You will report to the Electronics Packaging Manager and work within program teams to design and produce final drawings and data including Schematics, Master Pattern (Artwork), PWB, CCA, Bill of ...
You will report to the Electronics Packaging Manager and work within program teams to design and produce final drawings and data including Schematics, Master Pattern (Artwork), PWB, CCA, Bill of ...
Packaging Substrate Engineer (San Francisco)
San Francisco, CA · On-site
$181K - $318K/yr
... electronic packaging solutions for Apple's internal and custom external components of hardware for ... Exceptional technology development & project management skills. At Apple, base pay is one part of ...
Packaging Substrate Engineer (San Francisco)
San Francisco, CA · On-site
$181K - $318K/yr
... electronic packaging solutions for Apple's internal and custom external components of hardware for ... Exceptional technology development & project management skills. At Apple, base pay is one part of ...
NY · On-site
You will report to the Electronics Packaging Manager and work within program teams to design and produce final drawings and data including Schematics, Master Pattern (Artwork), PWB, CCA, Bill of ...
NY · On-site
You will report to the Electronics Packaging Manager and work within program teams to design and produce final drawings and data including Schematics, Master Pattern (Artwork), PWB, CCA, Bill of ...
You will report to the Electronics Packaging Manager and work within program teams to design and produce final drawings and data including Schematics, Master Pattern (Artwork), PWB, CCA, Bill of ...
You will report to the Electronics Packaging Manager and work within program teams to design and produce final drawings and data including Schematics, Master Pattern (Artwork), PWB, CCA, Bill of ...
Packaging Substrate Engineer
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Exceptional technology development & project management skills. Strong communication ...
Packaging Substrate Engineer
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Exceptional technology development & project management skills. Strong communication ...
Excellent time management skills.* Strong analytical and problem-solving skills.* Ability to ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Excellent time management skills.* Strong analytical and problem-solving skills.* Ability to ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Excellent time management skills.* Strong analytical and problem-solving skills.* Ability to ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Excellent time management skills.* Strong analytical and problem-solving skills.* Ability to ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Packaging Substrate Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Exceptional technology development & project management skills. Strong communication ...
Packaging Substrate Engineer
Bodega Bay, CA · On-site
$184K - $324K/yr
Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic ... Exceptional technology development & project management skills. Strong communication ...
Collaborates and communicates with management, internal, and development partners regarding design ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Collaborates and communicates with management, internal, and development partners regarding design ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Collaborate and communicate with management, internal, and development partners regarding design ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Collaborate and communicate with management, internal, and development partners regarding design ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages, such as ASICs, Front I/O modules ...
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages, such as ASICs, Front I/O modules ...
Collaborates and communicates with management, internal, and development partners regarding design ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Collaborates and communicates with management, internal, and development partners regarding design ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages , such as; ASICs, Front I/O ...
Quick apply
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages , such as; ASICs, Front I/O ...
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages , such as; ASICs, Front I/O ...
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages , such as; ASICs, Front I/O ...
Mechanical Design Engineer
O Fallon, MO · On-site
$55 - $67/hr
Successful candidates will bring experience in mechanical design for electronics, including areas such as electronic packaging, EMI/EMC considerations, military-grade connectors, thermal management ...
Quick apply
Mechanical Design Engineer
O Fallon, MO · On-site
$55 - $67/hr
Successful candidates will bring experience in mechanical design for electronics, including areas such as electronic packaging, EMI/EMC considerations, military-grade connectors, thermal management ...
Specialist, Design
Mason, OH · On-site
Create precise 3D models and 2D drawings of electronic packaging components and assemblies using ... Manage and organize CAD files and drawing databases. Work with manufacturing and quality control ...
Specialist, Design
Mason, OH · On-site
Create precise 3D models and 2D drawings of electronic packaging components and assemblies using ... Manage and organize CAD files and drawing databases. Work with manufacturing and quality control ...
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages, such as; ASICs, Front I/O modules ...
Quick apply
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages, such as; ASICs, Front I/O modules ...
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages, such as; ASICs, Front I/O modules ...
Ability to manage multiple projects in a fast-paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages, such as; ASICs, Front I/O modules ...
