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Bump Jobs in California (NOW HIRING)

DensityAI

Package Layout Engineer

Mountain View, CA · On-site

You'll take multi-die 2.5D and 3D packages from bump map through tapeout release - defining substrate and interposer stackups, planning bump and ball maps against the die floorplan, routing high ...

DensityAI

Package Layout Engineer

Mountain View, CA · On-site

$165K - $225K/yr

You'll take multi-die 2.5D and 3D packages from bump map through tapeout release -- defining substrate and interposer stackups, planning bump and ball maps against the die floorplan, routing high ...

DensityAI

Package Layout Engineer

Mountain View, CA · On-site

$165K - $225K/yr

You'll take multi-die 2.5D and 3D packages from bump map through tapeout release - defining substrate and interposer stackups, planning bump and ball maps against the die floorplan, routing high ...

Broadcom Inc.

ASIC Implementation Engineer PD

San Jose, CA · On-site

$121.90 - $195/hr

Manage all cross‑functional interactions related to top‑level floorplanning, I/O and bump planning with package team * Develop and improve floorplan implementation methodologies using both ...

Cspeed

Package Mechanical FEA Engineer

Palo Alto, CA · On-site

Analyze stress and strain in micro-bump, copper pillar, C4, and second-level interconnect structures, including chip-package interaction and low-k dielectric risk. * Own solder and interconnect ...

Broadcom, Inc.

ASIC Implementation Engineer

San Jose, CA · On-site

$143K - $230K/yr

Manage all cross functional interactions related to top level floorplanning, I/O and bump planning with package team * Develop and improve floorplan implementation methodologies using both industry ...

Broadcom

ASIC Implementation Engineer PD

San Jose, CA · On-site

$159K - $164K/yr

Manage all cross functional interactions related to top level floorplanning, I/O and bump planning with package team * Develop and improve floorplan implementation methodologies using both industry ...

Broadcom

ASIC Implementation Engineer

San Jose, CA

$143K - $230K/yr

Manage all cross functional interactions related to top level floorplanning, I/O and bump planning with package team * Develop and improve floorplan implementation methodologies using both industry ...

Cspeed

Package Mechanical FEA Engineer

Palo Alto, CA · On-site

Analyze stress and strain in micro-bump, copper pillar, C4, and second-level interconnect structures, including chip-package interaction and low-k dielectric risk. * Own solder and interconnect ...

Entrada Ventures

Package Engineer

Palo Alto, CA · On-site

$180 - $240/hr

Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints. * Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and ...

Delos Data Inc

Package Engineer

Palo Alto, CA · On-site

$180 - $240/hr

Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints. * Define substrate stack‑ups, bump pitch, ball pitch, routing, via structures, and ...

Three Point Solutions, Inc.

Picker/Packer

Lathrop, CA · On-site

$15.25 - $17.75/hr

Metatarsal boots, gloves, earplugs, safety glasses, bump cap * Client provides PPE except for metatarsal boots * PPE must be worn the entire shift-no exceptions Required Skills: * HS Diploma/GED or 1 ...

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All JobsBump JobsBump Jobs in California

Bump information

See California salary details

$275

$5.6K

$6.7K

How much do bump jobs pay per week?

As of Sep 7, 2026, the average weekly pay for bump in California is $5,580.71, according to ZipRecruiter salary data. Most workers in this role earn between $4,450.00 and $6,642.31 per week, depending on experience, location, and employer.

What is a bump?

A 'Bump' job typically refers to a position within the live events, film, or broadcasting industry, where a 'bump' crew is responsible for the setup (bump-in) and teardown (bump-out) of equipment, staging, and sets. These roles involve physically demanding work, often outside of regular business hours, and require teamwork and attention to detail. Bump staff may be involved in lighting, audio, video, and general stagehand duties, helping to ensure that events run smoothly and efficiently.

What are the key skills and qualifications needed to thrive as a bump (rigging technician), and why are they important?

To thrive as a Rigging Technician (sometimes called a 'Bump'), you need a solid understanding of rigging techniques, mechanical principles, and safety standards, often supported by relevant OSHA certifications or technical training. Familiarity with rigging hardware, lifting equipment, and load calculation software is typically required. Strong attention to detail, teamwork, and effective communication are key soft skills for coordinating with other crew members and ensuring safe operations. These skills and qualities are crucial for maintaining safety, efficiency, and reliability in environments like construction sites, film sets, or live events.

