... scale implementation. This role focuses on translating advanced quantum and AI concepts into ... of photonic integrated circuits. Experience modeling and simulating quantum gates or quantum ...
... scale implementation. This role focuses on translating advanced quantum and AI concepts into ... of photonic integrated circuits. Experience modeling and simulating quantum gates or quantum ...
... scale implementation. This role focuses on translating advanced quantum and AI concepts into ... integrated circuits. • Experience modeling and simulating quantum gates or quantum optical ...
... scale implementation. This role focuses on translating advanced quantum and AI concepts into ... integrated circuits. • Experience modeling and simulating quantum gates or quantum optical ...
... scale implementation. This role focuses on translating advanced quantum and AI concepts into ... integrated circuits. • Experience modeling and simulating quantum gates or quantum optical ...
... scale implementation. This role focuses on translating advanced quantum and AI concepts into ... integrated circuits. • Experience modeling and simulating quantum gates or quantum optical ...
Package Integration Engineer
San Francisco, CA · On-site
$122K - $164K/yr
In-depth knowledge in Wafer Level Chip Scale Packaging (RDL/Wafer Bumping & BEOL Assembly processes for Fan-In & Fan-Out designs). Expert level knowledge of common reliability failure modes. Able to ...
Package Integration Engineer
San Francisco, CA · On-site
$122K - $164K/yr
In-depth knowledge in Wafer Level Chip Scale Packaging (RDL/Wafer Bumping & BEOL Assembly processes for Fan-In & Fan-Out designs). Expert level knowledge of common reliability failure modes. Able to ...
... and chip-scale packaging technologies * Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including ...
... and chip-scale packaging technologies * Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including ...
Laser Scientist
Pleasanton, CA · On-site
$163K - $214K/yr
Develop custom laser systems from fiber-based oscillators to integrated chip-scale architectures. * PIC Design & Simulation: Design and simulate PIC layouts optimized for high-Q micro-resonators and ...
Laser Scientist
Pleasanton, CA · On-site
$163K - $214K/yr
Develop custom laser systems from fiber-based oscillators to integrated chip-scale architectures. * PIC Design & Simulation: Design and simulate PIC layouts optimized for high-Q micro-resonators and ...
... and chip-scale packaging technologies * Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including ...
... and chip-scale packaging technologies * Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including ...
Laser Scientist
$163K - $214K/yr
Develop custom laser systems from fiber-based oscillators to integrated chip-scale architectures. * PIC Design & Simulation: Design and simulate PIC layouts optimized for high-Q micro-resonators and ...
Laser Scientist
$163K - $214K/yr
Develop custom laser systems from fiber-based oscillators to integrated chip-scale architectures. * PIC Design & Simulation: Design and simulate PIC layouts optimized for high-Q micro-resonators and ...
Laser Scientist
Pleasanton, CA · On-site
$163K - $214K/yr
Develop custom laser systems from fiber-based oscillators to integrated chip-scale architectures. * PIC Design & Simulation: Design and simulate PIC layouts optimized for high-Q micro-resonators and ...
Quick apply
Laser Scientist
Pleasanton, CA · On-site
$163K - $214K/yr
Develop custom laser systems from fiber-based oscillators to integrated chip-scale architectures. * PIC Design & Simulation: Design and simulate PIC layouts optimized for high-Q micro-resonators and ...
Electrical Engineer
New York, NY · On-site
Exposure to MEMS, flexible electronics, or chip-scale integration What You'll Be Part Of This is a ground-floor opportunity to join a small, technically ambitious team working on technology with the ...
Quick apply
Electrical Engineer
New York, NY · On-site
Exposure to MEMS, flexible electronics, or chip-scale integration What You'll Be Part Of This is a ground-floor opportunity to join a small, technically ambitious team working on technology with the ...
MEMS Integration Engineer
Santa Clara, CA · On-site
$122K - $164K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Your success will ensure seamless integration and alignment with nEye's device specifications ...
