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Asic Director Jobs in Washington (NOW HIRING)

Leidos

Principal Hardware Design Engineer

Laurel, MD · On-site

Direct the application of ASIC and FPGA Place-and-Route (P&R) tools, engineering libraries, and physical implementation methodologies. * Oversee integration of new P&R tools, design libraries, and ...

Leidos

Principal Hardware Design Engineer

Laurel, MD · On-site

Direct the application of ASIC and FPGA Place-and-Route (P&R) tools, engineering libraries, and physical implementation methodologies. * Oversee integration of new P&R tools, design libraries, and ...

Northrop Grumman

Staff Digital Engineer

Linthicum, MD · On-site

$185K - $278K/yr

... ASIC and FPGA implementation Implement DSP algorithms in Matlab/Python or other higher-level ... Radar, Communications, Digital Signal Processing, Digital Receivers, Direct Digital Waveform ...

US Government Jobs

Interdisciplinary

Arlington, VA · On-site

Senior Test And Evaluation Engineer The Senior Test And Evaluation Engineer is a senior technical leader and the principal testing authority within the Direct Reporting Portfolio Manager for Unmanned ...

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Asic Director information

See Washington salary details

$27.9K

$141.2K

$234.6K

How much do asic director jobs pay per year?

As of Sep 7, 2026, the average yearly pay for asic director in Washington is $141,189.00, according to ZipRecruiter salary data. Most workers in this role earn between $95,019.00 and $183,596.00 per year, depending on experience, location, and employer.

What is an ASIC director?

ASIC Directors are senior executives responsible for overseeing the design, development, and implementation of Application-Specific Integrated Circuits (ASICs). They lead teams of engineers, manage project timelines and budgets, and ensure that ASIC products meet technical and business requirements. Additionally, ASIC Directors collaborate with other departments, oversee research and development efforts, and contribute to the strategic direction of semiconductor projects in their organization.

What are the typical collaboration points between an ASIC director and cross-functional teams during a project lifecycle?

An ASIC Director regularly collaborates with cross-functional teams including system architects, software engineers, hardware verification teams, and product managers. This collaboration is essential during the project lifecycle to ensure design specifications meet product requirements, timelines are aligned, and any technical challenges are addressed quickly. The ASIC Director often leads design reviews, coordinates integration testing, and communicates project status to both engineering and executive stakeholders. Effective cross-team communication helps streamline development and ensures successful delivery of complex ASIC projects.

What are the key skills and qualifications needed to thrive as an ASIC director, and why are they important?

To thrive as an ASIC Director, you need deep expertise in digital and analog integrated circuit design, project management, and a solid background in electrical engineering or a related field, often supported by an advanced degree. Familiarity with EDA tools like Cadence, Synopsys, and Mentor Graphics, as well as knowledge of semiconductor manufacturing processes, is essential. Strong leadership, strategic thinking, and effective communication skills set top candidates apart by enabling them to drive large teams and coordinate cross-functional development efforts. These abilities are critical for ensuring successful product delivery, innovation, and alignment with business goals in a highly competitive industry.

What is the difference between Asic Director vs Asic Engineer?

AspectAsic DirectorAsic Engineer
CredentialsTypically requires a Bachelor's or Master's in Electrical Engineering or Computer Engineering; leadership experienceRequires a Bachelor's or Master's in Electrical Engineering or Computer Engineering; technical expertise
Work EnvironmentLeadership roles overseeing teams, project management, strategic planningDesign, develop, and test ASIC chips; hands-on technical work
Industry UsageUsed in companies designing complex integrated circuits, often in senior or managerial contextsCommonly employed in semiconductor companies, focusing on chip design and verification

The main difference between an Asic Director and an Asic Engineer lies in their responsibilities and experience level. The Asic Director oversees teams and strategic projects, requiring leadership skills and experience, while the Asic Engineer focuses on technical design and development of ASIC chips. Both roles require similar educational backgrounds, but their scope and focus differ significantly.

Is an ASIC director a good career?

An ASIC director is a senior role responsible for overseeing the design and development of application-specific integrated circuits, often requiring strong technical skills in electronics and project management. It can be a rewarding career with high responsibility, competitive compensation, and opportunities for advancement in the semiconductor industry. Success typically depends on experience, technical expertise, and leadership abilities.

