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Director Microfabrication Engineer Jobs (NOW HIRING)

You will work closely with materials engineers, microfabrication, and cross-functional reliability ... Direct experience with high-strain-rate testing (SHPB, drop tower). * Experience with Digital Image ...

Director of Manufacturing Operations About Us Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an ... Experience and understanding of microfabrication for photonics devices, process integration ...

Director of Manufacturing Operations About Us Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an ... Experience and understanding of microfabrication for photonics devices, process integration ...

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Director Microfabrication Engineer information

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$73K

$194.7K

$254K

How much do director microfabrication engineer jobs pay per year?

As of Jun 10, 2026, the average yearly pay for director microfabrication engineer in the United States is $194,709.00, according to ZipRecruiter salary data. Most workers in this role earn between $141,500.00 and $253,000.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Director Microfabrication Engineer, and why are they important?

To thrive as a Director Microfabrication Engineer, you need advanced expertise in microfabrication processes, semiconductor device physics, and a relevant engineering degree, often with a PhD or extensive industry experience. Familiarity with cleanroom protocols, process control systems, and tools like photolithography, etching equipment, and statistical process control software is essential. Strong leadership, cross-functional collaboration, and strategic problem-solving skills set top performers apart. These competencies ensure effective management of fabrication teams, innovation in process development, and high-yield production in a highly technical field.

What does a Director Microfabrication Engineer do?

A Director Microfabrication Engineer leads teams in designing, developing, and optimizing processes for fabricating micro-scale devices, such as semiconductors, MEMS, or sensors. They oversee the entire microfabrication process, ensuring quality, efficiency, and innovation while managing budgets, timelines, and regulatory compliance. This role also involves collaborating with research scientists, engineers, and production staff to scale up prototypes to mass production, as well as staying current with advancements in microfabrication technologies.

What is the difference between Director Microfabrication Engineer vs Microfabrication Engineer?

AspectDirector Microfabrication EngineerMicrofabrication Engineer
ResponsibilitiesOversees microfabrication processes, manages teams, and sets strategic goalsExecutes microfabrication tasks, develops process improvements, and supports production
CredentialsTypically requires advanced degrees and extensive experience in microfabricationRequires relevant engineering degrees and technical skills
Work EnvironmentLeadership roles in R&D or manufacturing facilitiesHands-on technical work in cleanrooms or labs
Industry UsageCommonly found in high-tech, semiconductor, and nanotech companiesFound across semiconductor, electronics, and research organizations

The main difference between a Director Microfabrication Engineer and a Microfabrication Engineer lies in their scope of responsibilities. The director focuses on strategic oversight and team management, while the engineer handles technical execution. Both roles require relevant technical credentials and are integral to microfabrication operations in high-tech industries.

What are some of the key challenges a Director Microfabrication Engineer faces when leading cross-functional teams in semiconductor manufacturing?

One of the main challenges for a Director Microfabrication Engineer is effectively coordinating among diverse teams such as process engineers, equipment specialists, and R&D scientists to ensure seamless project execution. Balancing innovation with strict quality and yield requirements requires strong leadership and communication skills. Additionally, staying ahead of rapid technological advances while maintaining compliance with industry standards can be demanding, but it also drives professional growth and collaboration in the role.
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What cities are hiring for Director Microfabrication Engineer jobs? Cities with the most Director Microfabrication Engineer job openings:
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Infographic showing various Director Microfabrication Engineer job openings in the United States as of June 2026, with employment types broken down into 9% As Needed, 74% Part Time, 4% Temporary, and 13% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $194,709 per year, or $93.6 per hour.

Lead, Electrical Engineering - MEMS Subject

L3HHCM20

Palm Bay, FL

$136K - $142K/yr

Other

Posted 26 days ago


Job description

Job Title: Lead, Electrical Engineering - MEMS Subject Matter Expert

Job Code: 37521

Job Location: Herndon, VA or Palm Bay, FL

Job Schedule: 9/80: Employees work 9 out of every 14 days - totaling 80 hours worked - and have every other Friday off

 

Job Description:  

L3Harris is seeking an accomplished MEMS Subject Matter Expert to lead our advanced microsystems technology initiatives and drive innovation in MEMS and Photonic Integrated Circuit (PIC) technologies. This senior technical leadership role offers an exceptional opportunity to shape the future of L3Harris's microelectronics capabilities while leading our Herndon, VA Nanosystems team. The ideal candidate will combine deep technical expertise in MEMS design and fabrication as well as PIC microfabrication with proven business development skills and a passion for innovation. As a key technical leader, you will drive seedling and innovation IRAD projects, identify and capture new business opportunities, and provide strategic direction for our Nanosystems team and capabilities.

Essential Functions: 

  • Lead MEMS, Silicon Photonics, and PIC technology development from concept through demonstration, developing technology roadmaps and driving next-generation microsystems capabilities
  • Identify and pursue new business opportunities in MEMS, Silicon Photonics and PIC technology areas, supporting proposal development and engaging with customers to capture new programs
  • Provide technical leadership and subject matter expertise for complex MEMS design, modeling, and fabrication challenges across the organization
  • Lead and mentor the Herndon, VA Nanosystems fabrication and design team, managing resource allocation, prioritization, and team capability development
  • Direct microfabrication operations including cleanroom processes, equipment utilization, and process development activities to optimize throughput and quality
  • Design and model MEMS devices for defense applications, conducting device characterization and performance validation
  • Represent L3Harris at technical conferences and customer meetings, building relationships with key customers and partners in MEMS/PIC technology areas
  • Ability to obtain and maintain a TS/SCI clearance with CI polygraph
  • Sit in Herndon, VA or potential to sit in Palm Bay, FL with significant travel to Herndon for team support

Qualifications:

  • Bachelor's Degree and minimum 9 years of prior relevant experience. Graduate Degree and a minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years of prior related experience.

 

Preferred Additional Skills:

  • Active TS/SCI clearance
  • Demonstrated expertise in MEMS device design, simulation, and microfabrication with a strong background in relevant processes (lithography, etching, deposition, bonding)
  • Experience with cleanroom operations and semiconductor processing equipment
  • Knowledge of Silicon Photonics and PIC technologies and photonic device design
  • Proven track record of leading innovation projects and IRAD initiatives
  • Business development experience with successful new business capture
  • Experience with RF MEMS, optical MEMS, or inertial MEMS devices
  • Knowledge of silicon photonics and integrated photonics platforms
  • Familiarity with COMSOL, ANSYS, or other FEA/Multiphysics simulation tools
  • Experience with MEMS design tools Understanding of packaging technologies for MEMS and photonic devices
  • Publications or patents in MEMS or related fields
  • Experience with wafer-level processing and 3D integration
  • Knowledge of heterogeneous integration approaches
  • Experience with DOD customers and defense applications

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