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Astera Labs

60 Astera Labs Product Development Jobs Hiring Near You

Astera Labs

Director, Pricing Strategy

San Jose, CA · On-site

... being developed. Key Responsibilities * Pricing Strategy & Monetization * Define and evolve Astera Labs' global pricing strategy across semiconductor products, software offerings, connectivity ...

Astera Labs

Distinguished Formal Verification

San Jose, CA · On-site

$159K/yr

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity ... productivity and streamline verification processes * Team Development & Cross-Functional ...

Astera Labs

Senior Product Engineer

San Jose, CA · On-site

Role Overview Astera Labs is seeking a Senior Product Engineer to join our team in San Jose, CA. In this role, you will be at the intersection of silicon development and production excellence ...

Astera Labs

Sr. Director of Product Marketing

San Jose, CA · On-site

$240K - $300K/yr

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity ... Strong understanding of semiconductor products and silicon development lifecycle * Proven track ...

Astera Labs

Product Tech Lead

San Jose, CA · On-site

$160K - $200K/yr

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity ... You'll own design execution on complex blocks across our purpose-built products, working at the ...

Astera Labs

Technical Lead Product Engineer

San Jose, CA · On-site

$160K - $200K/yr

Role Overview Astera Labs is seeking a Technical Lead Product Engineer to join our team in San Jose, CA. In this role, you will be at the intersection of silicon development and production excellence ...

Astera Labs

Performance Engineer

San Jose, CA · On-site

... and product decisions - and fuel the marketing narrative that positions Astera Labs at the center ... development and issue resolution. * Cross-Functional Impact & Innovation * Partner closely with ...

Astera Labs

Director, Pricing Strategy

San Jose, CA · On-site

... being developed. Key Responsibilities * Pricing Strategy & Monetization * Define and evolve Astera Labs' global pricing strategy across semiconductor products, software offerings, connectivity ...

Astera Labs

Optical FW/SW Engineer - Tech Lead

San Jose, CA · On-site

$160K - $200K/yr

... development, and validation of embedded firmware and supporting software for Astera Labs' next-generation optical products. You will build software for optical engines, optical modules, and emerging ...

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    Infographic showing various Product Development job openings at Astera Labs in the United States as of August 2026, with employment types broken down into 100% Full Time. Highlights an 97% Physical, 1% Hybrid, and 2% Remote job distribution.

    Advanced Package Engineer, Principal

    Astera Labs

    San Jose, CA • On-site

    $185K - $240K/yr

    Full-time

    Posted 28 days ago

    Job description

    Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs' Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company's COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company's custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.
    Advanced Packaging Engineer, Principal
    Location: San Jose, CA (On-site).
    About the Role
    Astera Labs is seeking Advanced Packaging Engineer, Principal to lead advance packaging R&D for next-generation photonics products for scale up and scale out AI infrastructure applications. This is a senior individual contributor role focused on setting technical direction and driving packaging technology development for NPO and CPO products.
    Responsibilities
    • Lead R&D for advanced packaging of optical chips, including 2.1D, 2.5D, and 3D integration.
    • Define and optimize wafer-level, panel-level, or die-level packaging process flows.
    • Drive EIC-to-PIC integration and broader optical device integration efforts.
    • Select and qualify packaging materials for advanced packaging.
    • Partner with OSAT, tool vendors, and material suppliers to drive equipment, process, and materials development.
    • Characterize and continuously improve yield, reliability, and process capability for NPO and CPO packages.
    • Develop and maintain packaging PDKs and design rules for NPO and CPO products.

    Basic Qualifications
    • B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
    • 8+ years of experience in semiconductor or advanced packaging engineering, with demonstrated technical leadership.
    • Deep expertise in advanced packaging processes, including 2.5D/3D integration, flip-chip, hybrid bonding, Cu pillar, TSV, RDL, and overmold across wafer-, panel-, and die-level flows.
    • Experience with silicon photonics chip packaging and EIC/PIC integration.
    • Hands-on experience with advanced packaging materials, including underfill, molding compounds, dielectrics, adhesives, or optical-grade encapsulants.
    • Proven track record of equipment and process qualification with OSAT or tool suppliers.
    • Experience with PDK development and packaging design rule authoring.
    • Strong foundation in yield analysis, reliability characterization, and process capability methodologies such as Cpk and SPC.

    Preferred Qualifications
    • Hands-on experience with CPO or NPO product development.
    • Experience with optical coupling or waveguide alignment for photonic integration.
    • Familiarity with photonics chip design and photonics devices
    • Familiarity with DFM and DFT for advanced packaging.

    Salary range is $185,000 to $240,000 depending on experience, level, and business need. This role may be eligible for discretionary bonus, incentives and benefits.
    We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

    Apply