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Sr. Thermal Performance Engineer
Description -
What a Thermal & Performance Engineer does at HP:
Provides front-end thermal architecture solutions via simulation for new products. This requires excellent thermal model development skills and relentless effort to find the best solution space for performance, size, cost and specific thermal targets for desktops, laptops, PC clients, and other devices.
Leads and works with thermal hardware engineers from outsourced development partners. Responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing.
Leverages domain expertise as a subject matter expert in thermal design to influence our outsource partners and suppliers to provide solutions that bring value or differentiation to HP devices.
Drives innovation and integration of new thermal solution technologies and quality initiatives into projects and activities in the manufacturing and/or engineering organization.
Manages and expands relationships with outsourced development partners on electrical hardware design and development.
Provides program progress, escalations, and issue analysis to product stakeholders; collaborates with management and internal manufacturing and development partners to recommend and implement changes to product, processes, or business practices to resolve escalated issues and produce solutions.
Documents your technical work and research to help your colleagues, improve the product, and improve the development process.
Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.
Provides guidance and mentoring to less-experienced staff members.
Individuals who do well in this role at HP usually possess:
Bachelor's or Master's degree in Mechanical Engineering with a focus on Thermal Fluids.
Typically, 10+ years' experience in similar roles as a Thermal/Mechanical Engineer.
Experience with fan, heat pipe, microfluidics and vapor chamber design.
Experience relating skin temperature, acoustics, and system performance.
Experience designing sheet metal and plastic parts and associated production tooling and processes.
Excellent thermal analysis skills using CFD tools (Flotherm XT, FLOEFD, Icepak, or similar) and thermal mockups to validate thermal solutions in early architecture phases.
Ability to effectively communicate product architectures, design proposals and negotiate options at business unit and executive levels.
Understanding of ODM production process is a plus.
The pay range for this role is $130,700 to $205,200 USD annually with additional opportunities for pay in the form of bonus and/or equity (applies to United States of America candidates only). Pay varies by work location, job-related knowledge, skills, and experience.
Benefits:
HP offers a comprehensive benefits package for this position, including:

• Health insurance
• Dental insurance
• Vision insurance
• Long term/short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies, including;
• 4-12 weeks fully paid parental leave based on tenure
• 11 paid holidays
• Additional flexible paid vacation and sick leave (US benefits overview)

The compensation and benefits information is accurate as of the date of this posting. The Company reserves the right to modify this information at any time, with or without notice, subject to applicable law.
Posting Expiration Date: 2/1/26
Job -
Engineering
Schedule -
Full time
Shift -
No shift premium (United States of America)
Travel -
Not Specified
Relocation -
Yes
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP's EEO Policy or read about your rights as an applicant under the law here: "Know Your Rights: Workplace Discrimination is Illegal"