Dicing Technician information
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$11.30 - $13.18
1% of jobs
$13.18 - $15.06
7% of jobs
$15.06 - $16.94
11% of jobs
$17.61 is the 25th percentile. Wages below this are outliers.
$16.94 - $18.82
17% of jobs
The median wage is $20.63 / hr.
$18.82 - $20.69
15% of jobs
$20.69 - $22.57
17% of jobs
$23.81 is the 75th percentile. Wages above this are outliers.
$22.57 - $24.45
12% of jobs
$24.45 - $26.33
8% of jobs
$26.33 - $28.21
6% of jobs
$28.21 - $30.09
4% of jobs
$30.09 - $31.97
2% of jobs
How much do dicing technician jobs pay per hour?
As of Aug 13, 2026, the average hourly pay for dicing technician in the United States is $21.58, according to ZipRecruiter salary data. Most workers in this role earn between $17.31 and $24.52 per hour, depending on experience, location, and employer.
Dicing Technicians are skilled professionals who operate and maintain specialized equipment to cut, or 'dice,' semiconductor wafers into individual microchips or die. They work primarily in semiconductor manufacturing facilities and are responsible for ensuring precise and clean cuts to avoid damaging the delicate components. Their duties often include equipment setup, process monitoring, quality control, troubleshooting, and performing maintenance on dicing saws and related machinery. Dicing Technicians play a crucial role in the production of electronic devices by ensuring the integrity and quality of semiconductor components.
To thrive as a Dicing Technician, you need a solid understanding of semiconductor manufacturing processes, attention to detail, and typically a high school diploma or associate degree in a technical field. Familiarity with dicing saws, cleanroom protocols, and quality control systems is essential, and some employers may require certifications in semiconductor manufacturing or equipment operation. Strong problem-solving skills, manual dexterity, and effective communication help technicians excel in identifying and resolving process issues. These skills ensure precise wafer processing, minimize product defects, and support efficient, high-quality semiconductor production.
Dicing Technicians often encounter challenges such as handling fragile wafers, maintaining precise alignment during the dicing process, and ensuring equipment is properly calibrated to minimize yield loss. Managing these challenges involves following strict safety protocols, performing regular maintenance and calibration of dicing saws, and collaborating closely with process engineers to address any recurring issues. Staying organized and detail-oriented is essential, as is being proactive in identifying problems before they impact production quality.
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