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Senior Mems Process Engineer Jobs (NOW HIRING)

Draper

Bond Process Engineer

Cambridge, MA · On-site

$62.50K - $125K/yr

Summary: We're looking for a hands-on Bond Process Engineer to join the MEMS Tools & Logistics team, specializing in manual wafer processing within defense and aerospace applications. In this role ...

Draper Labs

Bond Process Engineer

Cambridge, MA

$62.50K - $125K/yr

Summary: We're looking for a hands-on Bond Process Engineer to join the MEMS Tools & Logistics team, specializing in manual wafer processing within defense and aerospace applications. In this role ...

Syntiant

MEMS Engineer

Itasca, IL

$85K - $110K/yr

We are seeking a MEMS Engineer to join our MEMS development group. Strong preference will be given ... Other desirable background experiences include MEMS processing and acoustics. Candidate will be ...

Draper

Bond Process Engineer

Cambridge, MA · On-site

$62.50K - $125K/yr

Summary: We're looking for a hands-on Bond Process Engineer to join the MEMS Tools & Logistics team, specializing in manual wafer processing within defense and aerospace applications. In this role ...

Syntiant

MEMS Engineer

Itasca, IL · On-site

$85K - $110K/yr

We are seeking a MEMS Engineer to join our MEMS development group. Strong preference will be given ... Other desirable background experiences include MEMS processing and acoustics. Candidate will be ...

New

Quantum Computing Inc.

Process Engineer - H1

Tempe, AZ · On-site

Senior Process Engineer - H1 Location : Tempe, AZ Department : Operations Reports to : Director of ... MEMS and electronic devices. * Experience modeling and measuring photonic integrated circuits

QCi

Process Engineer - H1

Arizona, LA · On-site

Senior Process Engineer - H1 Location: Tempe, AZ Department: Operations Reports to: Director of ... MEMS and electronic devices. * Experience modeling and measuring photonic integrated circuits

QCi

Process Engineer - H1

Tempe, AZ · On-site

Senior Process Engineer - H1 Location: Tempe, AZ Department: Operations Reports to: Director of ... MEMS and electronic devices. * Experience modeling and measuring photonic integrated circuits

Qorvo, Inc.

Sr. Process Integration Engineer, SAW R&D

Apopka, FL · On-site

$91.20K - $117.90K/yr

Job Title: Sr. Process Integration Engineer, SAW R&D SUMMARY: Our SAW R&D team seeks a Sr. Process ... The candidate will provide MEMS, thin films process integration support to include developing and ...

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How much do senior mems process engineer jobs pay per year?

As of May 31, 2026, the average yearly pay for senior mems process engineer in the United States is $121,116.00, according to ZipRecruiter salary data. Most workers in this role earn between $104,000.00 and $134,500.00 per year, depending on experience, location, and employer.

What are the key skills and qualifications needed to thrive as a Senior MEMS Process Engineer, and why are they important?

To thrive as a Senior MEMS Process Engineer, you need a solid background in microfabrication, semiconductor processing, and materials science, typically backed by a degree in electrical engineering, physics, or a related field. Proficiency with cleanroom equipment, photolithography tools, and simulation software like COMSOL or CoventorWare, as well as experience with process control systems, is essential. Strong problem-solving abilities, attention to detail, and effective communication skills help you collaborate across multidisciplinary teams and manage complex projects. These skills are crucial for developing innovative MEMS devices, ensuring process reliability, and driving technological advancements in the field.

What are some common challenges faced by Senior MEMS Process Engineers, and how are they typically addressed within a team setting?

Senior MEMS Process Engineers often encounter challenges such as process variability, yield improvement, and integrating new materials or technologies. Tackling these issues usually involves close collaboration with cross-functional teams, including design, fabrication, and quality assurance. Regular data analysis, root cause investigations, and process optimizations are common strategies. Sharing best practices and leveraging team expertise helps in developing robust solutions, ensuring high device performance and reliability.

What are Senior MEMS Process Engineers?

