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Substrate Design Engineer Ic Packaging Jobs (NOW HIRING)

Socket.dev

Package Layout Engineer

Mountain View, CA · On-site

$157K - $176K/yr

About This Role Lightmatter is looking for a Package Layout Design Engineer to drive the next ... Educational background in IC packaging and substrate layout design. * Familiarity with ...

Entrada Ventures

Package Engineer

Palo Alto, CA · On-site

$180K - $240K/yr

... OSAT on bumping, substrate options, and advanced packaging flows. * Partner with IC design ... S. in Electrical Engineering or related field. * Experience with multi‑die package design and ...

Apple Inc.

IC Package Design Engineer

Austin, TX · On-site

$134K/yr

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability ...

Google

Package Design Engineer

Sunnyvale, CA · On-site

$159K/yr

Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering ... substrate designs of advanced (2.5D/3.5D) packaging technologies for ML chips. This involves ...

Lightmatter

Package Layout Engineer

Mountain View, CA · On-site

$157K - $176K/yr

About This Role Lightmatter is looking for a Package Layout Design Engineer to drive the next ... Educational background in IC packaging and substrate layout design. * Familiarity with system-level ...

Micross Company

NY · On-site

$134K/yr

... Package Design Engineer to work in our Apopka, Florida or Raleigh, North Carolina facility ... interposer / substrate stack up * Work with IC design team to define IC package requirements

Amazon

IC Packaging Design Engineer, Amazon Leo

San Diego, CA · On-site

$144K/yr

The Role As an IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal ...

New

Delos Data Inc

Package Engineer

Palo Alto, CA · On-site

$180K - $240K/yr

... OSAT on bumping, substrate options, and advanced packaging flows. * Partner with IC design ... S. in Electrical Engineering or related field. * Experience with multi‑die package design and ...

Ciena

Principal SI/PI Design Engineer

New Providence, NJ · On-site

$148K - $237K/yr

As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead ... Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers * Problem ...

Ciena

Principal SI/PI Design Engineer

New Providence, NJ · On-site

$148K - $237K/yr

As an SI/PI Design Engineer, you will be an integral part of the Ciena engineering team and lead ... Familiar with package substrate technologies including 2.5-D IC and 3-D IC interposers * Problem ...

Apple

IC Package Design Engineer

Los Angeles, CA

$122K - $214K/yr

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability ...

Apple

IC Package Design Engineer

Austin, TX

$175K - $308K/yr

Our Packaging team defines, designs, and integrates advanced electronic packaging solutions for ... Solid grasp of substrate manufacturing processes, design rules (DRC), design for manufacturability ...

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Substrate Design Engineer Ic Packaging information

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$90K

$136.5K

How much do substrate design engineer ic packaging jobs pay per year?

As of Sep 10, 2026, the average yearly pay for substrate design engineer ic packaging in the United States is $135,040.00, according to ZipRecruiter salary data. Most workers in this role earn between $136,000.00 and $136,000.00 per year, depending on experience, location, and employer.

What is a substrate design engineer in IC packaging?

A Substrate Design Engineer in IC Packaging is a specialized engineer who focuses on designing the substrates that connect and support integrated circuits (ICs) within electronic packages. These substrates serve as the bridge between the silicon chip and the printed circuit board (PCB), providing electrical connections, mechanical support, and thermal management. The engineer works closely with cross-functional teams to optimize layout, materials, and manufacturing processes, ensuring high performance and reliability of electronic products. Their role is critical in enabling advanced semiconductor devices, such as processors and memory chips, to function efficiently in various applications.

What skills and qualifications are needed to thrive as a substrate design engineer in IC packaging?

To excel as a Substrate Design Engineer in IC Packaging, a solid background in electrical engineering, circuit design, and materials science—often with a relevant bachelor's or master's degree—is essential. Familiarity with EDA tools (such as Cadence Allegro or Mentor Graphics), PCB/IC packaging standards, and simulation software is typically required, alongside knowledge of industry certifications like IPC. Outstanding problem-solving, collaboration, and communication skills help engineers coordinate with cross-functional teams and address complex design challenges. These competencies ensure reliable, high-performance substrate solutions that meet manufacturing, cost, and quality requirements in advanced electronics.

