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Chip Scale Integration Jobs (NOW HIRING)

OMNIVISION

Product Validation Engineer

Santa Clara, CA · On-site

$120K - $125K/yr

... chip scale testing. * Drive production yield rate reach to target yield level from new product tape ... Digital circuit design and hardware/software integration for system-level applications, with ...

Micron

DMTS Digital Design Engineer / Chip Lead

Folsom, CA · On-site

$206K - $410K/yr

... scaling innovation across circuits, signaling, packaging, and interconnects with a 3-5 year ... The program integrates a fully custom analog PHY alongside digital control functions - providing a ...

USM

SR Business Analyst with EMV Chip Card

Blue Ash, OH · On-site

$84K - $109K/yr

Company Description USM Business Systems Inc. is a quickly developing worldwide System Integrator ... Business Analysis, EMV Chip Card An ideal candidate will have large scale enterprise environment ...

Ouster

Staff Electrical Engineer

San Francisco, CA · On-site

$107K - $200K/yr

... chip-scale laser array and one CMOS sensor. The result is a full range of high-resolution LIDAR ... Collaborate across hardware, firmware, and manufacturing teams to deliver integrated, world-class ...

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How much do chip scale integration jobs pay per hour?

As of Jun 7, 2026, the average hourly pay for chip scale integration in the United States is $29.84, according to ZipRecruiter salary data. Most workers in this role earn between $21.88 and $36.54 per hour, depending on experience, location, and employer.

What is the difference between Chip Scale Integration vs Microelectronics Engineer?

AspectChip Scale IntegrationMicroelectronics Engineer
Required CredentialsBachelor's or higher in Electrical Engineering or related fieldBachelor's or higher in Electrical Engineering, Microelectronics, or related field
Work EnvironmentDesign labs, manufacturing facilities, R&D centersDesign labs, fabrication facilities, R&D centers
Industry UsageSemiconductor, consumer electronics, telecommunicationsSemiconductor, integrated circuit design, electronics manufacturing

Chip Scale Integration involves designing and manufacturing highly integrated semiconductor devices, focusing on miniaturization and performance. Microelectronics Engineers work on designing, testing, and developing microelectronic circuits and systems. While both roles require similar educational backgrounds and work environments, Chip Scale Integration emphasizes the integration of multiple functions into a single chip, whereas Microelectronics Engineers focus on circuit design and development. Understanding these differences helps clarify career paths and job expectations in the electronics industry.

What is chip scale integration?

Chip scale integration refers to the technology and process of assembling and packaging integrated circuits (ICs) in a way that the package size is nearly the same as the chip itself. This approach minimizes the overall size of electronic devices, enhances performance, and can reduce manufacturing costs. Chip scale integration is commonly used in applications where space, weight, and power efficiency are critical, such as smartphones, wearables, and IoT devices.

What job makes $10,000 a month without a degree?

In the field of Chip Scale Integration, high-paying roles such as senior design engineers or technical managers can earn around $10,000 or more per month, often requiring specialized skills, experience, and industry certifications. These positions typically involve designing and testing integrated circuits and may require advanced knowledge of semiconductor fabrication and CAD tools, but they do not always require a traditional college degree if the candidate has substantial hands-on experience and expertise.

What are some common challenges faced by professionals in Chip Scale Integration, and how can they be addressed?

Professionals working in Chip Scale Integration often encounter challenges such as managing thermal issues, ensuring high-yield assembly, and maintaining signal integrity at increasingly smaller scales. Staying updated with the latest packaging technologies and collaborating closely with design, manufacturing, and testing teams can help address these challenges. Additionally, developing expertise in advanced simulation tools and actively participating in cross-functional meetings supports problem-solving and innovation in this rapidly evolving field.

What are the key skills and qualifications needed to thrive in Chip Scale Integration, and why are they important?

To excel in Chip Scale Integration, you need a solid background in electrical engineering, semiconductor physics, and microfabrication processes, typically with at least a bachelor’s or master’s degree in a related field. Proficiency in CAD software, semiconductor simulation tools, and familiarity with cleanroom protocols and industry standards such as IPC or JEDEC are highly valuable. Strong problem-solving skills, attention to detail, and effective cross-functional communication help professionals stand out in this role. These skills ensure the development of reliable, high-performance chip-scale devices and support innovation in advanced electronics manufacturing.
Infographic showing various Chip Scale Integration job openings in the United States as of May 2026, with employment types broken down into 92% Full Time, 5% Part Time, and 3% Contract. Highlights an 85% Physical, 4% Hybrid, and 11% Remote job distribution, with an average salary of $62,077 per year, or $29.8 per hour.
Product Validation Engineer

Product Validation Engineer

OMNIVISION

Santa Clara, CA • On-site

$120K - $125K/yr

Full-time

Posted 5 days ago

Job description

Description
Job Title: Product Validation Engineer
Job Duties:
  • Design a characterization/testing plan and work with R&D teams and manufacturing engineers to resolve various technical issues to meet performance requirements.
  • Evaluate image sensor manufacturing quality by statistically analyzing multiple electrical and functional parameters in wafer level characterization and chip scale testing.
  • Drive production yield rate reach to target yield level from new product tape out, listing parameters according to yield loss rate from high to low.
  • Debug root cause of process and design related yield loss happening in initial silicon; cooperate with process and design engineers to solve problems.
  • Conduct product introduction and ramp-up for image sensors and ASIC devices.
  • Work in close collaboration with silicon foundry, image characterization and pixel design.
  • Interact with foundry fab in improving all silicon process, color, and package issues.
  • Improve product yield and performance by process optimization and layout design update.
  • Analyze yield and drive corrective actions for yield improvements.
  • Drive characterization to finalize the product datasheet.
  • Work with pixel design group to design the most sophisticated and optimized pixel layout.
  • Work with characterization team to analyze and debug pixel device circuit and various image related issues.
  • Work with quality engineers to solve customer quality complaints and track quality improvement after solution implemented.
  • Support reliability engineers on production quality analysis and update relative criteria on product reliability documents.
  • Coordinate with company's fab to drive semiconductor processing tool vendors to optimize processes, including raw material vendor, IMP tool vendor and photo resist vendor etc.
  • Set up new tape out product process flows, inline handbooks, JDV check etc.
  • Work with testing engineers to develop, verify and release testing program at CP or FT. Test sample sensors on manual testing board, and help testing engineer finalize ATE testing program.
  • Determine production testing specifications base on wafer level characterization and packaged chip testing data.
  • Cooperate with testing engineers to debug testing problems such as tester mechanical failure, manufacture fluctuating issue and error handling.

Requirements:
Master's degree or foreign equivalent degree in Electrical Engineering, Computer Engineering, or related fields.
Required skills:
  • Semiconductor physics, including CMOS transistor performance and NMOS/PMOS device behavior.
  • Digital circuit design and hardware/software integration for system-level applications, with proficiency in digital logic design, simulation, and synthesis using Verilog and Xcelium.
  • Software development and research involving digital signal processing principles and statistical analysis methods.
  • Proficiency in data analysis and visualization using Python and Excel to manage large datasets, identify trends, and support engineering decision-making.
  • Ability to apply advanced engineering techniques for system modeling, optimization, and control in complex applications.

Annual base salary for this role in California, US is expected to be between $120,182 - $125,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.

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