MEMS Integration Engineer
Santa Clara, CA · On-site
$122K - $164K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Your success will ensure seamless integration and alignment with nEye's device specifications ...
MEMS Integration Engineer
Santa Clara, CA · Hybrid
$122K - $164K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Your success will ensure seamless integration and alignment with nEye's device specifications ...
Quick apply
MEMS Integration Engineer
Santa Clara, CA · Hybrid
$122K - $164K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Your success will ensure seamless integration and alignment with nEye's device specifications ...
MEMS Integration Engineer
Santa Clara, CA · Hybrid
$122K - $164K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Your success will ensure seamless integration and alignment with nEye's device specifications ...
MEMS Integration Engineer
Santa Clara, CA · Hybrid
$122K - $164K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Your success will ensure seamless integration and alignment with nEye's device specifications ...
Postdoctoral Fellowship in Applied Physics
Cambridge, MA · On-site
$67K - $91K/yr
... integrated optics, nonlinear optics, and microwave photonics. The candidate will focus on design, fabrication, and characterization of chip-scale photonic devices and systems, and their application ...
Postdoctoral Fellowship in Applied Physics
Cambridge, MA · On-site
$67K - $91K/yr
... integrated optics, nonlinear optics, and microwave photonics. The candidate will focus on design, fabrication, and characterization of chip-scale photonic devices and systems, and their application ...
... and chip-scale packaging technologies * Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including ...
... and chip-scale packaging technologies * Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including ...
Research Scholar
Raleigh, NC · On-site
However, their integration within microsystems remains limited due to planar optical routing ... Fabrication of various chip-scale photonic devices (e.g., Stepper, contact, and E-beam lithography ...
Research Scholar
Raleigh, NC · On-site
However, their integration within microsystems remains limited due to planar optical routing ... Fabrication of various chip-scale photonic devices (e.g., Stepper, contact, and E-beam lithography ...
Senior MEMS Design Engineer
Santa Clara, CA · On-site
$180K - $260K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Experience with advanced packaging technologies and their integration into the foundry process.
Senior MEMS Design Engineer
Santa Clara, CA · On-site
$180K - $260K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Experience with advanced packaging technologies and their integration into the foundry process.
Chip Lead, Senior Director
San Jose, CA · On-site
Drive chip development execution from RTL to GDSII, ensuring architecture, implementation, and ... integration * Experience operating in fast-growing startups or hyper-scale environments Key ...
Chip Lead, Senior Director
San Jose, CA · On-site
Drive chip development execution from RTL to GDSII, ensuring architecture, implementation, and ... integration * Experience operating in fast-growing startups or hyper-scale environments Key ...
Senior MEMS Design Engineer
Santa Clara, CA · On-site
$180K - $260K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Experience with advanced packaging technologies and their integration into the foundry process.
Senior MEMS Design Engineer
Santa Clara, CA · On-site
$180K - $260K/yr
The company's SuperSwitch is an ultra-low power consumption, high radix, compact chip-scale design ... Experience with advanced packaging technologies and their integration into the foundry process.
... and chip-scale packaging technologies * Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including ...
... and chip-scale packaging technologies * Collaboration within a cross-functional Integrated Product Team (IPT); effective and timely communication with peers in adjacent functions, including ...
Chip Scale Integration information
See salary details
$12.98 - $16.85
5% of jobs
$16.85 - $20.72
16% of jobs
$21.24 is the 25th percentile. Wages below this are outliers.
$20.72 - $24.58
26% of jobs
The median wage is $25.19 / hr.
$24.58 - $28.45
17% of jobs
$28.45 - $32.32
10% of jobs
$32.80 is the 75th percentile. Wages above this are outliers.
