manufacturing teams, and suppliers to ensure all aspects of the design meet performance, manufacturability, and safety requirements. Regular tasks also include reviewing prototypes, addressing manufacturability issues, and supporting the transition from design to production. This multifaceted role blends hands-on technical work with frequent teamwork and problem-solving to ensure successful electronic product launches.

What is an electronics packaging engineer?

An Electronics Packaging Engineer designs and develops the physical enclosure and interconnects for electronic components, ensuring reliability, thermal management, and signal integrity. They work with materials, manufacturing processes, and industry standards to optimize product performance and durability. Their role spans from conceptual design to production, collaborating with mechanical, electrical, and manufacturing teams.

What are the key skills and qualifications needed to thrive as an electronics packaging engineer?

A successful Electronics Packaging Engineer requires a solid background in electrical engineering, thermal management, materials science, and CAD-based design, often supported by a relevant bachelor’s or master’s degree. Familiarity with industry-standard design software such as AutoCAD, SolidWorks, and simulation tools, as well as adherence to IPC and JEDEC standards, is typically expected. Attention to detail, strong problem-solving skills, and effective collaboration with multidisciplinary teams are valuable soft skills in this field. Mastery of these competencies ensures reliable product development, compliance with industry standards, and seamless integration with manufacturing processes.

What are the most commonly searched types of Electronics Packaging Engineer jobs in Texas?

The most popular types of Electronics Packaging Engineer jobs in Texas are:

What are popular job titles related to Electronics Packaging Engineer jobs in Texas?

For Electronics Packaging Engineer jobs in Texas, the most frequently searched job titles are:

What job categories do people searching Electronics Packaging Engineer jobs in Texas look for?

The top searched job categories for Electronics Packaging Engineer jobs in Texas are:

Electronics Packaging Engineer jobs near you
Infographic showing various Electronics Packaging Engineer job openings in Texas as of August 2026, with employment types broken down into 96% Full Time, 2% Contract, and 2% Nights. Highlights an 100% In-person job distribution, with an average salary of $82,820 per year, or $39.8 per hour.

Packaging Engineer | High Voltage & high power

Texas Instruments

Dallas, TX • On-site

Full-time

Re-posted 27 days ago

Texas Instruments rating

8.1

Company rating: 8.1 out of 10

Based on 86 frontline employees who took The Breakroom Quiz

49th of 157 rated electronics manufacturers

Job description

Change the world. Love your job.

As a member of our Packaging team, you'll have the chance to interact with many product groups and functions. You'll have high visibility on your projects, with strong opportunities for growth both within our team and across the SC Packaging organization.
Responsibilities may include:

  • To define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets.
  • The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps.
  • The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
  • The candidate will develop new process flows/technologies necessary to create 1st article prototype and also scale to high volume manufacturing.
  • The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues.
  • The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps.
  • The candidate must be a proven leader, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products.
Why TI?
  • Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
  • We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI
  • Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us. Please find our country-specific benefits here

About Texas Instruments
Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com.

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.

If you are interested in this position, please apply to this requisition.
TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

Minimum Requirements:

  • Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering or related engineering degree
  • 8+ years of experience and proven track record of innovation in High Voltage (200V-3300V must) and high power (5KW - 300KW) semiconductor packaging across GaN / SIC / IGBT, Super Junction MOSFET technologies
  • Hands on high voltage package and power module design, materials, equipment, and assembly flow integration (molded packages like TOLT, TOLG, Q-DPAK  DIP, SIP and case modules)
  • Strong knowledge of Silicon / GaN / SiC-package interaction and hands on experience with stress, thermal and electrical modeling analysis and tools

Preferred Requirements:

  • Excellent communication skills and ability to work with internal and external customers to define and develop roadmaps
  • Prior experience scaling HV packages and modules from concept to high volume manufacturing
  • Good understanding of clip attach, flip chip packaging and overview of wafer bumping processes 
  • Knowledge of magnetics and high power density enterprise power modules (6V - 48V) is a plus 
  • Strong knowledge of HV Bill of Materials (Mold compounds, Die Attach, DBC substrates, etc.)
  • Good understanding of industry & subcon HV packaging capabilities & roadmaps
  • Overview of high voltage discrete and power modules reliability and qualification requirements, proven ability to define and drive reliability and qualification strategies in alignment with these standards and problem solving
  • Track record of presenting at international conferences or symposiums related to power electronics, semiconductor packaging, or high-voltage technologies

What Texas Instruments employees say

Pay

Benefits

Hours and flexibility

Workplace

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About Texas Instruments

Sourced by ZipRecruiter

As a global semiconductor company, we design, manufacture, test and sell analog and embedded processing chips to nearly 100,000 customers. Our products enable electronics everywhere and in things you experience every day - from health care, smart homes and connected cars to drones, smart phones and more. Our passion to create a better and more sustainable world by making electronics more affordable through semiconductors drives us to make our technology smaller, more efficient, more reliable and more affordable.

Industry

Semiconductor and electronic component manufacturing

Company size

10,000+ Employees

Headquarters location

Dallas, TX, US

Year founded

1930

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