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Semiconductor Packaging Engineer Jobs in Chicago, IL

Tagoretech

Senior RF Design Engineer

Arlington Heights, IL · On-site

$90 - $110/hr

Tagore Tech is pioneering a new semiconductor process that enables high RF power at competitive ... Define high power packages to meet thermal and electrical requirements. * You will prepare design ...

New

Barry Wehmiller Group

Senior Plumbing Engineer

Oak Brook, IL · On-site

$105K - $144K/yr

Plumbing Design Engineer Who You'll Work With You will join one of our 45 offices in the US, be ... consumer packaged goods and life sciences sectors. Familiarity with semiconductor, data center ...

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All JobsSemiconductor Packaging Engineer JobsSemiconductor Packaging Engineer Jobs in Chicago, IL

Semiconductor Packaging Engineer information

See Chicago, IL salary details

$20

$43

$69

How much do semiconductor packaging engineer jobs pay per hour?

As of Sep 2, 2026, the average hourly pay for semiconductor packaging engineer in Chicago, IL is $43.64, according to ZipRecruiter salary data. Most workers in this role earn between $33.65 and $50.77 per hour, depending on experience, location, and employer.

What does a semiconductor packaging engineer do?

A Semiconductor Packaging Engineer is responsible for designing, developing, and implementing the enclosures (or 'packages') that protect semiconductor devices and enable their integration into electronic systems. They work on selecting materials, ensuring thermal management, and optimizing electrical performance while maintaining the integrity and reliability of the chip. These engineers collaborate with cross-functional teams to improve packaging processes and address challenges like miniaturization and high-speed performance. Their work is critical to the performance and durability of modern electronic products.

What are the key skills and qualifications needed to thrive as a semiconductor packaging engineer?

To thrive as a Semiconductor Packaging Engineer, you need a strong background in materials science, mechanical or electrical engineering, and semiconductor manufacturing processes, typically supported by a relevant engineering degree. Proficiency with CAD tools, simulation software (such as ANSYS or COMSOL), and familiarity with industry standards like JEDEC are essential. Critical thinking, problem-solving, and effective teamwork are standout soft skills for this role. These competencies ensure the development of reliable, high-performance semiconductor packages that meet demanding industry requirements.

What are some common challenges semiconductor packaging engineers face in ensuring product reliability?

Semiconductor Packaging Engineers often encounter challenges related to thermal management, material compatibility, and miniaturization. Ensuring that packages effectively dissipate heat while maintaining electrical integrity is critical to product reliability. Additionally, engineers must carefully select materials and design structures that withstand mechanical and environmental stresses, all while meeting increasingly stringent size and performance requirements. Collaboration with design, manufacturing, and quality assurance teams is essential to address these challenges and deliver robust solutions.

What is the difference between Semiconductor Packaging Engineer vs Test Engineer?

AspectSemiconductor Packaging EngineerTest Engineer
Required CredentialsBachelor's in Electrical Engineering, Materials Science, or related fields; certifications like IPC or SEMIBachelor's in Electrical Engineering, Electronics, or related fields; certifications in testing standards
Work EnvironmentDesign labs, manufacturing facilities, cleanroomsTesting labs, production lines, quality assurance departments
Industry UsageSemiconductor manufacturing, electronics companiesElectronics manufacturing, semiconductor companies

Semiconductor Packaging Engineers focus on designing and developing packaging solutions to protect and connect semiconductor devices, while Test Engineers concentrate on testing and validating semiconductor products to ensure quality and performance. Both roles are essential in the semiconductor industry and often collaborate during product development.

What are popular job titles related to Semiconductor Packaging Engineer jobs in Chicago, IL?

For Semiconductor Packaging Engineer jobs in Chicago, IL, the most frequently searched job titles are:

What job categories do people searching Semiconductor Packaging Engineer jobs in Chicago, IL look for?

The top searched job categories for Semiconductor Packaging Engineer jobs in Chicago, IL are:

Semiconductor Packaging Engineer jobs near you
Infographic showing various Semiconductor Packaging Engineer job openings in Chicago, IL as of August 2026, with employment types broken down into 90% Full Time, 6% Part Time, and 4% Contract. Highlights an 87% Physical, 5% Hybrid, and 8% Remote job distribution, with an average salary of $90,776 per year, or $43.6 per hour.

Program Manager

Delve Search - Global Search Consultants

Mundelein, IL • On-site

$120K - $190K/yr

Other

Posted 7 days ago

Job description

Program Manager – Semiconductor Packaging


Location: Bay Area, California

Salary: $120,000 – $190,000 Base + Benefits

Industry: Semiconductor / OSAT / Electronics Packaging


The Opportunity

We are working with a specialist semiconductor packaging and OSAT business in the Bay Area that is continuing to grow its customer base and technical capabilities.


They are looking to appoint a Program Manager to take ownership of customer programs from initial requirements through development, qualification and production.


This is a highly cross-functional role, working closely with customers and internal engineering, operations, manufacturing, quality and commercial teams to ensure programs are delivered on time, to specification and within budget.


What You'll Be Doing

  • Own and manage multiple semiconductor packaging programs from project initiation through to production.
  • Act as the key point of contact between customers and internal technical teams.
  • Define project scope, timelines, milestones, resources and deliverables.
  • Coordinate NPI, engineering development, qualification and production ramp activities.
  • Manage customer requirements and ensure technical deliverables remain aligned with expectations.
  • Identify and manage project risks, issues, dependencies and changes.
  • Coordinate cross-functional teams across engineering, manufacturing, operations, quality and supply chain.
  • Track program performance against schedule, cost, quality and customer requirements.
  • Lead regular customer and internal program reviews.
  • Support RFQs, technical proposals and new customer engagements where required.
  • Drive continuous improvement throughout the program lifecycle.


What We're Looking For

We're particularly interested in candidates with experience in semiconductor packaging, OSAT or semiconductor manufacturing environments.


Relevant experience could include:

  • Advanced semiconductor packaging
  • IC packaging and assembly
  • Semiconductor assembly & test
  • Wafer-level packaging
  • Flip-chip
  • Wire bonding
  • SiP / MCM
  • Chiplet / heterogeneous integration
  • NPI and semiconductor manufacturing
  • Semiconductor process development


You should have proven experience managing complex technical programs, ideally involving multiple engineering and manufacturing functions.

Experience working directly with semiconductor customers and managing projects from development through qualification and into production would be highly valuable.


The Ideal Candidate

  • Program / Project Management experience within semiconductors, electronics or advanced manufacturing.
  • Strong understanding of semiconductor packaging or assembly processes.
  • Comfortable managing technically complex, customer-facing programs.
  • Strong communication and stakeholder management skills.
  • Able to coordinate multiple projects and priorities simultaneously.
  • Commercially aware with a strong focus on delivery and customer satisfaction.
  • Experience with NPI, qualification and production ramp is highly desirable.


This is an excellent opportunity to join a specialist OSAT / advanced semiconductor packaging business at an important stage of its growth. You'll have the opportunity to work directly with leading semiconductor and technology companies, while playing a key role in delivering complex packaging programs from concept through to production.


Apply directly or message me for a confidential conversation.


Apply