Ability to manage multiple projects in a fast‑paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages, such as; ASICs, Front I/O ...
Ability to manage multiple projects in a fast‑paced environment. Preferred Qualifications * Experience developing thermal cooling solutions for electronics packages, such as; ASICs, Front I/O ...
Collaborates and communicates with management, internal, and development partners regarding design ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Collaborates and communicates with management, internal, and development partners regarding design ... Experience with miniature electronic packaging and design using bare die or chip-scale packages.
Electronic Packaging Manager information
See salary details
$31.5K - $41.7K
19% of jobs
$41.7K - $52K
0% of jobs
$52K - $62.2K
4% of jobs
$64.7K is the 25th percentile. Wages below this are outliers.
$62.2K - $72.4K
8% of jobs
$72.4K - $82.6K
9% of jobs
$82.6K - $92.9K
7% of jobs
The median wage is $95.1K / yr.
$92.9K - $103.1K
9% of jobs
$112.8K is the 75th percentile. Wages above this are outliers.
$103.1K - $113.3K
19% of jobs
$113.3K - $123.5K
7% of jobs
$123.5K - $133.8K
10% of jobs
$133.8K - $144K
6% of jobs
$31.5K
$92.3K
$144K
How much do electronic packaging manager jobs pay per year?
What does an electronic packaging manager do?
What are the key skills and qualifications needed to thrive as an electronic packaging manager?
What are some common challenges faced by electronic packaging managers in coordinating cross-functional teams?
What are popular job titles related to Electronic Packaging Manager jobs?
For Electronic Packaging Manager jobs, the most frequently searched job titles are:

Associate Design Engineer, PWB Design
Buffalo, NY • On-site
Full-time
Medical, Dental, Vision, Life, Retirement, PTO
Posted 11 days ago
Moog Inc. rating
7.7
Based on 62 frontline employees who took The Breakroom Quiz
Job description
Job Title:
Associate Design Engineer, PWB Design
Reporting To:
Management, Design Engineering
Work Schedule:
Onsite - Buffalo, NY
The Space Sector of Moog's Space and Defense Group (SDG) designs and manufactures systems to survive the harsh environments of space travel. As an industry leader in space avionics, actuation and mechanisms, propulsion, power, structures, and shock and vibration control, Moog has been committed to the space industry for more than 60 years and Moog products have been to every planet.
Our team in the Space Sector's Actuation and Avionics Business Unit is looking for an Associate Design Engineer, PWB Design to design complex, multilayer, high density, high power, high voltage, and thermally challenging Printed Wiring Boards (PWBs) and Circuit Card Assemblies (CCAs) for NASA, military, and commercial space applications.
You will report to the Electronics Packaging Manager and work within program teams to design and produce final drawings and data including Schematics, Master Pattern (Artwork), PWB, CCA, Bill of Materials (BOM) and manufacturing data, developed and dependent on Schematic input, PWB layout input and 3D/Solid models working independently or in conjunction with others. This position requires a high degree of foresight and creativity, as well as the ability to work collaboratively in a cross functional team to anticipate and solve unprecedented engineering problems.
As an Associate Design Engineer, PWB Design, you will:
- Translation of requirements emanating from a variety of sources used to generate Schematics, Netlists, PWB layouts, Master Pattern (Artwork), 3D/Solid models, layouts and detailed engineering drawings as well as supporting electronic data for PWB fabrication and CCA manufacturing.
- In conjunction with an Engineering Designer, Electrical Team Lead, or Senior Circuit Board Designer, ensuring that the detailed integrity of Schematic, PWB layout, BOM and Manufacturing data meets the intended PWB and CCA design requirements.
- Occasionally directing the efforts of drafting personnel in the completion of their tasks. This effort includes direction and input based on familiarity with the Moog Systems and Procedures, MBS (Moog Business System), Moog Release/Change workflow process, and configuration control requirements.
- Creating and checking detailed drawings for completeness and accuracy, ensures the parts list in Moog's PLM (Teamcenter) and MBS is accurate and complete.
- Contributing to cost-effective design and functional products by working closely with Design Engineering and Manufacturing Engineering.
- Suggesting or specifying (for non-critical situations) materials to conform to design.