Senior MEMS Process Engineers are experienced professionals who design, develop, and optimize processes for fabricating Micro-Electro-Mechanical Systems (MEMS) devices. They work in cleanroom environments, collaborating with cross-functional teams to create miniaturized sensors, actuators, and other microdevices used in industries like automotive, medical, and consumer electronics. Their responsibilities include process integration, troubleshooting, yield improvement, and ensuring manufacturing scalability. Senior engineers often mentor junior staff and contribute to technology roadmaps within their organizations.
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Senior Mems Process Engineer jobs near you
Infographic showing various Senior Mems Process Engineer job openings in the United States as of May 2026, with employment types broken down into 100% Full Time. Highlights an 1% Physical, 27% Hybrid, and 72% Remote job distribution, with an average salary of $121,116 per year, or $58.2 per hour.
SAW Process Engineer - MEMS & Microfluidics Manufacturing

SAW Process Engineer - MEMS & Microfluidics Manufacturing

HP Development Company, L.P.

Corvallis, OR • On-site

Full-time

Posted 11 days ago

Job description

SAW Process Engineer - MEMS & Microfluidics Manufacturing
Description -
The SAW Process Engineer is responsible for the development, qualification, and sustainment of wafer dicing and singulation processes used to separate silicon and other substrates into individual die. This role provides technical ownership of precision mechanical cutting processes within a MEMS and microfluidics manufacturing environment and plays a critical role in ensuring yield, quality, and product reliability in high-volume production.
The position requires strong expertise in mechanical process engineering, brittle material handling, and manufacturing process control, with direct accountability for process stability, defect reduction, and continuous improvement.
Key Responsibilities
  • Own and sustain wafer singulation (SAW/dicing) processes used in MEMS and microfluidics manufacturing, including silicon and multi-layer substrate cutting.
  • Develop, qualify, and maintain process recipes and cutting strategies, including blade selection, cut parameters, and mechanical process windows.
  • Provide manufacturing process engineering support for production operations, including rapid response to yield excursions and defect trends related to singulation.
  • Lead root cause analysis for mechanical defects such as chipping, cracking, edge damage, delamination, or die breakage, and implement corrective actions.
  • Define and maintain process controls, critical parameters, and monitoring strategies to ensure consistent performance and robust manufacturing output.
  • Lead material, tool, and process change qualifications through formal change management and validation practices.
  • Support new product introduction (NPI) activities requiring new or modified singulation approaches.
  • Collaborate cross-functionally with operations, quality, reliability, and product engineering teams to ensure alignment on manufacturability and risk mitigation.
  • Create and maintain process documentation, technical specifications, and standard work to support long-term process sustainability.
  • Own production wafer and panel mounting processes, including tools, performance, and continuous improvement.
  • Lead qualification and implementation of new tape materials to meet product demands and ensure supply continuity.
  • Drive process control and development for UV-cure processes to ensure robust, scalable manufacturing.

Required Qualifications
Education
  • Bachelor's degree in Mechanical Engineering (preferred), Materials Science, Manufacturing Engineering, or a related engineering discipline.

Experience
  • 3-5 years of process engineering experience in semiconductor, MEMS, or microfluidics manufacturing.
  • Demonstrated hands-on experience with wafer dicing / singulation (SAW) processes, including precision mechanical cutting of brittle materials.
  • Experience supporting high-volume manufacturing environments with strong focus on yield, quality, and process stability.

Preferred Qualifications
  • Experience with silicon wafer singulation, thin wafers, and multi-layer or bonded substrate stacks.
  • Understanding of mechanical stress, fracture mechanics, and damage modes associated with material removal processes.
  • Experience implementing process controls, SPC, and structured problem-solving methodologies.
  • Familiarity with operating in cleanroom and semiconductor fabrication environments.
  • Strong technical communication skills and ability to work across cross-functional engineering and operations teams.

Key Competencies
  • Wafer dicing and singulation process engineering
  • Mechanical process optimization
  • Yield improvement and defect reduction
  • Root cause analysis and continuous improvement
  • Process documentation and change management
  • Cross-functional collaboration

Cross-Org Skills
• Effective Communication
• Results Orientation
• Learning Agility
• Digital Fluency
• Customer Centricity
Impact & Scope
• Impacts multiple teams and may act as a team or project leader providing direction to team activities and facilitates information validation and team decision making process.
Complexity
• Responds to moderately complex issues within established guidelines.
Disclaimer
• This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.
Job -
Engineering
Schedule -
Full time
Shift -
No shift premium (United States of America)
Travel -
25%
Relocation -
Yes
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal"

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