$32.32 - $36.19
6% of jobs
$36.19 - $40.06
9% of jobs
$40.06 - $43.92
2% of jobs
$43.92 - $47.79
1% of jobs
$47.79 - $51.66
4% of jobs
$51.66 - $55.53
3% of jobs
$12
$29
$55
How much do chip scale integration jobs pay per hour?
As of Jun 7, 2026, the average hourly pay for chip scale integration in the United States is $29.84, according to ZipRecruiter salary data. Most workers in this role earn between $21.88 and $36.54 per hour, depending on experience, location, and employer.
What is the difference between Chip Scale Integration vs Microelectronics Engineer?
| Aspect | Chip Scale Integration | Microelectronics Engineer |
|---|---|---|
| Required Credentials | Bachelor's or higher in Electrical Engineering or related field | Bachelor's or higher in Electrical Engineering, Microelectronics, or related field |
| Work Environment | Design labs, manufacturing facilities, R&D centers | Design labs, fabrication facilities, R&D centers |
| Industry Usage | Semiconductor, consumer electronics, telecommunications | Semiconductor, integrated circuit design, electronics manufacturing |
Chip Scale Integration involves designing and manufacturing highly integrated semiconductor devices, focusing on miniaturization and performance. Microelectronics Engineers work on designing, testing, and developing microelectronic circuits and systems. While both roles require similar educational backgrounds and work environments, Chip Scale Integration emphasizes the integration of multiple functions into a single chip, whereas Microelectronics Engineers focus on circuit design and development. Understanding these differences helps clarify career paths and job expectations in the electronics industry.
What is chip scale integration?
Chip scale integration refers to the technology and process of assembling and packaging integrated circuits (ICs) in a way that the package size is nearly the same as the chip itself. This approach minimizes the overall size of electronic devices, enhances performance, and can reduce manufacturing costs. Chip scale integration is commonly used in applications where space, weight, and power efficiency are critical, such as smartphones, wearables, and IoT devices.
What job makes $10,000 a month without a degree?
In the field of Chip Scale Integration, high-paying roles such as senior design engineers or technical managers can earn around $10,000 or more per month, often requiring specialized skills, experience, and industry certifications. These positions typically involve designing and testing integrated circuits and may require advanced knowledge of semiconductor fabrication and CAD tools, but they do not always require a traditional college degree if the candidate has substantial hands-on experience and expertise.
What are some common challenges faced by professionals in Chip Scale Integration, and how can they be addressed?
Professionals working in Chip Scale Integration often encounter challenges such as managing thermal issues, ensuring high-yield assembly, and maintaining signal integrity at increasingly smaller scales. Staying updated with the latest packaging technologies and collaborating closely with design, manufacturing, and testing teams can help address these challenges. Additionally, developing expertise in advanced simulation tools and actively participating in cross-functional meetings supports problem-solving and innovation in this rapidly evolving field.
What are the key skills and qualifications needed to thrive in Chip Scale Integration, and why are they important?
To excel in Chip Scale Integration, you need a solid background in electrical engineering, semiconductor physics, and microfabrication processes, typically with at least a bachelor’s or master’s degree in a related field. Proficiency in CAD software, semiconductor simulation tools, and familiarity with cleanroom protocols and industry standards such as IPC or JEDEC are highly valuable. Strong problem-solving skills, attention to detail, and effective cross-functional communication help professionals stand out in this role. These skills ensure the development of reliable, high-performance chip-scale devices and support innovation in advanced electronics manufacturing.
Full-time
Posted 15 days ago
Job description
Location: Hoboken, NJ
Department: Tomorrow
Reports to: Ting Bu
Position Overview
The Research Scientist will work on the modeling, simulation, and architectural development of
quantum and artificial intelligence (AI) computational structures intended for chip-scale
implementation. This role focuses on translating advanced quantum and AI concepts into
physically realistic, simulation-validated device and system designs suitable for fabrication. It
concentrates on high-fidelity simulation, feasibility analysis, and performance optimization under
practical fabrication constraints. The role serves as a technical bridge between the research
team developing novel quantum/AI architectures and the chip fabrication team responsible for
implementation, ensuring that proposed designs are physically realizable, scalable, and
performance-optimized prior to tape-out.