To be considered for the Associate Design Engineer, PWB Design here's what you'll typically need to bring with you:
- Bachelor of Science or Technology Degree (BT) in Electrical Engineering or other relevant Engineering degree
- OR an Associate's Degree in a technical Major and at least 2 years of Printed Wiring Board Layout Design and Drafting experience.
- Working knowledge of engineering principles, documentation standards, and drafting practices, including spatial visualization.
- Possess understanding of electronic circuits, electrical component properties, electronic packaging, PWB and CCA materials, as well comprehensive knowledge of, and the capability to design to the requirements of IPC, Space, Military and Commercial standards and specifications.
- Advanced experience and knowledge schematic entry and PWB layout/route.
- Working knowledge of configuration management control of product design.
It would be great if you also had:
- Utilization of OrCAD Schematic Entry and Cadence Allegro PWB layout ECAD design software is desirable.
- Prior experience in the Aerospace industry is preferred.
- IPC CID and/or CID+ certification a plus
- Experience using Siemens NX 3D MCAD software or Solidworks is a plus. Knowledge and use of Teamcenter PLM is a plus.
How We Care for You:
- Financial Rewards: great compensation package, bonus opportunities, matching 401k, and the ability to participate in Employee Stock Purchase Plan (select locations), Flexible Spending and Health Savings Accounts
- Work/Life Balance: Flexible paid time off, holidays and parental leave program, relocation assistance.
- Health & Welfare: Comprehensive insurance coverage including medical, dental, vision, life, disability, Employee Assistance Plan ("EAP") and other supplemental benefit coverages.
- Professional Skills Development: Tuition Assistance, mentorship and coaching opportunities, leadership development and other personal growth programs
- Culture: Warm, respectful, family-like environment driven by our 12 core values. Multiple Employee Resource Groups led by our employees, open and welcoming to all.
#LI-Onsite
#LI-CP2
Salary Range Transparency:
Buffalo, NY $65,000.00-$100,000.00 Annually
Salary Range Disclaimer
The base salary range represents the low and high end of the Moog salary range for this position in the given work location. Actual salaries will vary depending on factors including but not limited to location, experience, and performance. The range(s) listed is just one component of Moog's total compensation package for employees. Other rewards may include annual bonuses, employee stock purchase plan, an open paid time off policy, and many region-specific benefits.
This position requires access to U.S. export-controlled information.
EOE/AA Minority/Female/Sexual Orientation/Gender Identity/Disability/Veteran
Moog offers an exclusive workplace, and, as such, affirms the right of every person to participate in all aspects of employment based on merit without regard to race, religion, color, national origin, citizenship, sex, sexual orientation, gender identity, age, veteran status, disability, genetic information, or any other protected characteristic. If you are interested in applying for employment and need special assistance or an accommodation to apply for a posted position, contact our Human Resources department via phone at 844-367-5787.
No unsolicited agency submittals please. Agency partners must be invited to participate in a search by our Talent Acquisition Team and have signed terms in place prior to any submittal. Absent compliance with these pre-conditions resumes submitted directly to any Moog Inc. employee or affiliate will not qualify for fee payment, and therefore become the property of Moog Inc.
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About Moog
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Founded in 1951 with the invention of the servo valve by Bill Moog, a breakthrough in motion control systems, Moog Inc. (NYSE: MOG.A and MOG.B) has evolved into a global leader in motion control parts and systems. Headquartered in East Aurora, NY, we serve customers in over 90 countries, with operations spanning more than 27 countries and a dedicated workforce of nearly 13,000 professionals. Our organization comprises three operating groups: Aircraft, Industrial, and Space and Defense. Our high-performance systems drive military and commercial aircraft, satellites, launch vehicles, missiles, industrial machinery, marine, and medical equipment. At Moog, our focus lies in crafting high-performance solutions to solve the most challenging technical problems for our customers. Beyond technical prowess, Moog fosters a performance culture empowering employees to achieve greatness. Our team thrives on tackling engaging technical challenges within a culture of trust, offering rewarding job experiences and a fulfilling work-life balance.
Industry
Aviation
Company size
10,000+ Employees
Headquarters location
East Aurora, NY, US
Year founded
1951