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TITLE:                        THIN FILM MANUFACTURING ENGINEER

FLSA STATUS:          EXEMPT

REPORTS TO:          SR. MANAGER, THIN FILM MANUFACTURING ENGINEERING

SUMMARY:

Under the direction of the Sr. Manager of Thin Film Manufacturing Engineering , the Thin Film Manufacturing Engineer is responsible for the monitoring, sustaining, and supporting day-to-day thin film manufacturing processes, including providing technical support to ensure process reliability; verifying process robustness with characterization of process latitudes through experimentation; improving the efficiency of deposition and/or dry etching processes; developing and implementing practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; and improving production yields via process/tool manufacturability optimization. This position is located in Milpitas, California.
ESSENTIAL FUNCTIONS:

• Monitors, sustains, and supports day-to-day thin film manufacturing processes, programs, and activities
• Ensures process reliability by providing technical support to operators, technicians, and other engineers
• Improves the efficiency of deposition and/or dry etching processes analyzing data, conducting experiments, and researching alternative methods which reduce scrap
• Designs and conducts experiments to verify process robustness with characterization of process latitudes
• Develops and implements practices or methodologies which lower cost, reduce cycle time, and improve operational efficiency
• Conducts root cause analysis and implements corrective action if required
• Responds to inquiries from other team members, managers, or departments
• Uses Statistical Process Control (SPC) to analyze product quality data; develops charts or reports and presents findings before groups or teams
• Adheres to all safety policies and procedures as required
• Performs other duties of a similar nature or level*

MINIMUM QUALIFICATIONS:

• Master’s degree in Chemistry, Chemical or Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; PhD preferred
• Three years of hands-on experience working in magnetic thin film fabrication, or semiconductor industry in manufacturing or process engineering role
• Hands-on experience in SPC and Design of Experiments (DOE)
• Proficient in the use of Microsoft Office Applications

Knowledge, Skills, and Abilities:

• Strong knowledge of magnetic thin film fabrication techniques using film deposition and Ion Milling technologies
• Knowledge and experience of TMR, CPP GMR, spin transfer oscillator film processes
• Knowledge of surface analytical/materials characterization techniques, including XRD, AFM, TEM, SEM, and FIB
• Knowledge and experience of process development and integration
• Knowledge and experience using JMP or Excel and the ability to create macro formulas
• Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
• Able to design experiments, analyze results, and recommend corrective action
• Able to communicate effectively, both verbally and in writing, with all levels of contractors, employees, and management
• Able to work productively and collaboratively with all levels of employees and management
• Able to comply with all safety policies and procedures
• Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
• Demonstrated critical thinking and analytical skills
• Demonstrated organizational and time management skills
• Demonstrated problem-solving and trouble shooting skills
• Flexible and able to prioritize

The annual base salary for this full-time position is between $120,819.00-$177,675.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual base pay range shown is subject to change and may be modified periodically.

WORKING CONDITIONS:

The Thin Film Manufacturing Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time-to-time to meet business or operational needs; may travel from building-to-building as needed. Works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of workday; may be exposed to loud noise. Stands, walks, bends, and twists. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment. May occasionally be required to push, pull, or lift up to 30 pounds.
*Other duties of a similar nature or level are duties that may be required but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.