What are popular job titles related to Asic Director jobs in Washington?

For Asic Director jobs in Washington, the most frequently searched job titles are:

What job categories do people searching Asic Director jobs in Washington look for?

The top searched job categories for Asic Director jobs in Washington are:

What cities in Washington are hiring for Asic Director jobs?

Cities in Washington with the most Asic Director job openings:

Asic Director jobs near you
Infographic showing various Asic Director job openings in Washington as of August 2026, with employment types broken down into 2% As Needed, 79% Full Time, 10% Part Time, 3% Temporary, and 6% Contract. Highlights an 87% Physical, 2% Hybrid, and 11% Remote job distribution, with an average salary of $141,189 per year, or $67.9 per hour.

Hardware Design Engineer Level 1-3

Markesman Group

Fort George G Meade, MD • On-site

Full-time

Re-posted 3 days ago

Key responsibilities

  • Design, document, and develop code for digital signal processors or programmable hardware devices such as ASICs and FPGAs.

  • Analyze existing integrated circuits and hardware components for reverse engineering purposes.

  • Assist with designing new products and processes, and improve and maintain existing products.

Job description

Markesman Group is seeking Hardware Design Engineer (HDE) candidates to join our team. The HDE designs and tests new integrated circuits and hardware components for a wide variety of signal processing applications and research. They will design, document, and develop code (to include firmware) for digital signal processors or other programmable hardware devices such as Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) hardware. The HDE analyzes the function of existing integrated circuits and hardware components for the purpose of reverse engineering the hardware and firmware. Conducts the necessary hardware engineering and related functions to modify and adapt vendor-manufactured hardware to meet special Government needs and contingencies.

Capabilities

Level 1 Capabilities:

  • Assist with designing new products and processes and improving and maintaining existing products
  • Communicate with the other engineering personnel to coordinate the interrelated design and assure project completion
  • Conduct design analysis on components and/or assemblies to assist in the development process by ensuring designs are cost efficient, able to be manufactured, and reliable
  • Apply ASIC or FPGA place and route (P&R) tools with various libraries to create physical implementations of designs
  • Develop and maintain documentation for the P&R design flows
  • Assist with de-processing electronic components and retrieving stored firmware or software using approved reverse engineering procedures
  • Design new products and processes and improving and maintaining existing products
  • Work with tool and library vendors to develop solutions for designers' P&R design challenges
  • Perform the de-processing of electronic components and retrieving stored firmware or software using approved reverse engineering procedures
  • Integrate new P&R tools, P&R tool updates, and ASIC or FPGA design libraries into Government's computer aided design environment, documents the use of those tools and libraries, and Assist other physical designers to successfully complete their specific P&R design tasks

Level 2 Capabilities:

Includes all Level 1 capabilities plus:

  • Lead the designs of new products and processes and improve and maintain existing products
  • Provide technical leadership to less experienced engineers
  • Perform the de-processing of electronic components and retrieving stored firmware or software using approved reverse engineering procedures and develops improved procedures

Level 3 Capabilities:

Includes Level 1 and 2 capabilities plus:

  • Direct and check the work of other hardware design engineers
  • Act as internal consultant providing technical guidance on most complex projects
  • Develop novel procedures for reverse engineering of new component types
  • Oversee the de-processing of electronic components and retrieving stored firmware or software using approved reverse engineering procedures

Qualifications

Must possess a TS/SCI with Full-Scope Poly

Level 1 Qualifications:

Three (3) years experience as a HDE in integrated circuit or microelectronic component design or reverse engineering of the same is required. Bachelor's degree in Electrical Engineering or Computer Engineering from an accredited college or university is required. Five (5) years of additional hardware design engineering experience may be substituted for a bachelor's degree.

Level 2 Qualifications:

Seven (7) years experience as a HDE in integrated circuit or microelectronic component design or reverse engineering of the same is required. Bachelor's degree in Electrical Engineering or Computer Engineering from an accredited college or university is required. Five (5) years of additional hardware design engineering experience may be substituted for a bachelor's degree.

Level 3 Qualifications:

Twelve (12) years experience as a HDE in integrated circuit or microelectronic component design or reverse engineering of the same is required. Bachelor's degree in Electrical Engineering or Computer Engineering from an accredited college or university is required. Five (5) years of additional hardware design engineering experience may be substituted for a bachelor's degree.