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Substrate Engineer Jobs in Missouri (NOW HIRING)

Jobtailor

Senior SRE Platform Architect

California, MO · On-site

$180 - $240/hr

Own the end-to-end architecture of the NeoCloud SRE platform. * Write and maintain the platform ... substrate; recording rules, MWMBR burn-rate alerting, SLI/SLO discipline. * Cluster platforms ...

Washington University of St. Louis

We study how these complexes assemble, achieve substrate specificity, and promote bacterial ... In addition, another major focus of our research is protein engineering and the development of new ...

Washington University of St. Louis

$16.75 - $23/hr

We study how these complexes assemble, achieve substrate specificity, and promote bacterial ... In addition, another major focus of our research is protein engineering and the development of new ...

pcg

Regional Craft Employment - North Central

Las Vegas, NV · On-site

$1.2K - $1.6K/wk

Measure, cut and install EIFS substrate. Install mesh, leveling coats, and finishes for EIFS ... An operating engineer's job entails operating and maintaining heavy equipment, such as bulldozers ...

PPG Industries, Inc.

Bachelor's degree in business, Marketing, Chemistry, Engineering, or a related field, or equivalent ... Hands-on technical capabilities related to substrate preparation, painting processes and ...

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Substrate Engineer information

What is a substrate engineer?

A Substrate Engineer is a professional who specializes in designing, developing, and optimizing the underlying frameworks, often referred to as substrates, for electronic devices or software platforms. In the context of electronics, they work with materials and technologies that form the physical base for circuits and chips, ensuring performance, reliability, and manufacturability. In software, especially blockchain, a Substrate Engineer focuses on building and customizing blockchains using the Substrate framework, handling core logic, consensus, and runtime modules. Their role is crucial for creating robust and scalable systems tailored to specific application requirements.

What are the key skills and qualifications needed to thrive as a substrate engineer?

To thrive as a Substrate Engineer, you need a strong background in materials science, semiconductor fabrication, and electrical engineering, often supported by a relevant engineering degree. Familiarity with industry-standard design tools like Cadence or Mentor Graphics, as well as experience with substrate modeling, PCB design, and analysis software, is typically required. Excellent problem-solving skills, attention to detail, and effective communication are crucial soft skills for collaborating across multidisciplinary teams. These qualifications are essential for ensuring high-quality, reliable substrate designs that meet performance, manufacturability, and cost requirements in advanced electronics manufacturing.

What are some common challenges substrate engineers face when working on high-density interconnect (HDI) designs?

Substrate Engineers often encounter challenges related to managing signal integrity, thermal performance, and miniaturization when working with HDI designs. Balancing the need for dense routing with electrical performance can be complex, especially as device sizes shrink and layer counts increase. Collaboration with PCB designers, materials scientists, and manufacturing teams is crucial to address these issues and ensure the substrate meets both design and production requirements. Keeping up with evolving technologies and industry standards is also essential for success in this role.

What is the difference between Substrate Engineer vs Semiconductor Process Engineer?

AspectSubstrate EngineerSemiconductor Process Engineer
CredentialsBachelor's or Master's in Materials Science, Electrical Engineering, or related fieldsBachelor's or Master's in Electrical Engineering, Chemical Engineering, or related fields
Work EnvironmentResearch labs, fabrication facilities, semiconductor manufacturing plantsCleanrooms, fabrication facilities, process development labs
Industry UsageSemiconductor manufacturing, electronics, integrated circuitsSemiconductor fabrication, chip production, process optimization
Common Search/ComparisonYesYes

Substrate Engineers focus on developing and optimizing the materials and layers used in semiconductor devices, while Semiconductor Process Engineers work on the overall manufacturing processes to produce chips efficiently. Both roles require similar educational backgrounds and often collaborate within the semiconductor industry, but their specific responsibilities differ in scope and focus.

What are popular job titles related to Substrate Engineer jobs in Missouri?

For Substrate Engineer jobs in Missouri, the most frequently searched job titles are:

What job categories do people searching Substrate Engineer jobs in Missouri look for?

The top searched job categories for Substrate Engineer jobs in Missouri are:

What cities in Missouri are hiring for Substrate Engineer jobs?

Cities in Missouri with the most Substrate Engineer job openings:

Substrate Engineer jobs near you
Infographic showing various Substrate Engineer job openings in Missouri as of June 2026, with employment types broken down into 100% Full Time. Highlights an 100% In-person job distribution.

Silicon Photonics Packaging Technical Leader

Jobtailor

California, MO • On-site

$140 - $190/hr

Other

Posted 17 days ago

Job description

  • responsible for the development and qualification of advanced packaging solutions for Cisco’s next generation optical transceiver products
  • serve as the primary technical interface for the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT)
  • lead the design and layout of test vehicles to validate packaging processes
  • conduct rigorous design reviews for complex substrates, ensuring alignment with signal/power integrity requirements and manufacturing capabilities
  • cross-functional technical leadership to proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain
  • work collaboratively with other internal teams to influence package architecture and provide expert guidance on DfM, DfR
  • engage deeply in substrate design, materials selection, and reviews
  • present technical findings and recommendations to cross-functional teams and stakeholders
  • stay informed on emerging packaging technologies and industry trends
Requirements
  • Masters Degree in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 8+ years of experience in Photonics or Semiconductor Packaging Industry or a PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 3+ years of experience in Photonics or Semiconductor Packaging Industry
  • Proven experience in advanced Silicon Photonic package technology development, such as 2.5D/3D integration, TSV, flip-chip, stacking, hybrid integration, wafer-level packaging, and package technology qualification methods
  • Prior experience of package design & architecture, including substrate design and chip fabrication
  • Experience with advanced substrate manufacturing processes and materials and their impacts to device level signal and power integrity
  • Experience with industry-standard design and simulation software (e.g., Cadence, klayout, Ansys or similar tools)
Core Competencies

Demonstrates expertise in advanced packaging solutions for optical transceivers, with a strong focus on Silicon Photonic package technology development and substrate design. Proven ability to lead cross-functional teams, conduct rigorous design reviews, and influence package architecture while ensuring quality and reliability standards.

Highest-signal resume keywords
  • Advanced Silicon Photonic Package Technology Development
  • Substrate Design & Architecture
  • Design & Simulation Software (Cadence, Klayout, Ansys)
  • Cross-Functional Technical Leadership
  • Risk Mitigation & Quality Assurance
ATS Optimization KeywordsHard Skills
  • Silicon Photonic Package Technology
  • 2.5D/3D Integration
  • TSV
  • Flip-Chip
  • Stacking
  • Hybrid Integration
  • Wafer-Level Packaging
  • Package Technology Qualification Methods
  • Advanced Substrate Manufacturing Processes
  • Signal/Power Integrity
Soft Skills
  • Technical Communication
  • Collaboration
  • Problem Solving
  • Leadership
Industry Keywords
  • Photonics
  • Semiconductor Packaging
  • Design for Manufacturing (DfM)
  • Design for Reliability (DfR)
Tools & Technologies
  • Cadence
  • Klayout
  • Ansys
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