Thin Films Engineer Jobs in Florida (NOW HIRING)

If you are a self-motivated team player, who thrives in a fast-paced, constantly changing environment, passionate about building great products and learning new technologies, this is the job for you!

Primary Objective:

As an Equipment Engineer you will own all assigned toolsets. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the mechanics, electronics, and process using tool knowledge/experience, SPC, schematics, and other available resources. The candidate will have extensive collaboration with the area maintenance team and process engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, and production.

Major Areas of Accountability:

• Provide technical leadership and management of 200MM and 300MM Semiconductor processing equipment in Support of Advanced Packaging processes including Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined).
• Work with process engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions, and eliminate chronic and long-term down events.
• Lead continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk.
• Management of new tool installation, start-up and tool upgrades to increase fab capability, capacity, lower costs and improve yields.
• Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations.
• Participate in cross-functional teams that create efficiencies across all layers of the organization.
• The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications

• Experience and/or Training:
• 2-5 years relevant Semiconductor Industry Experience preferably with Wet Etch or CMP tools.
• Semiconductor Wafer Handling, RF Power, High Vacuum, Toxic Gas Delivery systems, Precision Optics, Wet Chemistry Distribution and delivery systems.
• Experience with application of structured problem-solving methodology.
• Positive interpersonal skills, highly energetic and self-motivated.
• Demonstrated ability to meet requirements and deliver results.
• Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.
• Education: Graduate of Engineering program; or Associate of Science + 5-7 years relevant Semiconductor Industry Experience in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant Engineering discipline.

US Citizenship Required: This position will require the holding of or ability to obtain government security clearance which requires U.S Citizenship.

Preferred Qualifications

• Experience and/or Training:
• 5-7 Years experience with 2+ years of experience within respective area of expertise.
• Experience with application of structured problem-solving methodology.
• Positive interpersonal skills, highly energetic and self-motivated.
• Demonstrated ability to meet requirements and deliver results.
• Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs.
• Experience Creating and Managing Preventive maintenance programs.
• Experience with set up and use of Maintenance management software systems.
• Experience with Automated Fault Detection and Classification Systems (FDC).
• Strong background with utilizing SPC.
• High level of understanding of equipment component behavior.
• Experience Integrating Equipment Maintenance Management Software.
• Proficiency with CAD Software programs such as PTC CREO Parametric and AutoCAD.
• Education: Bachelor of Science in Mechanical, Electrical or Chemical Engineering or Materials Science, Physics or other relevant Engineering discipline.

The annual salary range for this role is $79,440 - $119,160. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.
SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.

Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.

SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or Recruiting@SkyWatertechnology.com.

EOE, including disability/vets