What are some common challenges faced by bump technicians in film and television production, and how can they be addressed?

Bump Technicians in film and television often face tight deadlines and last-minute changes to set designs or props, requiring adaptability and problem-solving skills. Managing multiple requests from various departments, such as art or lighting, can be challenging, so strong communication and organizational abilities are essential. Building good relationships with the crew and proactively seeking clarification on tasks can help ensure smooth operations and successful project completion.

What is the difference between Bump vs Delivery Driver?

AspectBumpDelivery Driver
Required CredentialsNone or basic licenseValid driver's license, possibly specific vehicle certifications
Work EnvironmentWarehouse, retail stores, or event venuesOn the road, customer locations, various routes
Employer & Industry UsageRetail, logistics, event companiesFood services, courier services, e-commerce
Common Search & ComparisonYesYes

While both Bump and Delivery Driver roles involve transportation, Bump typically refers to moving items within a location or event, often requiring minimal credentials. Delivery Drivers focus on transporting goods or food to customers, often needing a valid license and familiarity with routes. Understanding these differences helps job seekers find the right position based on credentials, environment, and industry expectations.

What are popular job titles related to Bump jobs in California?

For Bump jobs in California, the most frequently searched job titles are:

What job categories do people searching Bump jobs in California look for?

The top searched job categories for Bump jobs in California are:

Bump jobs near you
Infographic showing various Bump job openings in California as of August 2026, with employment types broken down into 88% Full Time, 8% Part Time, 3% Contract, and 1% Nights. Highlights an 100% Physical job distribution, with an average salary of $290,197 per year, or $139.5 per hour.

Packaging Engineer- Flip Chip

Conductor

San Francisco, CA • On-site

$110 - $170/hr

Other

Posted 19 days ago

Job description

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip).

This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cross-functional support through package and systemproductization.

Core Responsibilities:

  • Develop and optimize flip chip attach processes including bump formation,

placement, reflow, and underfill for high-performance semiconductor packages.

  • Define and manage bump metallurgy stacks (e.g., Cu pillar, SnAg, micro-bumps)

and substrate pad finishes for robust interconnect performance.

  • Drive package integration from die to substrate, ensuring alignment, coplanarity,

and yield optimization.

  • Evaluate and mitigate assembly risks including warpage, non-wet opens, voiding,

head-in-pillow, and interconnect defects.

  • Collaborate with substrate vendors, OSATs, and internal teams to define design

rules (pad pitch, bump pitch, keep-outs, stack-ups).

  • Lead process development for reflow profiles, flux selection, cleaning, and underfill

dispense/cure.

  • Perform root cause analysis of assembly and reliability failures using cross-

sectioning, SEM, CSAM, and other failure analysis techniques.

  • Support reliability qualification including thermal cycling, drop, mechanical shock,

and power cycling.

  • Work cross-functionally with design, reliability, thermal, and manufacturing teams

to ensure robust package performance from concept through high-volume

production.

Required Technical Skills:

  • Strong experience in flip chip packaging and assembly processes for

Deep understanding of bumping technologies (solder bumps, Cu pillar, micro-

  • bumps) and UBM/metallization systems.

Experience with underfill materials, dispense techniques, flow behavior, and cure

  • processes.

Understanding of thermo-mechanical behavior in flip chip assemblies (CTE

  • mismatch, warpage, solder fatigue, reliability risks).

Hands-on experience with failure analysis and reliability testing (cross-sections,

  • SEM, CSAM, thermal cycling).

Ability to work with OSATs and suppliers to develop and transfer assembly

  • processes into production.

Strong problem-solving skills with ability to debug yield and reliability issues in

  • manufacturing environments.

Preferred / Differentiating Skills:

  • Experience with III-V packaging, photonics packaging, and precision chip attach.

Experience with advanced packaging technologies including 2.5D interposers, 3D

  • stacking, chiplets, and CoWoS-like architectures.
  • Familiarity with bill of materials used in photonics packaging such as clear

adhesives and underfills as well as mold compounds and underfills for 2.5D

advanced packaging.

  • Familiarity with fine-pitch micro-bump and hybrid bonding approaches.
  • Experience integrating high-power or high-TDP devices with tight warpage and

thermal constraints.

  • Exposure to thermo-mechanical modeling or collaboration with simulation teams

for warpage and reliability prediction.

  • Understanding of system-level interactions (PCB attach, second-level interconnect

reliability).

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