How does a substrate design engineer in IC packaging typically collaborate with cross-functional teams during a project?

As a Substrate Design Engineer in IC Packaging, you'll work closely with electrical engineers, mechanical engineers, and manufacturing teams to ensure the substrate meets both electrical and physical requirements. Collaboration often involves regular design reviews, troubleshooting sessions, and iterative feedback to align on performance, cost, and manufacturability targets. Communication skills are vital, as you'll translate technical requirements between design and production, and may also interact with suppliers or customers to address specific needs or constraints. This cross-functional teamwork is essential for delivering reliable, high-performance IC packages on schedule.
Infographic showing various Substrate Design Engineer Ic Packaging job openings in the United States as of July 2026, with employment types broken down into 88% Full Time, 9% Part Time, and 3% Contract. Highlights an 85% Physical, 4% Hybrid, and 11% Remote job distribution, with an average salary of $135,040 per year, or $64.9 per hour.

Senior IC Packaging Development Engineer

Santa Clara, CA • On-site

Nvidia
Computer and Electronic Product Manufacturing • 10K+ employees
Learn more about Nvidiaexternal

Full-time

Re-posted 27 days ago

Nvidia rating

9.6

Company rating: 9.6 out of 10

Based on 18 frontline employees who took The Breakroom Quiz

Job description

We are looking for an experienced Engineerwho will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will include planning &drivingrelated R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn-around-time, reliability, and chip-package interaction. Prior knowledge of Package related Failure Analysis is beneficial.

What you will be doing:

  • Package Development & Prototyping:Drive the process, mechanical, thermal, and material evaluation ofthe latestIC packages. Manage rapid prototyping builds, package stack-ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases.

  • Material Characterization:Pioneer new packaging & die-level processing methodologies and evaluateinnovativepackaging materials (e.g., molding compounds, substrates, adhesives).

  • Failure Analysis & Debug:Coordinate comprehensive physical and electrical failure analysis on prototype builds, reliability-tested components to determine root causes of failures.

  • Multi-functionalCollaboration:You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams, process & product engineering. Collaboratewith foundries and OSAT (Outsourced Semiconductor Assembly and Test) partners to develop & test the required processes, tooling, and workflows.

What we need to see:

  • B.S., M.S., or Ph.D., or equivalent experiencein Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.

  • Packaging Expertise:Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.

  • Experience:12+ years of hands-on experience in IC packaging development and/or package design, NPI (New Product Introduction).

  • Design & Simulation Tools:Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and Finite Element Modeling (FEM) tools like ANSYS or ABAQUS is a strong plus.

  • FA Tooling Proficiency:At a minimum, you'll need basic understanding of advanced packaging related FA techniques and equipment, such as SEM, EDX, CSAM, X-Ray, and LIT.

With competitive salaries and a generous benefits package, we are widely considered to be one of the technology world's most desirable employers; we have some of the most forward-thinking and hardworking people in the world working for us and, due to unparalleled growth, best-in-class teams are rapidly growing. If you're creative and autonomous with a real passion for your work, we want to hear from you!

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions. The base salary range is 168,000 USD - 270,250 USD for Level 5, and 216,000 USD - 345,000 USD for Level 6.

You will also be eligible for equity and benefits.

Applications for this job will be accepted at least until July 19, 2026.

This posting is for an existing vacancy.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.

What Nvidia employees say

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About Nvidia

Sourced by ZipRecruiter

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It's a unique legacy of innovation that's fueled by great technology--and amazing people. Today, we're tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what's never been done before takes vision, innovation, and the world's best talent.

Industry

Computer and electronic product manufacturing

Company size

10,000+ Employees

Headquarters location

Santa Clara, CA, US

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