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Sip Packaging Engineer Jobs (NOW HIRING)

Aziro Technologies LLC

IC Packaging Engineer

San Jose, CA

$159K/yr

Serve as technical authority for IC and SiP packaging across multiple products and programs. * Own ... BSEE or MSEE (PhD a plus) in Electrical Engineering, or related field. * Minimum of 10+ years of ...

Qualcomm

Staff Packaging Engineer

San Diego, CA · On-site

Engineering Group, Engineering Group > Packaging Engineering General Summary: We are seeking a ... Extensive expertise in Flip Chip, Wire Bond, and System in Package (SiP) assembly processes, as ...

Axiado

Senior IC Packaging Engineer

San Jose, CA

$122K - $168K/yr

Serve as technical authority for IC and SiP packaging across multiple products and programs. * Own ... BSEE or MSEE (PhD a plus) in Electrical Engineering, or related field. * Minimum of 10+ years of ...

Axiado

Senior IC Packaging Engineer

San Jose, CA · On-site

$122K - $168K/yr

Serve as technical authority for IC and SiP packaging across multiple products and programs. * Own ... BSEE or MSEE (PhD a plus) in Electrical Engineering, or related field. * Minimum of 10+ years of ...

Talking Rain

Associate Packaging Engineer

Preston, WA · On-site

$92K - $110K/yr

We create connections with every sip of our iconic Sparkling Ice, Sparkling Ice Caffeine, Sparkling ... WHAT YOU'LL DO As an Associate Packaging Engineer, you will play a crucial role in the research ...

Texas Instruments

Packaging Engineer

Dallas, TX · On-site

... TOLG, Q-DPAK DIP, SIP and case modules) * Strong knowledge of Silicon / GaN / SiC-package ... Engineer your future. We empower our employees to truly own their career and development. Come ...

Talking Rain

Associate Packaging Engineer

Preston, WA · On-site

$92K - $110K/yr

We create connections with every sip of our iconic Sparkling Ice, Sparkling Ice Caffeine, Sparkling ... We are currently seeking a motivated and talented Associate Packaging Engineer to join our dynamic ...

Skyworks

Principal Packaging Engineer

Irvine, CA · On-site

$129K - $247K/yr

Principal Packaging Engineer Posting Start Date: 3/23/26 Job Location(s): San Jose If you are ... Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,

Texas Instruments

Packaging Engineer

Dallas, TX · On-site

Engineer your future. We empower our employees to truly own their career and development. Come ... TOLG, Q-DPAK DIP, SIP and case modules) * Strong knowledge of Silicon / GaN / SiC-package ...

Skyworks

Principal Packaging Engineer

Irvine, CA

$129K - $247K/yr

We are seeking a Principal Packaging Engineer with expertice in advanced laminate packaging ... Experience in Advanced RF SiP Moldules: Dual Side BGA, Dual Side Mold Grid Array, EMI Shielding,

Qualcomm

Staff IC Packaging Engineer

San Diego, CA · On-site

Engineering Group, Engineering Group > Packaging Engineering General Summary: We are seeking a ... SiP/Modules, RDL-based packages, and 2.5D/3D integration. • Drive new product introduction (NPI ...

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Sip Packaging Engineer information

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$42

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How much do sip packaging engineer jobs pay per hour?

As of Jun 7, 2026, the average hourly pay for sip packaging engineer in the United States is $42.37, according to ZipRecruiter salary data. Most workers in this role earn between $32.69 and $49.28 per hour, depending on experience, location, and employer.

What is the difference between Sip Packaging Engineer vs Container Packaging Engineer?

AspectSip Packaging EngineerContainer Packaging Engineer
CredentialsBachelor's in Packaging Engineering or related field, certifications like CPPBachelor's in Packaging Engineering or related field, certifications like CPP
Work EnvironmentManufacturing plants, R&D labs, quality controlManufacturing facilities, design departments, quality assurance
Industry UsageElectronics, pharmaceuticals, consumer goodsFood, beverages, chemicals, pharmaceuticals
Common Search/ComparisonYesYes

The main difference between a Sip Packaging Engineer and a Container Packaging Engineer lies in their focus areas. Sip Packaging Engineers typically work on packaging solutions for small, specialized containers like vials or bottles used in electronics or pharmaceuticals. Container Packaging Engineers often focus on larger containers such as drums, bottles, or cans used in food, beverages, or chemicals. Both roles require similar credentials and work environments but serve different product types and industries.

What are the key skills and qualifications needed to thrive as a Sip Packaging Engineer, and why are they important?

