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Job Details:Job Description: Physical Design and Implementation Lead, Memory PHY IP (DDR/LPDDR)Intel is seeking an experienced Senior Director of Engineering to lead the Physical Design organization responsible for delivering best-in-class DDR and LPDDR Memory PHY IPs for Intel's Client, Datacenter, and Foundry/ASIC products.The successful candidate will lead a global team of more than 50 engineers across the United States, India, and Malaysia, consisting of both direct reports and matrixed resources. This leader will drive end-to-end physical implementation, execution excellence, methodology development, and technology enablement for multiple generations of high-performance memory PHY solutions spanning leading-edge process technologies including Intel 18A, Intel 14A, and future nodes.The role requires a combination of deep technical expertise in high-speed PHY design and physical implementation, strong organizational leadership, and proven experience delivering complex silicon at aggressive schedules across multiple product segments.________________________________________Key ResponsibilitiesOrganizational LeadershipLead and develop a global team of 50+ Physical Design engineers located across multiple geographies.Manage a mix of direct and matrix reporting relationships while fostering a high-performance, collaborative engineering culture.Drive organizational growth, talent development, succession planning, and employee engagement.Establish clear goals, execution strategies, and performance metrics aligned with business objectives.Technical LeadershipOwn end-to-end Physical Design execution for DDR and LPDDR PHY IPs across multiple Intel product lines.Drive implementation activities including: oFloorplanningoPower planningoPlacement and optimizationoClock distributionoTiming closureoSignal integrityoPower integrityoPhysical verificationoDesign signoffLead delivery of high-speed PHY implementations targeting industry-leading performance, power, area, and reliability metrics.Establish and drive best-known methods (BKMs) for advanced-node implementation and signoff.Program ExecutionDrive predictable execution across multiple concurrent programs supporting Client, Datacenter, and ASIC/Foundry products.Partner closely with Architecture, Circuit Design, RTL Design, Verification, Package, Product Engineering, and Technology Development teams.Manage schedule, resource allocation, risk mitigation, and milestone delivery.Ensure successful tape-in and tape-out of complex PHY IPs on aggressive product timelines.Methodology and InnovationChampion next-generation Physical Design methodologies, automation, and AI-assisted design flows.Drive productivity improvements through scalable automation and design reuse strategies.Lead adoption of advanced implementation techniques required for sub-2nm technologies.Promote technical innovation, patents, and continuous improvement initiatives.Stakeholder EngagementCommunicate effectively with senior engineering leaders, product teams, and executive management.Drive alignment across geographically distributed organizations and external partners.Present technical status, risks, and strategic recommendations to executive leadership.________________________________________Qualifications:Minimum QualificationsBachelor's degree in Electrical Engineering, Computer Engineering, or related discipline with 15+ years of industry experience; Master's or PhD preferred.18+ years of semiconductor design experience with significant leadership responsibility.Proven experience leading large-scale Physical Design organizations.Demonstrated success delivering high-speed PHY, SerDes, DDR, LPDDR, or other complex mixed-signal IPs into production.Deep expertise in advanced node implementation including Intel 18A, Intel 14A, 2nm-class technologies, or equivalent leading-edge process nodes.Extensive experience with: oTiming closureoPower optimizationoSignal integrityoReliability analysisoPhysical verificationoDesign signoff methodologiesExperience managing globally distributed teams across multiple geographic regions.Excellent communication, organizational, and people leadership skills.________________________________________Preferred QualificationsExpertise in DDR5, LPDDR5/LPDDR6, HBM, or next-generation memory interfaces.Strong understanding of PHY architecture and mixed-signal design challenges.Experience delivering IP across Client, Datacenter, AI Accelerator, and Foundry/ASIC markets.Knowledge of advanced packaging technologies and system-level integration considerations.Experience driving AI-enabled design productivity and design automation initiatives.Proven track record of building high-performing engineering organizations and developing future technical leaders.________________________________________Success ProfileThe ideal candidate combines:Deep technical credibility in high-speed PHY implementation.Strong leadership experience managing large global teams.Proven success delivering silicon on leading-edge process technologies.Exceptional execution discipline and customer focus.Ability to influence across organizational boundaries and drive results through both direct and matrix structures.This leader will play a critical role in enabling Intel's next generation Client, Datacenter, AI, and Foundry products through the successful delivery of world-class Memory PHY IP solutions.Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, California, FolsomAdditional Locations:US, Arizona, Phoenix, US, California, Santa Clara, US, Oregon, HillsboroPosting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $220,920.00-361,480.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.