Duties and Responsibilities
Develop and simulate quantum and AI-based photonic architectures for on-chip
implementation.
Translate high-level computational concepts into device-level and system-level
simulation models.
Perform rigorous electromagnetic and multiphysics simulations to evaluate optical,
nonlinear, and quantum effects.
Model and simulate quantum photonic circuits and quantum gates under realistic device
conditions.
Analyze fabrication tolerances and material constraints to assess design robustness.
Optimize photonic device structures for performance, scalability, and manufacturability.
Collaborate closely with fabrication and packaging teams to ensure simulation models
align with process capabilities.
Support post-fabrication validation by correlating experimental results with simulation
predictions.
Document modeling methodologies, simulation results, and architectural trade-offs for
internal and external reporting.
Required Qualifications
Education
Ph.D. in Physics, Applied Physics, Electrical Engineering, or a closely related discipline.
Technical Background
Strong foundation in Photonics, Quantum optics, Nonlinear optics
Demonstrated experience in simulation of photonic integrated circuits.
Experience modeling and simulating quantum gates or quantum optical systems.
Understanding of semiconductor/TFLN and photonic chip fabrication processes sufficient
to incorporate realistic constraints into simulations.
Familiarity with chip testing and packaging considerations from a modeling perspective.
Software Proficiency
Lumerical (FDTD, MODE, INTERCONNECT)
Tidy3D
COMSOL Multiphysics
Python
MATLAB
Employment Type: FULL_TIMEDepartment: Tomorrow
Reports to: Ting Bu
Position Overview
The Research Scientist will work on the modeling, simulation, and architectural development of
quantum and artificial intelligence (AI) computational structures intended for chip-scale
implementation. This role focuses on translating advanced quantum and AI concepts into
physically realistic, simulation-validated device and system designs suitable for fabrication. It
concentrates on high-fidelity simulation, feasibility analysis, and performance optimization under
practical fabrication constraints. The role serves as a technical bridge between the research
team developing novel quantum/AI architectures and the chip fabrication team responsible for
implementation, ensuring that proposed designs are physically realizable, scalable, and
performance-optimized prior to tape-out.
Duties and Responsibilities
Develop and simulate quantum and AI-based photonic architectures for on-chip
implementation.
Translate high-level computational concepts into device-level and system-level
simulation models.
Perform rigorous electromagnetic and multiphysics simulations to evaluate optical,
nonlinear, and quantum effects.
Model and simulate quantum photonic circuits and quantum gates under realistic device
conditions.
Analyze fabrication tolerances and material constraints to assess design robustness.
Optimize photonic device structures for performance, scalability, and manufacturability.
Collaborate closely with fabrication and packaging teams to ensure simulation models
align with process capabilities.
Support post-fabrication validation by correlating experimental results with simulation
predictions.
Document modeling methodologies, simulation results, and architectural trade-offs for
internal and external reporting.
Required Qualifications
Education
Ph.D. in Physics, Applied Physics, Electrical Engineering, or a closely related discipline.
Technical Background
Strong foundation in Photonics, Quantum optics, Nonlinear optics
Demonstrated experience in simulation of photonic integrated circuits.
Experience modeling and simulating quantum gates or quantum optical systems.
Understanding of semiconductor/TFLN and photonic chip fabrication processes sufficient
to incorporate realistic constraints into simulations.
Familiarity with chip testing and packaging considerations from a modeling perspective.
Software Proficiency
Lumerical (FDTD, MODE, INTERCONNECT)
Tidy3D
COMSOL Multiphysics
Python
MATLAB
About QCI
Sourced by ZipRecruiter
Company size
51 - 200 Employees
Headquarters location
West Des Moines, IA, US
Year founded
1995