A Sip Packaging Engineer requires a solid background in mechanical or chemical engineering, knowledge of packaging materials, and experience with design and manufacturing processes. Familiarity with CAD software, packaging simulation tools, and industry standards or certifications such as Six Sigma is highly beneficial. Strong problem-solving abilities, attention to detail, and effective communication skills help drive innovation and cross-functional collaboration. These competencies are crucial to ensuring product quality, cost efficiency, and successful project execution in packaging engineering.

What are some common challenges Sip Packaging Engineers face when developing new beverage packaging solutions?

Sip Packaging Engineers often encounter challenges balancing sustainability, cost, and functionality when designing new beverage packaging. They must select materials that preserve product quality, comply with food safety regulations, and meet environmental standards, all while keeping manufacturing costs competitive. Additionally, collaborating closely with marketing, production, and supply chain teams is essential to ensure packaging designs are both visually appealing and logistically feasible. Staying updated on new materials and technologies is also crucial for success in this evolving field.
Infographic showing various Sip Packaging Engineer job openings in the United States as of May 2026, with employment types broken down into 99% Full Time, and 1% Part Time. Highlights an 82% Physical, 7% Hybrid, and 11% Remote job distribution, with an average salary of $88,120 per year, or $42.4 per hour.

Senior IC Packaging Engineer

Aziro Technologies LLC

San Jose, CA

Other

Posted 27 days ago

Job description

Job title: Senior IC Packaging Engineer

Location: San Jose, CA, USA

Duration: Full-time

Department: Design

Job Description

Client is seeking a Senior IC Packaging Engineer to provide technical leadership and architectural ownership of advanced IC and System-in-package(SiP) in a fast-growing startup environment. This role is designed for a senior technologist who combines deep hands-on expertise with system-level thinking, and who thrives in high-ambiguity, high-impact settings.

You will define and drive high-performance, low-power packaging architectures spanning 2D and RDL based fan-out (2.5D), chiplet-based designs, and heterogeneous integration, leading efforts from early technology path finding through production ramp. You will work closely with foundries, OSATs, substrate suppliers, and internal cross-functional teams to shape both product execution and long-term packaging strategy.

Key Responsibilities

  • Serve as technical authority for IC and SiP packaging across multiple products and programs.
  • Own package architecture and technology roadmap, aligned with product, cost, and scalability goals.
  • Lead chiplet-based packaging strategies, including UCIe, silicon interposers, and advanced RDL.
  • Perform and guide hands-on package design and physical layout, including critical structures for High-speed SerDes/PHY (PCIe, CXL), LPDDR5, UCIe, and Other multi-gigabit interfaces.
  • Define substrate stack-ups, materials, bump/RDL architectures, and DFM guidelines for advanced nodes.
  • Drive SI/PI, thermal, mechanical, and reliability trade-offs at the system and package levels.
  • Lead external engagement with OSATs, foundries, and key suppliers for technology development and manufacturing readiness.
  • Influence product roadmap, risk management, and investment decisions through technical insight.
  • Establish scalable design methodologies, best practices, and reusable packaging flows.

Qualifications

  • BSEE or MSEE (PhD a plus) in Electrical Engineering, or related field.
  • Minimum of 10+ years of experience with extensive IC packaging expertise for SoCs, ASICs, or memory products.
  • Deep hands-on expertise in Flip-Chip BGA (FCBGA) and System-in-Package (SiP), RDL, silicon interposers, and chiplet architectures (UCIe)
  • Strong understanding of electrical, mechanical, thermal, and reliability design trade-offs, Advanced packaging materials and substrate technologies, Design-for-Manufacturing (DFM) and yield optimization
  • Demonstrated ability to operate autonomously, make high-impact decisions, and execute in a startup environment.

Required Experience

  • Technical leadership of multiple end-to-end packaging programs, from early architecture through high-volume production.
  • Proven experience with high-speed SerDes package development, including PCIe Gen5, LPDDR5 / LPDDR5X, USB 3.x or 10G interfaces
  • Experience defining die-to-die and chiplet based RDL/bump architecture.
  • Direct collaboration with OSATs, foundries, and substrate suppliers for co-development and ramp.
  • Strong cross-functional leadership across design, product, test, operations, reliability, and customer teams.
  • Clear understanding of cost, yield, schedule, and risk trade-offs at a product and portfolio level.

Tools & Preferred Skills

  • Cadence Allegro Package Designer (APD) or equivalent EDA tools.
  • Strong background in flip-chip BGA package design and layout.
  • SI/PI expertise preferred, including S-parameter extraction and PDN optimization using HFSS, SIwave, or Ansys Designer.
  • Experience building new packaging methodologies or platforms from scratch.

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